A microlens substrate, a display device and a method for manufacturing a microlens substrate are provided. The microlens substrate includes: a base; a first lens pattern disposed on a side of the base and including a plurality of first microlenses distributed at intervals; a second lens pattern disposed on a side of the first lens pattern and including a plurality of second microlenses distributed at intervals, where an orthographic projection of at least one of the plurality of second microlens on the base is located between two orthographic projections of two adjacent first microlenses on the base.

A display module is provided. The display module includes a light modulation layer, and the light modulation layer is located between a color film layer and a display substrate. The light modulation layer includes a plurality of modulation portions, and a modulation portion is correspondingly disposed between a light-emitting portion and a color film portion. The modulation portion includes a modulation structure and a transmission structure. The color film portion includes a first region and a second region. An orthogonal projection of the transmission structure on the corresponding color film portion is located within the first region. The second region is adjacent to another color film portion of a different color, and an orthogonal projection of the modulation structure on the corresponding color film portion is located in the second region. The modulation structure is used to converge exit light of the corresponding light-emitting portion.

A semiconductor light emitting device includes: a wiring substrate on which a p-electrode and an n-electrode are provided on a substrate; a light-emitting functional layer including a p-type semiconductor layer and an n-type semiconductor layer connected to the p-electrode and the n-electrode, respectively, and bonded onto the wiring substrate; a light-transmitting optical element having a light shielding film provided on a side surface of a plate-shaped light-transmitting optical body and which has an annular frame portion that covers a peripheral edge portion of a back surface of the light-transmitting optical body and formed on the peripheral edge portion; and an adhesive layer configured to adhere the light-transmitting optical element to an upper surface of the wiring substrate such that the light-emitting functional layer is inserted into a recessed portion inside the frame portion. The recessed portion is filled with the adhesive layer.

The present inventive concept provides a display device comprising: a first electrode provided on a substrate; a light-emitting layer provided on the first electrode; a second electrode provided on the light-emitting layer; and an antireflective layer, which is provided on the second electrode and comprises a light-absorbing material, wherein the light-absorbing material comprises at least one selected from the group consisting of amorphous carbon (a-C), a polymer, a monomer, metal and graphite.

An array substrate, a method of manufacturing the array substrate, and a display device are provided. The array substrate includes: a transparent rigid base; light-emitting chips on the transparent rigid base, each light-emitting chip including a chip body and a pin coupled to the chip body, a light-exiting surface of the chip body facing towards the transparent rigid base, and the pin being on a side of the chip body facing away from the transparent rigid base; a driving wire layer on a side of the pin facing away from the transparent rigid base; and a driving chip structure on a side of the driving wire layer facing away from the transparent rigid base. The driving chip structure is coupled to pins of the plurality of light-emitting chips through the driving wire layer, and is used for provide driving signals for the light-emitting chips.

A display apparatus including a display substrate, light emitting devices disposed on the display substrate, circuit electrodes disposed between the light emitting devices and the display substrate, and a transparent layer covering the light emitting devices and the circuit electrodes, in which at least one of the light emitting devices includes a first LED sub-unit configured to emit light having a first wavelength, a second LED sub-unit adjacent to the first LED sub-unit and configured to emit light having a second wavelength, a third LED sub-unit adjacent to the second LED sub-unit and configured to emit light having a third wavelength, and a substrate disposed on the third LED sub-unit, in which a difference in refractive indices between the transparent layer and air is less than a difference in refractive indices between the substrate and a semiconductor layer of the third LED sub-unit.

The invention relates to various aspects of a -LED or a -LED array for augmented reality or lighting applications, in particular in the automotive field. The -LED is characterized by particularly small dimensions in the range of a few m.

The present disclosure provides a display device and a method for operating the display device. The display device includes a night vision mode and a normal mode, and the display device includes a plurality of visible light display units and a plurality of invisible light display units. The method includes driving the visible light display units and turning off the invisible light display units in the normal mode, and driving the invisible light display units and turning off the visible light display units in the night vision mode.

A display device includes a plurality of first electrodes and a contact electrode on a substrate; a plurality of light-emitting elements on the plurality of first electrodes; a first optical layer between the plurality of light-emitting elements; and a second electrode on the plurality of light-emitting elements, the second electrode including a first region that is on the plurality of light-emitting elements and a second region that extends past an end the first optical layer and is in contact with the contact electrode.

A light emitting device package may include a wiring substrate. The wiring substrate may include: a first wiring electrode; a second wiring electrode; an insulating support supporting the first wiring electrode and the second wiring electrode; and a surface from which the first wiring electrode and the second wiring electrode are exposed. a semiconductor light emitting device disposed on the surface of the wiring substrate. The light emitting device package may further include: a first scattering layer covering the semiconductor light emitting device, on the surface of the wiring substrate; and a second scattering layer disposed on the first scattering layer. For light emitted from the semiconductor light emitting device, a maximum intensity of a first directional light in a 0-degree direction may be less than a maximum intensity of a second directional light in a 45-degree direction.