Long wavelength polarization sensitive image sensor devices and methods are provided. The image sensor includes pixels that each include a plurality of sub-pixels. At least some of the sub-pixels within each pixel are associated with a grid structure. Each grid structure includes two or more linear grid elements that are parallel to one another. The grid elements are disposed directly on a light incident surface of a sensor substrate in which the sub-pixels are formed, and are electrically floating. The sub-pixels can be formed as photodiodes in a silicon or other semiconductor substrate. Infrared light incident on the pixels results in the heating of the grid elements, and in particular of grid elements oriented in a direction that is parallel to a polarization of the incident light, which in turn generates a current in associated a sub-pixels. A polarization state and intensity of the incident light can be determined.

A photodetection element includes a pixel region, a first absorption region, a first discharge electrode, a pixel neighboring region, a second absorption region, and a second discharge electrode. The pixel region is formed in a semiconductor substrate and internally generates an electron and a hole in accordance with the incident light. The pixel neighboring region is formed so as to be adjacent to the pixel region and internally generates an electron and a hole in accordance with the incident light. The second absorption region is formed in the pixel neighboring region and absorbs, of either of the electron and the hole generated in the pixel neighboring region, the carrier equal to a first discharge carrier as a second discharge carrier. The second discharge electrode is formed on the semiconductor substrate and discharges, from the second absorption region, the second discharge carrier absorbed in the second absorption region.

A pixel array may include a metal shielding structure on a grid structure between pixel sensors in the pixel array. The metal shielding structure laterally extends outward from the grid structure to reflect photons of incident light that might otherwise travel between the grid structure and the isolation structure of the pixel sensors in the pixel array. The lateral extensions of the metal shielding reflect these photons to reduce crosstalk between adjacent pixel sensors, thereby increasing the performance of the pixel array.

A back-illuminated photo detector array (PDA) includes a front side and a back side. The back side receives optical energy incident on the back side at an incident direction. The front side includes a detection layer that includes detection structures and a plurality of photon-trapping nanostructures (PTN). The PTN cause optical energy incident on the back side to disperse in a direction perpendicular to the incident direction, and thereby improve an absorption efficiency of the back-illuminated PDA.

An assembly method of an image sensor module assembly device is provided. The assembly method includes: setting an image sensor and a module lens of an image sensor module at a first position; inputting image data to the image sensor module set at the first position; pre-processing data that are output from the image sensor module based on sensing the input image data; obtaining, based on the pre-processed data, a module optical system reference value of the module lens and a sensor optical system reference value of the image sensor; and determining whether to maintain the first position based on the module optical system reference value and the sensor optical system reference value.

A photoelectric conversion device is provided. The device includes: a semiconductor layer having a photoelectric conversion element; a wiring structure; and contact plug that connect the semiconductor layer and a wiring pattern arranged in a wiring layer closest to the semiconductor layer among wiring layers included in the wiring structure. A light reflecting layer through which the contact plug penetrate is arranged between the wiring layer and the semiconductor layer, and the light reflecting layer has a periodic structure in which a first layer constituted by one of a dielectric and a semiconductor and a second layer constituted by one of a dielectric and a semiconductor that are different from the first layer are periodically stacked.

An image sensor includes an array of image pixels and black level correction (BLC) pixels. Each BLC pixel includes a BLC pixel photodetector, a BLC pixel sensing circuit, and a BLC pixel optics assembly configured to block light that impinges onto the BLC pixel photodetector. Each BLC pixel optics assembly may include a first portion of a layer stack including a vertically alternating sequence of first material layers having a first refractive index and second material layers having a second refractive index. Additionally or alternatively, each BLC pixel optics assembly may include a first portion of a layer stack including at least two metal layers, each having a respective wavelength sub-range having a greater reflectivity than another metal layer. Alternatively or additionally, each BLC pixel optics assembly may include an infrared blocking material layer that provides a higher absorption coefficient than color filter materials within image pixel optics assemblies.

An image sensor includes different first and second focus pixels in a substrate; a first adjacent pixel in the substrate and adjacent to the first focus pixel in a positive first direction, a pixel being absent between the first focus pixel and the first adjacent pixel; a first micro-lens covering the first adjacent pixel; a second adjacent pixel in the substrate and adjacent to the second focus pixel in a positive first direction, a pixel being absent between the second focus pixel and the second adjacent pixel; and a second micro-lens covering the second adjacent pixel, and an area of the first micro-lens being different from an area of the second micro-lens.

An image sensor includes a first substrate including a focus pixel region and pixel regions around the focus pixel region, each of the focus pixel region and the pixel regions including at least one photoelectric conversion region, color filters provided on the focus pixel region and the pixel regions, respectively, and on a first surface of the first substrate, and micro lenses provided on the color filters, respectively. The micro lenses include an auto-focus lens on the focus pixel region, a first micro lens adjacent to the auto-focus lens, and a standard micro lens spaced apart from the auto-focus lens.

The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a semiconductor substrate having sidewalls that form one or more trenches. The one or more trenches are disposed along opposing sides of a photodiode and vertically extend from an upper surface of the semiconductor substrate to within the semiconductor substrate. A doped region is arranged along the upper surface of the semiconductor substrate and along opposing sides of the photodiode. A first dielectric lines the sidewalls of the semiconductor substrate and the upper surface of the semiconductor substrate. A second dielectric lines sidewalls and an upper surface of the first dielectric. The doped region has a width laterally between a side of the photodiode and a side of the first dielectric. The width of the doped region varies at different heights along the side of the photodiode.