A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified.

A design structure for an integrated radio frequency (RF) filter on a backside of a semiconductor substrate includes: a device on a first side of a substrate; a radio frequency (RF) filter on a backside of the substrate; and at least one substrate conductor extending from the front side of the substrate to the backside of the substrate and electrically coupling the RF filter to the device.

An electroactive device may include (1) an electroactive polymer element having a first surface and a second surface opposing the first surface, (2) a primary electrode abutting the first surface, and (3) a secondary electrode abutting the second surface. The electroactive polymer element may be transformed from an initial state to a deformed state and may achieve substantially uniform strain by the application of an electrostatic field produced by a potential difference between the electrodes. Various other devices, systems, and methods are also disclosed.

A multilayer piezoelectric element includes a ceramic base body, a pair of external electrodes, multiple internal electrodes, and surface electrodes. The pair of external electrodes cover a pair of end faces and extend from the pair of end faces along a pair of principal faces and a pair of side faces. The multiple internal electrodes are stacked inside the ceramic base body along the thickness direction, and are connected alternately to one or the other of the pair of external electrodes along the thickness direction. The surface electrodes extend from the pair of external electrodes along the pair of principal faces, and are each divided in the longitudinal direction at a position near, of the pair of external electrodes, the external electrode to which the internal electrode adjacent to the principal face is connected.

Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.

A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

According to one embodiment, a liquid discharge head includes a flexible printed circuit (FPC) connected to piezoelectric elements. The FPC has a first end in the first direction. A wiring layer of the FPC has a first region at the first end and a cover layer covering on a second region. The piezoelectric elements are spaced from each other in a second direction and each has a first electrode on a side surface facing towards the FPC. The first side has a joint surface facing the first region of the wiring layer. The first electrode is electrically connected to the wiring layer at the joint surface. The side surface includes a step portion that is recessed from the joint surface. A portion of the cover layer protrudes into a space adjacent to the step portion.

An electroacoustic transducer includes: a polygonal-shaped laminated piezoelectric element including alternately stacked piezoelectric layers and electrode layers, with the piezoelectric layers placed between at least one pair of electrode layers having different polarities; and a circular vibration plate on which the laminated piezoelectric element is placed. Of the piezoelectric layers sandwiched between the at least one pair of electrode layers, the total volume (V) of those effective layers that overlap the at least one pair of electrode layers as viewed from the stacking direction satisfies the condition below:

0.2πR.sup.2×ts≦V≦2.0πR.sup.2×ts

wherein π represents the ratio of the circumference of a circle to its diameter, R represents the radius of the vibration plate, and ts represents the thickness of the vibration plate.

In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.

A bender beam actuator includes a first layer of piezoelectric material and a second layer of piezoelectric material overlying a portion of the first layer of piezoelectric material, where a length of the first layer of piezoelectric material is at least 2% greater than a length of the second layer of piezoelectric material.