A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip, selecting a wavelength-converting element in dependence on a dominant wavelength of an electromagnetic radiation that can be emitted by the optoelectronic semiconductor chip, and situating the selected wavelength-converting element in a beam path of the optoelectronic semiconductor chip to form an optoelectronic arrangement, wherein the wavelength-converting element is selected such that chromaticity coordinates of an electromagnetic radiation that can be emitted by the optoelectronic arrangement lie within a specified value range of chromaticity coordinates, a peak wavelength of a blue peak of the electromagnetic radiation that can be emitted by the optoelectronic arrangement lies within a specified value range of peak wavelengths, and the value range of peak wavelengths is 438 nm to 458 nm.

A white light emitting device includes a blue light emitting diode emitting first light having a dominant wavelength in a range of 440 nm to 460 nm, a quantum dot disposed on a path of the emitted first light and converting a first portion of the emitted first light into green light, and a fluoride phosphor disposed on the path of the emitted first light and converting a second portion of the emitted first light into red light. The quantum dot includes a core formed of a group III-V compound and a shell formed of a group II-VI compound, and the fluoride phosphor is represented by empirical formula A.sub.xMF.sub.y:Mn.sup.4+, A being at least one selected from Li, Na, K, Rb, and Cs, M being at least one selected from Si, Ti, Zr, Hf, Ge, and Sn, and the empirical formula satisfying 2x3 and 4y7.

Provided is a light-emitting apparatus including a board, a resin frame fixed on the board, sets of light-emitting elements mounted in a region on the board surrounded by the resin frame, wherein the light-emitting elements configuring each set are connected in series to each other. The light-emitting apparatus further includes connection electrodes provided on the board and electrically connected to the light-emitting elements and capable of supplying a drive current selectively to the sets of light-emitting elements, and a sealing resin which includes a phosphor mixed therein and excited by light from the light-emitting elements, and is filled so as to bury the region on the board, to seal integrally the light-emitting elements. The thickness of the sealing resin immediately above the light-emitting elements differs for the respective sets, and thereby, a chromaticity of light emitted from the sealing resin differs when each set of light-emitting elements emits the light singly.

A light emitting assembly comprising a solid state device coupleable with a power supply constructed and arranged to power the solid state device to emit from the solid state device a first, relatively shorter wavelength radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and which in exposure to said first, relatively shorter wavelength radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is down-converted to white light by packaging the diode with fluorescent organic and/or inorganic fluorescers and phosphors in a polymeric matrix.

A compound is provided containing silicon, aluminum, strontium, europium, nitrogen, and oxygen is used that enables a red phosphor having strong luminous intensity and high luminance to be obtained, and that enables the color gamut of a white LED to be increased with the use of the red phosphor. The red phosphor contains an element A, europium, silicon, aluminum, oxygen, and nitrogen at the atom number ratio of the following formula: [A.sub.(m-x)Eu.sub.x]Si.sub.9Al.sub.yO.sub.nN.sub.[12+y2(nm)/3]. The element A in the formula is at least one of magnesium, calcium, strontium, and barium, and m, x, y, and n in the formula satisfy the relations 3<m<5, 0<x<1, 0<y<2, and 0<n<10.

The light emitting device includes: an ultraviolet light emitting diode emitting light in an ultraviolet wavelength region; and blue phosphors, green phosphors, and red phosphors excited by the ultraviolet light emitting diode, wherein white light is formed by synthesis of the light emitted from the ultraviolet light emitting diode, light emitted from the blue phosphors, light emitted from the green phosphors, and light emitted from the red phosphors, the white light includes ultraviolet light, green light, blue light, and red light, an intensity of a peak wavelength of the green light is in a range of 1.8 to 2.1 times the intensity of a peak wavelength of the blue light, and an intensity of a peak wavelength of the red light is in a range of 2.8 to 3.1 times the intensity of the peak wavelength of the blue light.

A method for producing a laterally structured phosphor layer and an optoelectronic component comprising such a phosphor layer are disclosed. In an embodiment the method includes providing a carrier having a first electrically conductive layer at a carrier top side, applying an insulation layer to the first electrically conductive layer and a second electrically conductive layer to the insulation layer, etching the second electrically conductive layer and the insulation layer, wherein the first electrically conductive layer is maintained as a continuous layer. The method further includes applying a voltage to the first electrically conductive layer and electrophoretically coating the first electrically conductive layer with a first material, and applying a voltage to the second electrically conductive layer and electrophoretically coating the second electrically conductive layer with a second material.

A light source device includes a LED package, a container where the LED package is arranged and that is filled with nitrogen gas, and a fluorine-based coating film applied on a surface of the LED package and covering a light exit surface of the LED package. The LED package includes a LED element, a base board on which the LED element is mounted, a peripheral wall portion surrounding the LED element and extending from the base board, sealing resin disposed in an inner space within the peripheral wall portion such that the LED element is sealed with the sealing resin, and the light exit surface that is a surface of the sealing resin surrounded by the peripheral wall portion. Light from the LED element is exited outside the sealing resin through the light exit surface.

A light emitting diode (LED) package includes a package body; an LED chip above the package body; a first wavelength conversion layer containing a first wavelength conversion material, and an upper surface portion covering a part of an upper surface of the LED chip and a lateral portion covering side surfaces of the LED chip; and a second wavelength conversion layer containing a second wavelength conversion material different from the first wavelength conversion material, and covering the first wavelength conversion layer and a remaining part of the upper surface of the LED chip.

A conversion element, a component and a method for producing the component are disclosed. In an embodiment the conversion element includes a phosphor configured to convert electromagnetic primary radiation into electromagnetic secondary radiation and a glass composition as matrix material in which the phosphor is embedded. The glass composition has the following chemical composition: at least one tellurium oxide with a proportion of 65 mole % as a minimum and 90 mole % as a maximum, R.sup.1O with a proportion of between 0 mole % and 20 mole %, at least one M.sup.1.sub.2O with a proportion of between 5 mole % and 25 mole %, at least one R.sup.2.sub.2O.sub.3 with a proportion of between 1 mole % and 3 mole %, M.sup.2O.sub.2 with a proportion of between 0 mole % and 2 mole %, and R.sup.3.sub.2O.sub.5 with a proportion of between 0 mole % and 6 mole %.