A method for manufacturing an image sensor with deep trench spacing isolation is provided. A trench is formed in a semiconductor substrate, around and between a plurality of pixel regions of the semiconductor substrate. A cap is formed using epitaxy to seal a gap between sidewalls of the trench. Pixel sensors corresponding to the plurality of pixel regions are formed over or within the corresponding pixel regions. An image sensor resulting from the method is also provided.

A technique relates to forming a self-aligning field effect transistor. A starting punch through stopper comprising a substrate having a plurality of fins patterned thereon, an n-type field effect transistor (NFET) region, a p-type field effect transistor (PFET) region, and a center region having a boundary defect at the interface of the NFET region and the PFET region is first provided. The field effect transistor is then masked to mask the NFET region and the PFET region such that the center region is exposed. A center boundary region is then formed by etching the center region to remove the boundary defect.

A logic semiconductor device includes a plurality of active patterns extending in a horizontal direction and being spaced apart from each other in a vertical direction, an isolation layer defining the active patterns, a plurality of gate patterns extending in the vertical direction on the active patterns and the isolation layer, the gate patterns being spaced apart from each other in the horizontal direction, a plurality of lower wirings extending in the horizontal direction over the gate patterns, a plurality of upper wirings extending in the vertical direction over the lower wirings, a through contact connecting at least one upper wiring of the upper wirings and at least one gate pattern of the gate patterns, the through contact extending from a bottom surface of the upper wiring to a position under a bottom surface of one of the lower wirings relative to the active patterns.

An electrical device that in some embodiments includes a substrate including a lateral device region and a vertical device region. A lateral diffusion metal oxide semiconductor (LDMOS) device may be present in the lateral device region, wherein a drift region of the LDMOS device has a length that is parrallel to an upper surface of the substrate in which the LDMOS device is formed. A vertical field effect transistor (VFET) device may be present in the vertical device region, wherein a vertical channel of the VFET has a length that is perpendicular to said upper surface of the substrate, the VFET including a gate structure that is positioned around the vertical channel.

A strain relaxed buffer layer is fabricated by melting an underlying layer beneath a strained semiconductor layer, which allows the strained semiconductor layer to elastically relax. Upon recrystallization of the underlying layer, crystalline defects are trapped in the underlying layer. Semiconductor layers having different melting points, such as silicon germanium layers having different atomic percentages of germanium, are formed on a semiconductor substrate. An annealing process causes melting of only the silicon germanium layer that has the higher germanium content and therefore the lower melting point. The silicon germanium layer having the lower germanium content is elastically relaxed upon melting of the adjoining silicon germanium layer and can be used as a substrate for growing strained semiconductor layers such as channel layers of field-effect transistors.

One illustrative method disclosed herein includes, among other things, forming first and second fins, respectively, for a PMOS device and an NMOS device, each of the first and second fins comprising a lower substrate fin portion made of the substrate material and an upper fin portion that is made of a second semiconductor material that is different from the substrate material, exposing at least a portion of the upper fin portion of both the first and second fins, masking the PMOS device and forming a semiconductor material cladding on the exposed upper portion of the second fin for the NMOS device, wherein the semiconductor material cladding is a different semiconductor material than that of the second semiconductor material. The method also including forming gate structures for the PMOS FinFET device and the NMOS FinFET device.

An integrated circuit containing a first plurality of MOS transistors operating in a low voltage range, and a second plurality of MOS transistors operating in a mid voltage range, may also include a high-voltage MOS transistor which operates in a third voltage range significantly higher than the low and mid voltage ranges, for example 20 to 30 volts. The high-voltage MOS transistor has a closed loop configuration, in which a drain region is surrounded by a gate, which is in turn surrounded by a source region, so that the gate does not overlap field oxide. The integrated circuit may include an n-channel version of the high-voltage MOS transistor and/or a p-channel version of the high-voltage MOS transistor. Implanted regions of the n-channel version and the p-channel version are formed concurrently with implanted regions in the first and second pluralities of MOS transistors.

The present disclosure provides an embodiment of a fin-like field-effect transistor (FinFET) device. The device includes a substrate having a first gate region, a first fin structure over the substrate in the first gate region. The first fin structure includes an upper semiconductor material member, a lower semiconductor material member, surrounded by an oxide feature and a liner wrapping around the oxide feature of the lower semiconductor material member, and extending upwards to wrap around a lower portion of the upper semiconductor material member. The device also includes a dielectric layer laterally proximate to an upper portion of the upper semiconductor material member. Therefore the upper semiconductor material member includes a middle portion that is neither laterally proximate to the dielectric layer nor wrapped by the liner.

A method includes forming an initial strain relaxed buffer layer on a semiconductor substrate. A trench is formed within the initial strain relaxed buffer layer. An epitaxial deposition process is performed to form an in situ carbon-doped strain relaxed buffer layer in the trench. A channel semiconductor material is formed on the initial strain relaxed buffer layer and on the in situ carbon-doped strain relaxed buffer layer in the trench. A plurality of fin-formation trenches that extend into the initial strain relaxed buffer layer is formed so as to thereby form an NMOS fin including the channel semiconductor material and the in situ carbon-doped strain relaxed buffer layer and a PMOS fin including the channel semiconductor material and the initial strain relaxed buffer layer. A recessed layer of insulating material and gate structures are formed around the NMOS fin and the PMOS fin.

An electrical device that in some embodiments includes a substrate including a lateral device region and a vertical device region. A lateral diffusion metal oxide semiconductor (LDMOS) device may be present in the lateral device region, wherein a drift region of the LDMOS device has a length that is parrallel to an upper surface of the substrate in which the LDMOS device is formed. A vertical field effect transistor (VFET) device may be present in the vertical device region, wherein a vertical channel of the VFET has a length that is perpendicular to said upper surface of the substrate, the VFET including a gate structure that is positioned around the vertical channel.