A method of controlling a moving robot is provided. The method of controlling a moving robot includes the steps of: (a) performing a basic motion of the moving robot which moves on a rotating mop; (b) measuring the slip rate of the moving robot; and (c) controlling the travel of the moving robot.

A method of controlling a moving robot is provided. The method of controlling a moving robot includes the steps of: (a) performing a basic motion of the moving robot which moves on a rotating mop; (b) measuring the slip rate of the moving robot; and (c) controlling the travel of the moving robot.

A wash equipment assembly for a car wash and method of operating the equipment are described. For example, the assembly includes a cleaning element configured to clean a vehicle, an arm assembly operably attached to the cleaning element and configured to move the cleaning element to a vehicle cleaning position, the arm movably fixed to a support at a first end and the cleaning element mounted on the arm at a second end, a controlled locator for positioning the arm relative to the support such that the cleaning equipment is moved to the vehicle cleaning position, and a sensor for evaluating an actual orientation of the cleaning element relative to a default orientation of the cleaning element. In certain implementations, the controlled locator can modify the position of the arm in response to a signal from the sensor, thereby providing a closed loop control system.

A wash equipment assembly for a car wash and method of operating the equipment are described. For example, the assembly includes a cleaning element configured to clean a vehicle, an arm assembly operably attached to the cleaning element and configured to move the cleaning element to a vehicle cleaning position, the arm movably fixed to a support at a first end and the cleaning element mounted on the arm at a second end, a controlled locator for positioning the arm relative to the support such that the cleaning equipment is moved to the vehicle cleaning position, and a sensor for evaluating an actual orientation of the cleaning element relative to a default orientation of the cleaning element. In certain implementations, the controlled locator can modify the position of the arm in response to a signal from the sensor, thereby providing a closed loop control system.

A roadway or pavement sweeper with multiple sweeping modes for the removal of debris from a swept surface may, in some embodiments, include a sweeper vehicle having a pair of side-brooms independently movable between a retracted and extended position for sweeping debris into an area therebetween and at least one material-transfer broom to sweep a portion of the debris accumulated between the side-brooms as the vehicle moves in its direction of travel. A fan-driven suction-inlet may be provided at or adjacent each side of the vehicle. The at least one material-transfer broom may rotate in a first or other direction to transfer debris for entrainment into a selected suction-inlet for transfer to a debris hopper. Other embodiments are also described.

A roadway or pavement sweeper with multiple sweeping modes for the removal of debris from a swept surface may, in some embodiments, include a sweeper vehicle having a pair of side-brooms independently movable between a retracted and extended position for sweeping debris into an area therebetween and at least one material-transfer broom to sweep a portion of the debris accumulated between the side-brooms as the vehicle moves in its direction of travel. A fan-driven suction-inlet may be provided at or adjacent each side of the vehicle. The at least one material-transfer broom may rotate in a first or other direction to transfer debris for entrainment into a selected suction-inlet for transfer to a debris hopper. Other embodiments are also described.

In an example of the disclosure, a blanket servicing system includes a rotatably mounted endless cleaning surface and a scraper. The endless cleaning surface is to have a first engagement with a blanket to obtain a layer of thermoplastic print agent from the blanket. The endless cleaning surface is to have a second engagement with the blanket to receive residue from the blanket onto the layer of thermoplastic print agent. The scraper is to scrape the endless cleaning surface to transfer the residue from the endless cleaning surface to a collection element.

In an example of the disclosure, a blanket servicing system includes a rotatably mounted endless cleaning surface and a scraper. The endless cleaning surface is to have a first engagement with a blanket to obtain a layer of thermoplastic print agent from the blanket. The endless cleaning surface is to have a second engagement with the blanket to receive residue from the blanket onto the layer of thermoplastic print agent. The scraper is to scrape the endless cleaning surface to transfer the residue from the endless cleaning surface to a collection element.

A surface treatment vehicle for manufacturing a wind turbine blade is provided, the vehicle including: a transportation unit for locomotion of the vehicle, and a filling unit for applying a filler material on a surface of the blade, wherein the filling unit includes: a dispensing head for dispensing the filler material, the dispensing head being moveably attached to the transportation unit, and a tank for storing the filler material, the tank being attached to the transportation unit and fluidly connected to the dispensing head. Having the surface treatment vehicle with the filling unit allows an easier, faster, safer and more efficient manufacturing of a wind turbine blade.

A wafer cleaning apparatus includes: a brush, configured to wash a surface to be cleaned of a wafer; a base for carrying the brush, the base having at least one conductive disk, a disk surface of the conductive disk being parallel to the surface to be cleaned, and the base being able to rotate around an axis of the base; and a magnetic field generation structure configured to emit, to the conductive disk, a magnetic field perpendicular to the disk surface of the conductive disk, so that an induced electric field is generated in the conductive disk during the rotation of the base. The quality of wafer cleaning and the yield of wafer products can be improved.