A solar cell, including a crystalline silicon substrate; a first passivation contact step provided on a surface of the crystalline silicon substrate; a second passivation contact step provided on a surface of the first passivation contact step away from the crystalline silicon substrate and located corresponding to an electrode; a first passivation antireflection step provided on the surface of the first passivation contact step away from the crystalline silicon substrate and not in contact with the second passivation contact step; a second passivation antireflection step provided on a surface of the second passivation contact step away from the first passivation contact step; and the electrode including a side in contact with the first passivation contact step and another side penetrating through the second passivation contact step and the second passivation antireflection step.

Disclosed herein are devices, systems, and methods for processing a solar cell precursor. The processing may include forming a transparent, electrically conductive first layer over the solar cell precursor. The processing may also include forming a transparent, electrically conductive second layer over the solar cell precursor, preferably in physical contact with the first layer. The first layer may comprise at least indium, zinc, and oxygen and the second layer may comprise oxygen and a greater proportion of indium than the first layer.

The present application relates a solar cell, a photovoltaic device and a photovoltaic system. The solar cell includes a substrate, a first passivation layer, and a second passivation layer. The substrate includes a first surface and a second surface opposite to each other along a thickness direction of the substrate. The first passivation layer is disposed on the first surface of the substrate. The second passivation layer is disposed on a side of the first passivation layer away from the substrate. A material of the first passivation layer is the same as that of the second passivation layer. An atomic packing density of the first passivation layer is higher than that of the second passivation layer. An average thickness of the first passivation layer is smaller than that of the second passivation layer.

A transparent laminated passivation film structure and a preparation method and application thereof are provided. The transparent laminated passivation film structure includes a first passivation layer, a second passivation layer, and a third passivation layer sequentially laminated on a surface of a silicon substrate. The material of the first passivation layer is a hydrogenated silicon oxide film. The material of the second passivation layer is one selected from a hydrogenated silicon carbon nitride film, a hydrogenated silicon carbide film, a hydrogenated silicon nitride film, a hydrogenated silicon carbon nitride oxide film, a hydrogenated silicon carbide oxide film, and a hydrogenated silicon nitride oxide film. The material of the third passivation layer is one or a laminated film of more selected from a hydrogenated aluminum oxide film, a hydrogen-containing silicon nitride film, and a hydrogenated silicon oxide film. The transparent laminated passivation film structure has excellent surface and bulk passivation effects.

Disclosed is a circular interdigital array plasmon electrode photoelectric detector suitable for non-polarized light. The detector includes a substrate, a semiconductor layer and a circular interdigital array electrode, where rectangular electrodes on left side and right side of the circular interdigital array electrode respectively form a positive electrode and a negative electrode, the positive and negative electrodes are connected to the circular interdigital array electrode through electrode connecting wires, and a circular electrode array and the electrode connecting wires form a circular interdigital array electrode structure. A preparation method for a circular interdigital array plasmon electrode photoelectric detector is also provided. According to the present disclosure, by adjusting inner circle and outer circle radii and the arrangement manner of circular electrodes, the polarization-insensitive effect of the detector for incident light is achieved, and the absorption efficiency for the incident light and the bandwidth of the detector are increased.

The present disclosure relates to a semiconductor device, an electronic device, and a manufacturing method capable of reducing leakage and shrinking a keep out zone.

The semiconductor device includes a first semiconductor chip, a second semiconductor chip stacked on the first semiconductor chip and provided with a PN junction portion in a depth direction by forming an N-type well on a front surface of a substrate of P-type or forming a P-type well on a front surface of a substrate of N-type, and a through electrode provided in a through hole penetrating the substrate. The through electrode is configured such that a ferroelectric film or a thermal oxide film having an insulating property for at least the PN junction portion is provided along an inner wall surface of the through hole. The present technology can be applied to, for example, a stacked CMOS image sensor.

Disclosed is a highly efficient rear junction Tunnel oxide passivated contact (TOPCon) solar cell photovoltaic cell with TOPCon on both sides. Further disclosed are laser etching and screen printing methods for patterning the TOPCon. Further disclosed is a tandem cell having a TOPCon cell as a bottom cell. Low-cost, manufacturable screen printed TOPCon on both sides of a solar cell to exploit the full potential of this technology and concept. The TOPCon can be fabricated on the front side to be selectively placed under a metal grid with 5% area coverage, while the remaining 95% area on the front has an undiffused Si wafer passivated with AI2O3/SiN dielectric.

An occupancy sensor covering a wide field in an integrated chip is disclosed. The occupancy sensor includes an array of grating coupled waveguide sensors wherein continuous wave (cw) signals monitor an ambient light field for dynamic changes on times scales of seconds, and high frequency signals map in three-dimensions of the space using time-of-flight (TOF) measurements, pixel level electronics that perform signal processing; array level electronics that perform additional signal processing; and communications and site level electronics that interface with actuators to respond to occupancy sensing.

The present application relates to a solar cell, a method for manufacturing the same, a photovoltaic module and a photovoltaic system. The solar cell includes: a substrate (110), including a first surface (S1) and a second surface (S2) being opposite to each other, wherein the first surface (S1) has a first region (A) and a second region (B) adjacent to each other in a first direction; a passivating contact layer (120), located in the first region (A) of the first surface (S1); a polysilicon layer (130) located on at least a part of a surface of the passivating contact layer (120) away from the substrate (110); the passivating contact layer (120) including a first tunneling layer (121) and a first doped layer (122), the first tunneling layer (121) and the first doped layer (122) being sequentially stacked on the first region (A) of the first surface (S1) of the substrate (110) in a direction away from the second surface (S2); and a first passivation layer (140), located on a surface of the polysilicon layer (130) away from the passivating contact layer (120) and on the second region (B) of the first surface (S1).

The present disclosure relates to a thin-film solar cell capable of independently adjusting transparency and color, which is capable of selectively controlling transmittance while independently adjusting external and internal colors within a range in which degradation of photoelectric conversion efficiency is minimized, and a method of manufacturing the same, and the thin-film solar cell capable of independently adjusting transparency and color according to the present disclosure includes a structure in which a back transparent electrode, a light absorption layer, a front transparent electrode, and a front color layer are sequentially stacked on a transparent substrate, in which a light transmission part region, to which the back transparent electrode is exposed, is formed by removing the front color layer, the front transparent electrode, and the light absorption layer.