The present disclosure relates to an array substrate for an X-ray detector and an X-ray detector including the same. The array substrate is defined as an active area and a pad area, wherein the pad area includes a substrate including a first area and a second area extending from the first area, and a plurality of data lines contacting an upper surface of the substrate and extending toward the second area from the first area, adjacent data lines of the plurality of data lines are spaced apart from each other, the upper surface of the substrate is exposed in a area between the adjacent data lines in the first area of the substrate, and a first insulation film is disposed between the substrate and the data lines in the second area of the substrate, thereby preventing a short-circuit between adjacent data lines due to agglomeration between data lines and an organic layer during cutting.

An imaging device having a three-dimensional integration structure is provided. A first structure including a transistor including silicon in an active layer or an active region and a second structure including an oxide semiconductor in an active layer are fabricated. After that, the first and second structures are bonded to each other so that metal layers included in the first and second structures are bonded to each other; thus, an imaging device having a three-dimensional integration structure is formed.

Photodetector structures and methods of manufacture are provided. The method includes forming undercuts about detector material formed on a substrate. The method further includes encapsulating the detector to form airgaps from the undercuts. The method further includes annealing the detector material causing expansion of the detector material into the airgaps.

There is provided an imaging device manufacturing method contributing to improved reliability and yield. The method includes forming a first insulating film on a polysilicon film and then removing a portion of the first insulating film formed on a second main surface and a portion of the first insulating film formed on a side surface of the substrate to expose a polysilicon film. After the polysilicon film is exposed, a second insulating film is formed on the first main surface by a plasma chemical vapor deposition (CVD) method.

A method of manufacturing an image sensor device includes providing a substrate; forming a buffer layer on the substrate; forming a metal oxide channel on the buffer layer; forming a gate oxide layer on the buffer layer and the metal oxide channel; forming a gate metal layer on the gate oxide layer; forming a photodiode stack on the gate metal layer; patterning the gate oxide layer and the gate metal layer to form a first portion under the photodiode stack, and a second portion comprising a transistor; forming an interlayer dielectric layer over at least the photodiode stack and the transistor; forming a plurality of vias in the interlayer dielectric layer; and metalizing the vias to form contacts to the image sensor device.

In some embodiments of the disclosed subject matter, a touch sensing pattern recognition array substrate, and related unit, sensor, apparatus, and fabricating method are provided. The sensing unit on the touch sensing pattern recognition array substrate comprises a thin film transistor part and a photosensitive part. The photosensitive part comprises an opaque electrode, a transparent electrode, and a photosensitive layer sandwiched by the opaque electrode and the transparent electrode. The thin film transistor part comprises a gate electrode connected with a scanning line, a source electrode connected with a signal line, and a drain electrode connected with the photosensitive layer of the photosensitive part.

Various embodiment include optical and optoelectronic devices and methods of making same. Under one aspect, an optical device includes an integrated circuit having an array of conductive regions, and an optically sensitive material over at least a portion of the integrated circuit and in electrical communication with at least one conductive region of the array of conductive regions. Under another aspect, a film includes a network of fused nanocrystals, the nanocrystals having a core and an outer surface, wherein the core of at least a portion of the fused nanocrystals is in direct physical contact and electrical communication with the core of at least one adjacent fused nanocrystal, and wherein the film has substantially no defect states in the regions where the cores of the nanocrystals are fused. Additional devices and methods are described.

A photoelectric conversion device includes a photoelectric conversion unit including a first and second electrodes, a photoelectric conversion layer between the first and second electrodes, and an insulating layer between the photoelectric conversion layer and the second electrodes, an amplifier unit connected to the second electrode and outputs a signal generated in the photoelectric conversion unit, and a reset unit for resetting a voltage of the second electrode. An accumulating operation for accumulating signal charges in the photoelectric conversion unit and a charge removing operation for removing the signal charges from the photoelectric conversion unit are alternately executed in accordance with a voltage applied between the first and second electrodes, and the charge removing operation is executed multiple times between a first accumulating operation and a second accumulating operation which is executed after the first accumulating operation.

Photon or electron detectors may include polycrystalline silicon resistive gates with voltage gradients applied to reduce lag and improve operating speeds. The polycrystalline silicon resistive gates may be doped polycrystalline silicon which is heavily doped with donor atoms or acceptor atoms and ion-implanted with an electrically inactive species. The electrically inactive species may be implanted in a pattern to form multiple ion-implanted regions with different resistivities. The ion-implanted regions are formed in select patterns to control the resistivity of the polycrystalline silicon resistive gates and to modify the lateral electric field across the differentially-biased polycrystalline silicon resistive gate. The X-ray detectors may also include a circuit element with a current-mode differential connection to improve clock feedthrough and power dissipation characteristics.

In a manufacturing method of a photoelectric conversion panel, a contact hole CH3 that exposes a part of an upper face of a photodiode and a contact hole CH2 that exposes a source connection electrode are formed in a first flattening film and in inorganic insulating films 105a to 105c, an inorganic insulating film 107 is formed, contact holes CH2a and CH3a are formed in the contact holes CH2 and CH3, respectively, and a bias line and a data line are formed in the contact holes CH2a and CH3a, respectively.