A photo-sensing unit including a first electrode, a first insulation layer, a photo-sensing structure and a second electrode is provided. The first insulation layer covers the first electrode and has an opening exposing the first electrode. The photo-sensing structure is located on the first electrode and disposed in the opening of the first insulation layer. The photo-sensing structure includes a first photo-sensing layer and a second photo-sensing layer stacked with each other. A material of the first photo-sensing layer is Si.sub.xGe.sub.yO.sub.z. A material of the second photo-sensing layer is Si.sub.vO.sub.w. The second electrode covers the photo-sensing structure. A photo-sensing apparatus including the photo-sensing unit and a fabricating method of a photo-sensing unit are also provided.

A packaging structure and a packaging method for a fingerprint identification chip are provided. The packaging structure includes a substrate, a sensing chip, a wire and a plastic encapsulation layer. The substrate is provided with a first solder pad layer. The sensing chip has a first surface and a second surface opposite to the first surface, the first surface comprises a sensing area and a peripheral area surrounding the sensing area, and the surface of the sensing chip in the peripheral area is provided with a second solder pad layer. Two ends of the wire are electrically connected to the first solder pad layer and the second solder pad layer respectively. The plastic encapsulation layer is made of a polymer, the plastic encapsulation layer surrounds the wire and the sensing chip.

In some embodiments of the disclosed subject matter, a touch sensing pattern recognition array substrate, and related unit, sensor, apparatus, and fabricating method are provided. The sensing unit on the touch sensing pattern recognition array substrate comprises a thin film transistor part and a photosensitive part. The photosensitive part comprises an opaque electrode, a transparent electrode, and a photosensitive layer sandwiched by the opaque electrode and the transparent electrode. The thin film transistor part comprises a gate electrode connected with a scanning line, a source electrode connected with a signal line, and a drain electrode connected with the photosensitive layer of the photosensitive part.

A light-emitting element that includes a fluorescent material and has a high emission efficiency is provided. A light-emitting element in which a delayed fluorescence component due to TTA accounts for a high proportion of emissive components is provided. A novel light-emitting device with a high emission efficiency and a low power consumption is provided. A light-emitting element includes an anode, a cathode, and an EL layer. The EL layer includes a light-emitting layer including a host material and an electron-transport layer including a first material in contact with the light-emitting layer. The LUMO level of the first material is lower than that of the host material. The proportion of a delayed fluorescence component due to TTA is greater than or equal to 10 percent of the light emission from the EL layer. The proportion of the delayed fluorescence component due to TTA may be greater than or equal to 15 percent of the light emission.

An electronic device is disclosed, which includes: a substrate including a biometric sensing region and a non-sensing region; a biometric sensing module disposed corresponding to the biometric sensing region; a display layer disposed on the substrate; a light altering member at least partially disposed in the biometric sensing region; a touch sensing layer disposed on the display layer; and a supporting element disposed between the substrate and the biometric sensing module, wherein the light altering member includes a first insulating layer and a micro-structure layer disposed on the first insulating layer.

The present disclosure relates to a display apparatus. The display apparatus includes a plurality of light-transmitting areas disposed between the plurality of pixels. The light-transmitting area is formed between structures disposed in the light-emitting area adjacent to the light-transmitting area, and the structure physically disconnects a cathode layer of the light-emitting area and a cathode layer of the light-transmitting area. The cathode layer may be patterned in the light-transmitting area. Accordingly, when patterning is performed with a laser, it is possible to prevent the edge of the cathode layer from being curled in the outer portion of the light-transmitting area. In addition, it is possible to pattern with low energy and solve the damage due to thermal energy of the laser beam by preventing heat conduction to the light-emitting area of the light-emitting device layer. Further, it is possible to improve the reliability by blocking the moisture permeable path.

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

An electronic device comprises a substrate, a semiconductor element disposed on the substrate and comprising a top surface, a bottom surface and a side surface connected between the top surface and the bottom surface, and a shielding element comprising a first portion, a second portion and a third portion. The first portion is disposed between the bottom surface of the semiconductor layer and the substrate, the second portion surrounds the side surface of the semiconductor element, and the semiconductor element is disposed between the first portion and the third portion.

The present disclosure provides a display panel including: a substrate and a cover plate, disposed oppositely; a plurality of drive transistors, a plurality of reading transistors and a plurality of Schottky photodiodes, which are disposed on the substrate and located at a side of the substrate facing toward the cover plate; each of the Schottky photodiodes includes a photosensitive active layer and an interdigital electrode layer, the interdigital electrode layer is disposed on the photosensitive active layer and includes at least one first interdigital electrode and at least one second interdigital electrode spaced apart, each of the at least one first interdigital electrode is connected to a corresponding one of the reading transistors, and each of the at least one second interdigital electrode is connected to a bias signal terminal; a plurality of light-emitting units, disposed between the substrate and the cover plate and connected to the drive transistors one-to-one.

Fingerprint sensing circuit packages and methods of making such packages may comprise a first substrate having a top side and a bottom side; the top side comprising a fingerprint image sensing side over which a user's fingerprint is swiped; the bottom side comprising a metal layer forming a fingerprint sensing circuit image sensor structure; and a sensor control circuit housed in a sensor control circuit package mounted on the metal layer. The sensor control circuit may comprise an integrated circuit die contained within the sensor control circuit package. The fingerprint sensing circuit package may also have a second substrate attached to the bottom side of the first substrate having a second substrate bottom side on which is placed connector members connecting the fingerprint sensing circuit package to a device using a fingerprint image generated from the fingerprint sensing circuitry contained in the fingerprint sensing circuitry package.