A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

A printing consumable and an ink cartridge are provided in various embodiments of the present disclosure. The printing consumable includes an ink container, detachably installed on an ink cartridge main body; and further includes a first memory, disposed on the ink container, where the first memory is capable of being accessed by a printer and stores ink amount data related to an ink status in the ink container. The printer is configured to rewrite the ink amount data during an ink consumption process, where when ink is substantially used up, the printer is configured to rewrite a part of the ink amount data; and the rewritten part of the ink amount data is configured to be at a non-rewritable protected state.

A logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The logic circuit may be configured to identify, from a command stream received from the print apparatus, parameters including a class parameter, and/or identify, from the command stream, a read request, and output, via the interface, a count value in response to a read request, the count value based on identified received parameters.

Examples of a print liquid supply unit are described herein. In some examples, the print liquid supply unit includes an electrical interconnect. In some examples, the electrical interconnect is sealed in a supply joint from an outside of the supply unit to an inside of the supply unit. In some examples, the supply joint is welded to join housing components of the supply unit.

An actuator includes: a diaphragm on a substrate having a pressure chamber, the diaphragm having a first surface defining a part of a wall of the pressure chamber; a piezoelectric element on a second surface of the diaphragm opposite to the first surface; a lead wire led out from the piezoelectric element to supply electric power to the piezoelectric element; and a moisture-proof film covering: the lead wire; and a part of the piezoelectric element overlapped with the lead wire.

Examples of a print liquid supply unit are described herein. In some examples, the print liquid supply unit includes an electrical interconnect. In some examples, the electrical interconnect is sealed in a supply joint from an outside of the supply unit to an inside of the supply unit. In some examples, the supply joint is welded to join housing components of the supply unit.

A heterogeneous integration chip of a micro fluid actuator is disclosed and includes a first substrate, a first insulation layer, a first conductive layer, a piezoelectric layer, a second conductive layer, a second substrate, a control element, a perforated trench and a conductor. The first substrate includes a first chamber. The first insulation layer is disposed on the first substrate. The first conductive layer is disposed on the first insulation layer and includes an electrode pad. The piezoelectric layer and the second conductive layer are stacked on the first conductive layer sequentially. The second substrate is assembled to the first substrate through a bonding layer to define a second chamber and includes an orifice, a fluid flowing channel and a third chamber. The control element is disposed in the second substrate. The perforated trench filled with the conductor is penetrated from the electrode pad to the second substrate.

A printhead module includes a monolithic substrate having longitudinal ink supply channels defined through a thickness of the substrate and extending parallel with each other along a length of the substrate; rows of print chips mounted on a front face of the substrate, each row of print chips receiving ink only from a respective one of the ink supply channels; and first PCBs mounted on the front face, each PCB extending alongside a respective one of the rows of print chips and supply power thereto. The rows of print chips and the first PCBs are mounted alternately across the front face of the substrate.

A method of manufacturing a MEMS device, the MEMS device comprising a movable Micro-Electro-Mechanical piezoelectric component and a CMOS circuit configured to be in conductive communication with the Micro-Electro-Mechanical component. A plurality of CMOS circuit layers are formed on a substrate to form the CMOS circuit, the plurality of CMOS circuit layers comprising a plurality of CMOS passivation and metallisation layers. A portion of at least one of the plurality of CMOS passivation and metallisation layers is removed in a component region of the device. One or more component region layers are formed in place of the removed portion in the component region to form the movable Micro-Electro-Mechanical piezoelectric component. The one or more component region layers are different from the portion of the at least one of the plurality of CMOS passivation and metallisation layers.

A liquid discharge head includes a nozzle layer including a piezoelectric layer and having a nozzle penetrating through the nozzle layer, a liquid chamber communicating with the nozzle, and a drive circuit to apply a drive waveform to the piezoelectric layer to drive the piezoelectric layer. The drive waveform has a first waveform and a second waveform. The first waveform has a first voltage to discharge a liquid in the liquid chamber from the nozzle. The first voltage has a first rising edge from which the first voltage rises. The second waveform has a second voltage having a second rising edge from which the second voltage rises. The second rising edge is delayed from the first rising edge by (m−0.5)×Tc, where m represents a positive integer, and Tc represents a natural period of vibration of the piezoelectric layer.