A cost effective process flow for manufacturing semiconductor on insulator structures is parallel is provided. Each of the multiple semiconductor-on-insulator composite structures prepared in parallel comprises a charge trapping layer (CTL).

A semiconductor device includes a semiconductor layer, an element isolation portion that is formed at the semiconductor layer and that defines an element region in the semiconductor layer, and a first contact that is formed in a linear shape along the element isolation portion in a plan view and that is electrically connected to the element isolation portion. The semiconductor device further includes a semiconductor substrate supporting the semiconductor layer and a buried layer formed so as to be contiguous to the semiconductor layer, and the element isolation portion may reach the semiconductor substrate through the buried layer from a front surface of the semiconductor layer.

A semiconductor device includes a semiconductor layer, an electronic element and laterally separated trench isolation structures. The semiconductor layer includes an element region having an inner region, an outer region on opposite sides of the inner region, and a transition region that laterally separates the inner region and the outer region. The electronic element includes a first doped region formed in the inner region and a second doped region formed in the outer region. The trench isolation structures are formed at least in the transition region. Each trench isolation structure extends from a first surface of the semiconductor layer into the semiconductor layer.

In one aspect, a silicon-on-insulator semiconductor device includes: a substrate; a buried dielectric layer disposed on the substrate; a first electrode; a second electrode; and a drift region disposed on the buried dielectric layer. An upper surface of the drift region forms a drop structure including a first side adjacent to the first electrode, a second side adjacent to the second electrode, and a transition region between the first side and the second side. An upper surface of the second side is higher than a bottom surface of the first side, such that a thickness of the drift region at the second side is greater than that at the first side. The first electrode and the second electrode are configured such that a voltage applied to the second electrode is greater than a voltage applied to the first electrode when a reverse bias voltage is applied to the device.

A semiconductor device comprises a semiconductor layer over an insulator layer and a base layer under the insulator layer. A well is in the base layer, a doped region is above and coupled with the well, and the doped region is in the insulator layer. A drift region is above and coupled with the doped region, and the drift region is at least partially in the semiconductor layer. A gate stack is partially over the semiconductor layer and partially over drift region.

A method for manufacturing a semiconductor structure includes: forming a trench in a semiconductor substrate; forming an isolating material layer on the semiconductor substrate and in the trench; forming a protective material layer on the isolating material layer and in the trench; removing horizontal portions of the protective material layer to form a protective layer laterally covering the isolating material layer and to expose horizontal portions of the isolating material layer from the protective layer; removing the horizontal portions of the isolating material layer to form an isolation layer that laterally covers the semiconductor substrate and that is disposed between the protective layer and the semiconductor substrate; and forming a conductive material layer to fill the trench.

A semiconductor device includes a high voltage device. The high voltage device includes a central region with a first inner region. A termination area laterally surrounds the central portion and includes a first extension region. The first extension region is formed between the first inner region and a first outer region. A lightly doped base portion and the extension region form a pn junction. The central region further includes a second inner region. The second inner region and the first inner region are laterally separated and connected to different inner contact structures. Alternatively or in addition, the high voltage device further includes a second outer region, with the first outer region and the second outer region being laterally separated and connected to different outer contact structures.

A voltage level shifter includes an input stage with series-connected first and second N-type field effect transistors (NFETs) and an output stage with an inverter connected to an intermediate node between the first and second NFETs. Gates of the first and second NFETs are connected to an output node of the inverter and an input node, respectively. An input voltage signal on the input node toggles between a first voltage and ground. An intermediate voltage signal on the intermediate node toggles between a second voltage (lower than the first voltage) and ground. An output voltage signal on the output node toggles between the second voltage and ground. A capacitor in the input stage is connected between the input and intermediate nodes so that, when the input voltage switches to ground, the intermediate voltage signal is pulled to ground to facilitate switching of the output voltage signal to the second voltage.