B41J2202/03

LIQUID EJECTION HEAD CIRCUIT BOARD AND LIQUID EJECTION HEAD
20220153027 · 2022-05-19 ·

A liquid ejection head circuit board including a substrate, a heat generating resistance element that generates heat energy used for ejection of liquid, an electric wiring layer that is electrically connected to the heat generating resistance element, and an insulating film that insulates the electric wiring layer. The insulating film includes a first insulating film and a second insulating film on the first insulating film, the first insulating film is a first SiOCN film, and the second insulating film is a second SiOCN film containing more carbon than the first SiOCN film or a low-density insulating film with a lower density than the first SiOCN film.

METHOD FOR MANUFACTURING DISPLAY PANEL USING INKJET DEVICE
20230269883 · 2023-08-24 ·

In a method for manufacturing a display panel according to an embodiment, a first anisotropic conductive layer is formed by ejecting a first anisotropic conductive layer forming material in order to bond the circuit board to the display panel, a reinforced curing layer is formed by ejecting a reinforced curing layer forming material onto a side surface of the first anisotropic conductive layer, a second anisotropic conductive layer is formed by ejecting a second anisotropic conductive layer forming material to an inner side of the second anisotropic conductive layer and the reinforced curing layer in order to bond the display drive integrated circuit, and a pixel is formed by ejecting a material for pixel printing to an inner side of the second anisotropic conductive layer for fixing the display drive integrated circuit.

Wafer structure

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process. At least one inkjet chip is directly formed on the chip substrate by the semiconductor process and diced into the at least one inkjet chip for inkjet printing. Each of the inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

PIEZOELECTRIC ELEMENT, DROPLET DISPENSING HEAD, ACTUATOR, AND VIBRATOR
20230255117 · 2023-08-10 ·

A piezoelectric element includes: a first electrode formed at a vibration plate; a seed layer formed at the first electrode; a piezoelectric film containing potassium, sodium, and niobium and formed at the seed layer; and a second electrode formed at the piezoelectric film. The piezoelectric film contains lithium and one or more first transition elements. The seed layer contains bismuth. When the piezoelectric film is divided into two equal parts in a stacking direction, the second electrode side is defined as a first region, and the first electrode side is defined as a second region, a bismuth intensity obtained by SIMS measurement at a boundary between the first region and the second region is equal to or less than 1/500 of a maximum bismuth intensity obtained by the SIMS measurement of the piezoelectric film.

Droplet Discharge Head And Droplet Discharge Apparatus
20230302797 · 2023-09-28 ·

A droplet discharge head includes: a nozzle configured to discharge a liquid as droplets; a pressure chamber defining substrate defining a pressure chamber communicating with the nozzle; a piezoelectric element including a first electrode, a second electrode, and a piezoelectric layer containing a perovskite-type composite oxide containing potassium (K), sodium (Na), and niobium (Nb) as a main component; and a vibration plate forming a part of a wall surface of the pressure chamber and configured to vibrate by driving of the piezoelectric element. A driving frequency f [Hz] of the piezoelectric element, a piezoelectric constant d.sub.31 [m/v] of the piezoelectric element, a ratio x of a Na molar fraction to a total value of a K molar fraction and the Na molar fraction in the piezoelectric layer, and a viscosity μ [Pa.Math.s] of the liquid at 25° C. satisfy a relationship represented by a formula (1).

INK DISCHARGING DEVICE, METHOD OF DISCHARGING INK, METHOD OF MANUFACTURING INK-DISCHARGED MATTER, WHITE INK, AND SET

An ink discharging device contains an ink containing an organic solvent with an SP value of from 9.0 to 12.0, a white pigment, a polyurethane resin with a glass transition temperature Tg of 0 degrees C. or lower, and water, and an ink discharging unit including a nozzle plate including a liquid repellent layer containing a silicone resin, the ink discharging unit for discharging the ink, wherein the proportion of the organic solvent to the entire of the ink is from 0.5 to 2.5 percent by mass and the proportion of the white pigment to the entire of the ink is from 6 to 15 percent by mass.

Electrical component

The present invention relates to an electrical component for a microelectromechanical systems (MEMS) device, in particular, but not limited to, an electromechanical actuator. In one aspect, the present invention provides an electrical component for a microelectromechanical systems device comprising: i) a substrate layer; ii) a plurality of adjacent electrical elements arranged over the substrate layer, where each electrical element is separated from a neighbouring electrical element by an intermediate region, each of the plurality of electrical elements comprising: a) a ceramic member; and b) first and second electrodes disposed adjacent the ceramic member such that a potential difference may be established between the first and second electrodes and through the ceramic member during operation; iii) a passivation layer, or a laminate of multiple passivation layers, at least partially overlying each of the plurality of electrical elements so as to provide electrical passivation between the first and second electrodes of each of the plurality of electrical elements; wherein the passivation layer, or at least an innermost layer of the laminate of passivation layers which is disposed adjacent each underlying electrical element, is discontinuous over at least one intermediate region between neighbouring electrical elements of the electrical component.

Liquid ejecting head, liquid ejecting apparatus, and actuator

A liquid ejecting head includes a piezoelectric element and a vibrating plate configured to vibrate in response to actuation of the piezoelectric element, the vibrating plate including a first layer that contains SiO.sub.2 and a second layer that contains ZrO.sub.2 and that is stacked on the first layer. The second layer contains a first impurity element different from Zr, and the concentration of the first impurity element at an interface in contact with the first layer in the second layer is higher than the concentration of the first impurity element in an internal region that is included in the second layer and that is contiguous from the interface to the surface of the second layer.

Liquid ejection head circuit board and liquid ejection head

A liquid ejection head circuit board including a substrate, a heat generating resistance element that generates heat energy used for ejection of liquid, an electric wiring layer that is electrically connected to the heat generating resistance element, and an insulating film that insulates the electric wiring layer. The insulating film includes a first insulating film and a second insulating film on the first insulating film, the first insulating film is a first SiOCN film, and the second insulating film is a second SiOCN film containing more carbon than the first SiOCN film or a low-density insulating film with a lower density than the first SiOCN film.

Liquid discharging head and liquid discharging apparatus

Provided is a liquid discharging head including a nozzle discharging a liquid; a chamber plate in which a plurality of pressure chambers are arranged side by side on a first surface side; and a flow path plate having a second surface formed with an opening of a communication flow path, wherein a first region of a partition wall between a first pressure chamber and a second pressure chamber adjacent to each other among the plurality of pressure chambers is constrained by being bonded to the second surface of the flow path plate, and a second region of the partition wall overlaps the opening of the communication flow path in plan view.