Patent classifications
H10D30/6734
Semiconductor Device and Method for Manufacturing the Same
A semiconductor device includes a pixel electrode and a transistor which includes a first gate electrode, a first insulating layer over the first gate electrode, a semiconductor layer over the first insulating layer, a second insulating layer over the semiconductor layer, and a second gate electrode. The pixel electrode and the second gate electrode are provided over the second insulating layer. The first gate electrode has a region overlapping with the semiconductor layer with the first insulating layer provided therebetween. The second gate electrode has a region overlapping with the semiconductor layer with the second insulating layer provided therebetween. A first region is at least part of a region where the second gate electrode overlaps with the semiconductor layer. A second region is at least part of a region where the pixel electrode is provided. The second insulating layer is thinner in the first region than in the second region.
Semiconductor-Metal-On-Insulator Structures, Methods of Forming Such Structures, and Semiconductor Devices Including Such Structures
Methods for fabricating semiconductor-metal-on-insulator (SMOI) structures include forming an acceptor wafer including an insulator material on a first semiconductor substrate, forming a donor wafer including a conductive material and an amorphous silicon material on a second semiconductor substrate, and bonding the amorphous silicon material of the donor wafer to the insulator material of the acceptor wafer. SMOI structures formed from such methods are also disclosed, as are semiconductor devices including such SMOI structures.
DISPLAY SUBSTRATE AND FABRICATION METHOD THEREOF, AND DISPLAY DEVICE
A display substrate and a fabrication method thereof, and a display device are disclosed. The fabrication method of a display substrate, includes forming a first gate electrode on a transparent base substrate; forming a transparent gate insulating layer on the first gate electrode; forming a transparent active layer on the transparent gate insulating layer; forming a transparent source electrode and a transparent drain electrode on the transparent active layer, wherein, the transparent source electrode and the transparent drain electrode do not overlap with the first gate electrode in a thickness direction of the transparent base substrate.
TFT SWITCH AND METHOD FOR MANUFACTURING THE SAME
A thin-film transistor (TFT) switch includes a gate, a drain, a source, a semiconductor layer, and a fourth electrode. The drain is connected to a first signal. The gate is connected to a control signal to control the switch on or off. The source outputs the first signal when the switch turns on. The fourth electrode and the gate are respectively located at two sides of the semiconductor layer. The fourth electrode is conductive and is selectively coupled to different voltage levels, thereby reducing leakage current in a channel to improve switch characteristic when the switch turns off.
GOA CIRCUIT STRUCTURE FOR SLIM-BEZEL LCD
The present invention provides a GOA circuit structure for a slim-bezel LCD, including: a latch, a NAND gate, a buffer unit, and a reset unit. An input signal is supplied to the latch and an output signal is supplied from the buffer unit. The buffer unit includes a plurality of TFTs formed of a first metal layer (1), a second metal layer (2), and an active layer (3) arranged between the first metal layer (1) and the second metal layer (2). Each of the TFTs includes a dual-gate arrangement including a bottom gate formed of the first metal layer (1), a source and a drain formed of the second metal layer (2), and a top gate also formed of the second metal layer (2) so that the size of the TFT of the buffer unit can be reduced, the width of buffer unit can be reduced, thereby reducing the width of the GOA circuit and allowing a bezel of the LCD to be slimmer.
Fin-type device system and method
A transistor is disclosed and includes forming a gate of a transistor within a substrate having a surface and a buried oxide (BOX) layer within the substrate and adjacent to the gate at a first BOX layer face. The method also includes a raised source-drain channel (fin), where at least a portion of the fin extends from the surface of the substrate, and where the fin has a first fin face adjacent to a second BOX layer face of the BOX layer.
Semiconductor device, module, and electronic device
Provided is an element with stable electrical characteristics or a device including plural kinds of elements with stable electrical characteristics. The semiconductor device includes a first insulator, a transistor over the first insulator, a second insulator over the transistor, and a third insulator over the second insulator. The second insulator includes an opening reaching the first insulator. The opening is filled with a fourth insulator. The first insulator, the third insulator, and the fourth insulator each have a lower hydrogen-transmitting property than the second insulator.
Semiconductor device and method for manufacturing the same
A transistor with stable electrical characteristics is provided. The transistor includes a first insulator over a substrate; first to third oxide insulators over the first insulator; a second insulator over the third oxide insulator; a first conductor over the second insulator; and a third insulator over the first conductor. An energy level of a conduction band minimum of each of the first and second oxide insulators is closer to a vacuum level than that of the oxide semiconductor is. An energy level of a conduction band minimum of the third oxide insulator is closer to the vacuum level than that of the second oxide insulator is. The first insulator contains oxygen. The number of oxygen molecules released from the first insulator measured by thermal desorption spectroscopy is greater than or equal to 1E14 molecules/cm.sup.2 and less than or equal to 1E16 molecules/cm.sup.2.
Semiconductor device comprising an oxide semiconductor, module, and electronic device
A transistor with stable electrical characteristics or a transistor with normally-off electrical characteristics. The transistor is a semiconductor device including a conductor, a semiconductor, a first insulator, and a second insulator. The semiconductor is over the first insulator. The conductor is over the semiconductor. The second insulator is between the conductor and the semiconductor. The first insulator includes fluorine and hydrogen. The fluorine concentration of the first insulator is higher than the hydrogen concentration of the first insulator.
DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC DEVICE
A novel display device or the like in which a transistor connected to a scan line has small gate capacitance is provided. A novel display device or the like in which a scan line has low resistance is provided. A novel display device or the like in which pixels can be arranged with high density is provided. A novel display device or the like that can be manufactured without an increase in cost is provided. In a transistor including a first gate electrode and a second gate electrode, the first gate electrode is formed using a metal material with low resistance and the second gate electrode is formed using a metal oxide material that can reduce oxygen vacancies in an oxide semiconductor layer. The first gate electrode is connected to the scan line, and the second gate electrode is connected to a wiring to which a constant potential is supplied.