A semiconductor product comprising: a semiconductor substrate and a test structure, the test structure comprising: a thermopile and at least one temperature sensitive element, the at least one temperature sensitive element being located in the substrate, or between the substrate and the thermopile.

Provided is a thermoelectric material satisfying (MX).sub.1+a(TX.sub.2).sub.n and having a superlattice structure, wherein M is at least one element selected from the group consisting of Group 13, Group 14, and Group 15, T is at least one element selected from Group 5, X is a chalcogenide element, a is a real number satisfying 0<a<1, and n is a natural number of 1 to 3.

Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures are disclosed. In one exemplary embodiment, a three-dimensional integrated circuit structure includes a plurality of integrated circuit chips stacked one on top of another to form a three-dimensional chip stack, a thermoelectric cooling daisy chain comprising a plurality of vias electrically connected in series with one another formed surrounding the three-dimensional chip stack, a thermoelectric cooling plate electrically connected in series with the thermoelectric cooling daisy chain, and a heat sink physically connected with the thermoelectric cooling plate.

A system exchanges pressure and heat from a source stream to a sink stream. The system includes a source exchanger and a sink exchanger. The source exchanger includes a first pressure exchanger and a first heat exchanger. The first pressure exchanger converts pressure of the source stream to electrical energy. The first heat exchanger converts temperature from the source stream via a first temperature differential to electrical energy. The sink exchanger includes a second pressure exchanger and a second heat exchanger. The second pressure exchanger uses electrical energy received from the source exchanger to change a pressure of the sink stream. The second heat exchanger uses electrical energy received from the source exchanger to change a temperature of the sink stream. Related apparatus, systems, techniques, and articles are also described.

A thermoelectric conversion element is made of a material with a band structure having Weyl points in the vicinity of Fermi energy. The thermoelectric conversion element has a thermoelectric mechanism for generating electromotive force by the anomalous Nernst effect. A thermoelectric conversion device includes a substrate; and a power generator provided on the substrate and including a plurality of thermoelectric conversion elements. Each of the plurality of thermoelectric conversion elements has a shape extending in one direction, and is made of a material identical to that of the above-mentioned thermoelectric conversion element. The plurality of thermoelectric conversion elements is arranged in parallel to one another in a direction perpendicular to the one direction and electrically connected in series to one another in a serpentine shape.

A method is provided for making a multilayer functional fiber, where the method includes: providing a scaffold fiber; disposing a first electrode layer enclosing the scaffold fiber; disposing a functional layer enclosing the first electrode layer, the functional layer having a functional characteristic varying as a function of longitudinal position along the functional layer; disposing a second electrode layer enclosing the functional layer; and disposing a cladding layer enclosing the second electrode layer. In another aspect, a multilayer functional fiber is provided produced by, for instance, the above-noted method.

An overheat detection system and insulation muff comprising an overheat detection system. The overheat detection system comprises a thermometer, a thermal harvesting module comprising at least one passive radiator, the thermal harvesting module being able to generate electrical energy from the thermal difference between two elements, and a digital module, comprising a power management system, a data treatment system and a wireless transmission system, wherein the electrical energy generated by the thermal harvesting module powers the thermometer and the digital module.

A system, a thermoelectric generator, and a method for generating electricity are provided. The system includes a thermoelectric generator, a cooling system, and a heating system. The cooling system includes a cold side module configured to hold a predetermined volume of air, a subterranean heat exchanger including an underground conduit, the underground conduit having a first end configured to receive ambient air and a second end coupled to the inlet of the cold side module, and an air exhaust coupled to the outlet of the cold side module and having one or more valves configured to control an airflow from the subterranean heat exchanger towards the air exhaust. The heating system includes a first solar concentrator to collect light rays, a hot side module, and a fiber optic cable to transport the collected light rays to the hot side module.

A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.

A thermoelectric conversion module is disclosed that corrects the difference in thermal resistance between a P-type thermoelectric conversion member and an N-type thermoelectric conversion member. In this thermoelectric conversion module, since insulators included in the P-type thermoelectric conversion member and the N-type thermoelectric conversion member have a different thermal resistance, it is possible to correct the difference in thermal resistance between the P-type thermoelectric conversion element and the N-type thermoelectric conversion element.