H10F77/162

Photoelectric conversion device

Provided are a solar cell and a light emitting device with low leakage current and low cost, using ZnO fine particles. A p-type ZnO layer (p-type layer) made primarily of p-type ZnO fine particles is formed. P-side electrodes are formed at a plurality of regions on the p-type layer. A thin insulating layer is formed between an n-type layer and the p-type layer. In the insulating layer, openings are formed at regions A each not overlapping the p-side electrodes and being apart from them in a plan view. In the configuration, by thus making the p-side electrodes apart from the regions A, the length of a current path in the p-type layer can be made substantially larger than the layer thickness.

Photoelectric conversion device

Provided are a solar cell and a light emitting device with low leakage current and low cost, using ZnO fine particles. A p-type ZnO layer (p-type layer) made primarily of p-type ZnO fine particles is formed. P-side electrodes are formed at a plurality of regions on the p-type layer. A thin insulating layer is formed between an n-type layer and the p-type layer. In the insulating layer, openings are formed at regions A each not overlapping the p-side electrodes and being apart from them in a plan view. In the configuration, by thus making the p-side electrodes apart from the regions A, the length of a current path in the p-type layer can be made substantially larger than the layer thickness.

3D Light Field Detector, Sensor and Methods of Fabrication Thereof
20250311454 · 2025-10-02 ·

The present disclosure concerns a light field detector for converting a vector of an 5 electromagnetic radiation into a chromatic output, comprising at least one azimuth detector on a transparent substrate and the at least one azimuth detector comprising at least two luminescent nanocrystal pixels having different emission wavelengths relative to each other. The present disclosure also concerns a light field sensor comprising the light field detector thereof and methods of fabricating the light field 10 detector.

HIGH-BANDGAP(EG) STRUCTURE IN PLANAR FLOATING-BASE BIPOLAR PHOTOTRANSISTOR (PT)
20250318288 · 2025-10-09 ·

A semiconductor bipolar phototransistor (PT) comprises a floating base consisting of a base (b) electrically coupled only to (i) an emitter (e) via an emitter junction (ej); and (ii) a collector (c) via a collector junction (cj) conductively, capacitively or inductively. A substantially planar semiconductor interface is formed between the semiconductor and a dielectric. A semiconductor volume of highest bandgap (Eg) whose bandgap is higher than the bandgap of the remaining semiconductor volume of the semiconductor bipolar phototransistor (PT) within about 1 micron linear distance from the substantially planar semiconductor interface with the dielectric. The emitter junction (ej) comprises an emitter junction (ej) portion with a bandgap lower than the bandgap of the highest bandgap volume. The base (b) comprises a base (b) portion with a bandgap lower than the bandgap of the highest bandgap volume. The collector junction (cj) comprises a collector junction (cj) portion with a bandgap lower than the bandgap of the highest bandgap volume. A first low-doped region of the highest bandgap volume resides within the emitter junction (ej). A second low-doped region of the highest bandgap volume resides within the base (b). A third low-doped region of the highest bandgap volume resides within the collector junction (cj). A minimum linear dimension of the highest bandgap volume is at least 10 nanometers. The highest bandgap volume is substantially single crystalline. The first, second, and third low-doped regions of the highest bandgap volume are not doped to higher than 10.sup.16/cm.sup.3.

HIGH-BANDGAP(EG) STRUCTURE IN PLANAR FLOATING-BASE BIPOLAR PHOTOTRANSISTOR (PT)
20250318288 · 2025-10-09 ·

A semiconductor bipolar phototransistor (PT) comprises a floating base consisting of a base (b) electrically coupled only to (i) an emitter (e) via an emitter junction (ej); and (ii) a collector (c) via a collector junction (cj) conductively, capacitively or inductively. A substantially planar semiconductor interface is formed between the semiconductor and a dielectric. A semiconductor volume of highest bandgap (Eg) whose bandgap is higher than the bandgap of the remaining semiconductor volume of the semiconductor bipolar phototransistor (PT) within about 1 micron linear distance from the substantially planar semiconductor interface with the dielectric. The emitter junction (ej) comprises an emitter junction (ej) portion with a bandgap lower than the bandgap of the highest bandgap volume. The base (b) comprises a base (b) portion with a bandgap lower than the bandgap of the highest bandgap volume. The collector junction (cj) comprises a collector junction (cj) portion with a bandgap lower than the bandgap of the highest bandgap volume. A first low-doped region of the highest bandgap volume resides within the emitter junction (ej). A second low-doped region of the highest bandgap volume resides within the base (b). A third low-doped region of the highest bandgap volume resides within the collector junction (cj). A minimum linear dimension of the highest bandgap volume is at least 10 nanometers. The highest bandgap volume is substantially single crystalline. The first, second, and third low-doped regions of the highest bandgap volume are not doped to higher than 10.sup.16/cm.sup.3.

Sensor system based on stacked sensor layers
12436389 · 2025-10-07 · ·

A sensor assembly for determining one or more features of a local area is presented herein. The sensor assembly includes a plurality of stacked sensor layers. A first sensor layer of the plurality of stacked sensor layers located on top of the sensor assembly includes an array of pixels. The top sensor layer can be configured to capture one or more images of light reflected from one or more objects in the local area. The sensor assembly further includes one or more sensor layers located beneath the top sensor layer. The one or more sensor layers can be configured to process data related to the captured one or more images. A plurality of sensor assemblies can be integrated into an artificial reality system, e.g., a head-mounted display.

Solar cell, solar cell module, and method for manufacturing solar cell

The present application discloses a solar cell, a solar cell module, and a method for manufacturing a solar cell. In one example, a solar cell includes a semiconductor substrate, an ultra-thin dielectric layer, a passivation layer, a first electrode, and metallic crystals. The semiconductor substrate has a light receiving surface and a back surface opposite to the light receiving surface. The ultra-thin dielectric layer is formed on at least one of the back surface and the light receiving surface of the semiconductor substrate. The passivation layer is formed on the ultra-thin dielectric layer. The first electrode is formed on the passivation layer. The metallic crystals are formed in the passivation layer. The metallic crystals include a first metallic crystal, where an end surface of the first metallic crystal abuts against the ultra-thin dielectric layer, and another end surface of the first metallic crystal is connected to the first electrode.

Solar cell, solar cell module, and method for manufacturing solar cell

The present application discloses a solar cell, a solar cell module, and a method for manufacturing a solar cell. In one example, a solar cell includes a semiconductor substrate, an ultra-thin dielectric layer, a passivation layer, a first electrode, and metallic crystals. The semiconductor substrate has a light receiving surface and a back surface opposite to the light receiving surface. The ultra-thin dielectric layer is formed on at least one of the back surface and the light receiving surface of the semiconductor substrate. The passivation layer is formed on the ultra-thin dielectric layer. The first electrode is formed on the passivation layer. The metallic crystals are formed in the passivation layer. The metallic crystals include a first metallic crystal, where an end surface of the first metallic crystal abuts against the ultra-thin dielectric layer, and another end surface of the first metallic crystal is connected to the first electrode.

Functional photoresist and method of patterning nanoparticle thin film using the same

The functional photoresist for patterning a nanoparticle thin film including nanoparticles on a substate includes: a photoactive compound (PAC); and a functional ligand that is bound to surfaces of the nanoparticles and controls physical properties of the nanoparticles.

Functional photoresist and method of patterning nanoparticle thin film using the same

The functional photoresist for patterning a nanoparticle thin film including nanoparticles on a substate includes: a photoactive compound (PAC); and a functional ligand that is bound to surfaces of the nanoparticles and controls physical properties of the nanoparticles.