A display device may include a pixel circuit layer. A first electrode and a second electrode may be on the pixel circuit layer and spaced from each other. A first insulating layer may be on the pixel circuit layer, the first electrode, and the second electrode. A conductive pattern may be on the first insulating layer and electrically insulated from the first electrode and the second electrode. The bank may be on the conductive pattern. Light emitting elements may be located on the first insulating layer between the first electrode and the second electrode, and electrically coupled to the first electrode and the second electrode.

The present disclosure discloses a display substrate, including a substrate, and a driver circuit, an insulation layer and a bonding electrode sequentially superposed on the substrate. The bonding electrode is configured to be connected to an anode and a cathode of a micro inorganic light-emitting diode chip to be bonded. The display substrate further includes an elastic layer sandwiched between the bonding electrode and the insulation layer, the elastic layer having an orthographic projection on the substrate covering at least an orthographic projection of the bonding electrode on the substrate. The present disclosure provides a display panel, including the above display substrate, and further including a micro inorganic light-emitting diode chip having an anode and a cathode thereof connected to the bonding electrode on the display substrate.

The present disclosure provides a trench field effect transistor structure and a manufacturing method thereof. The manufacturing method includes: providing a substrate (100), forming an epitaxial layer (101), forming a device trench (102) in the epitaxial layer, and forming a shielding dielectric layer (107), a shielding gate layer (105), a first isolation dielectric layer (108), a gate dielectric layer (109), a gate layer (110), a second isolation dielectric layer (112), a body region (114), a source (115), a source contact hole (118), a source electrode structure (122), and a drain electrode structure (123). During manufacturing of a trench field effect transistor structure, a self-alignment process is adopted in a manufacturing process, so that a cell pitch is not limited by an exposure capability and alignment accuracy of a lithography machine, to further reduce the cell pitch of the device, improve a cell density, and reduce a device channel resistance.

Provided are an ink composition, a light-emitting apparatus using the ink composition, and a method of manufacturing the light-emitting apparatus. The ink composition may include a light-emitting device, a solvent, and an organic thickener, and the organic thickener is a polymeric compound including at least one group represented by Formula 1: ##STR00001## wherein in Formula 1, X, R.sub.1, n1, and R.sub.2 may respectively be understood by referring to the descriptions of X, R.sub.1, n1, and R.sub.2 provided in the detailed description.

A stretchable display device includes a lower substrate; a plurality of first substrates which is disposed on the lower substrate and includes a first area in which a plurality of sub pixel including a display element and a driving element is disposed and a second area excluding the first area; a plurality of second substrates configured to couple adjacent first substrates among the plurality of first substrates; and a plurality of connection lines which are disposed on the plurality of second substrates and are configured to couple the plurality of sub pixels, and in the second area, a first contact pad and a second contact pad are disposed and the first contact pad and the second contact pad are coupled to the plurality of connection lines via a plurality of contact holes.

A display device comprises electrodes spaced apart from one another in a first direction and in a second direction intersecting the first direction, each of the electrodes having a shape extending in the second direction, a first insulating layer disposed on the electrodes, light-emitting elements disposed on the first insulating layer, each of the light-emitting elements including ends disposed on the electrodes spaced apart from one another in the first direction, and a second insulating layer at least partially disposed on the light-emitting elements. The second insulating layer comprises extended portions extending in the second direction, and at least one pattern portion connected to the extended portions. The at least one pattern portion includes a part having a width greater than a width of each of the extended portions in the first direction.

Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

An apparatus for manufacturing a display device includes a stage, a first electric field applying module including first probe pins and disposed on a first side of the stage, a light irradiation module including light-emitting elements and disposed on the stage, and a first voltage output module that outputs an emission driving signal that drives the light-emitting elements, outputs a first alignment signal to one of the first probe pins, and outputs a second alignment signal to another one of the first probe pins.

A lighting device comprises multiple modules each having an array of LED chip connection pads. Interconnections between the pads provide groups of connection pads, each group comprising a parallel set of connection pads, and the groups being in series with each other. An optical unit is provided for shaping the light output from LED chips mounted on the pads. The groups are defined to minimize an overall spacing of the pads within the groups (in combination) to provide a best possible color mixing for the LEDs mounted on the connection pads.

A light-emitting device includes a carrier, a light-emitting element and a connection structure. The carrier includes a first electrical conduction portion. The light-emitting element includes a first light-emitting layer capable of emitting first light and a first contact electrode formed under the light-emitting layer. The first contact electrode is corresponded to the first electrical conduction portion. The connection structure includes a first electrical connection portion and a protective portion surrounding the first contact electrode and the first electrical connection portion. The first electrical connection portion includes an upper portion, a lower portion and a neck portion arranged between the upper portion and the lower portion. An edge of the upper portion is protruded beyond the neck portion, and an edge of the lower portion is protruded beyond the upper portion.