A miniature imaging sensor illumination package includes a substrate, an illumination module, an image sensing module, and an encapsulating medium. The substrate has multiple conductive routings. The illumination module includes a supporter, a light-emitting element, and conductors. The light-emitting element is located on the top surface of the supporter. The conductors are arranged inside the supporter and correspondingly positioned under the light-emitting element. The first end of the conductor is electrically connected to the light-emitting element, and the second end is electrically connected to the conductive routings. A connection part is provided between the conductors to separately connect a part of the conductors. The image sensing module is located on the substrate and adjacent to the illumination module. The encapsulating medium is positioned between and around the illumination module and the image sensing module.

A carrier-free micro light source image sensing device includes an image sensor, a light source module, and a packaging layer. The image sensor is placed on a first positioning area of a temporary carrier; the light source module is adjacent to one side of the image sensor. The light source module includes a supporter and a light-emitting element. The light source module is placed on a second positioning area of a temporary carrier. The altitude of a light-emitting face of the light source element is lower than or equal to that of a sensing face of the image sensor. The packaging layer covers the image sensor and the light source module but reveals the sensing face and the light-emitting face. The temporary carrier is removed after the packaging layer is cured. The present invention can minimize the size of the light source image sensing device, simplify the production process, improve the overall product quality, increase the signal-to-noise ratio, and enhance image quality.

The present invention relates to an optical fingerprint sensor configured to be arranged under a cover structure comprising a display, the optical fingerprint sensor comprising: an array of photodetectors for detecting light transmitted from an object located on an opposite side of the cover structure; an array of light emitters for illuminating the object, the array of light emitters is interleaved with the array of photodetectors, and a collimator structure arranged to cover the array of light emitters and the array of photodetectors, the collimator structure comprising a first set of collimators aligned with the photodetectors and each being configured to provide a predetermined field of view, and a second set of collimators aligned with the light emitters, and each being configured to provide a predetermined field of illumination.

A sensing device is provided. The sensing device includes a driving substrate, a sensing module, and a plurality of bonding pads. The driving substrate includes a first substrate and a plurality of driving circuits disposed on the first substrate. Each of the driving circuits includes a plurality of thin-film transistors. The sensing module is bonded to the driving substrate, and the sensing module includes a second substrate and a plurality of sensing elements disposed on the second substrate. The sensing module is bonded to the driving substrate through the bonding pads. In addition, each of the driving circuits is electrically connected to at least one of the sensing elements. The wavelength of light penetrating the first substrate is greater than or equal to 4 m and less than or equal to 10 m. An electronic device including the sensing device is also provided.

A method of manufacturing a sensing device includes: providing a substrate; forming a circuit element on the substrate; forming a sensing element on the substrate; forming a planarization layer on the sensing element and the circuit element; forming a first opening in the planarization layer, wherein the first opening overlaps with the circuit element; and forming a second opening in the planarization layer, wherein the second opening overlaps with the sensing element. In addition, the first opening and the second opening are formed by different processes.

A detection device includes a substrate, a plurality of photodiodes that are arranged in a detection region of the substrate, a plurality of first terminals that are arranged in a first direction in a peripheral region outside the detection region of the substrate, an insulating film that covers the first terminals, and an anisotropic conductive film that is located above the insulating film, and covers the first terminals.

According to an aspect, a detection device includes: a substrate; a plurality of transistors provided on the substrate; a plurality of scan lines that extend in a first direction; a plurality of signal lines that extend in a second direction intersecting the first direction; a plurality of photodiodes that are provided in an area surrounded by the scan lines and the signal lines and each include a p-type semiconductor layer, an i-type semiconductor layer, and an n-type semiconductor layer; and a shield wiring line that extends in the first direction and overlaps a corresponding one of the scan lines. The shield wiring line is electrically coupled to, among the signal lines, a power supply signal line configured to supply a power supply potential to the transistors.

A display apparatus includes: a substrate including a display area and a peripheral area around the display area, the substrate having a bent portion; a plurality of display elements in the display area; and a thin film encapsulation layer over the plurality of display elements and including a first encapsulation layer, a second encapsulation layer over the first encapsulation layer, and an organic encapsulation layer between the first encapsulation layer and the second encapsulation layer, wherein the second encapsulation layer includes a plurality of inorganic thin layers and a plurality of organic thin layers alternately arranged, and a thickness of the second encapsulation layer is equal to or less than a thickness of the first encapsulation layer.

The present disclosure relates to an integrated chip including a semiconductor layer and a photodetector disposed along the semiconductor layer. A color filter is over the photodetector. A micro-lens is over the color filter. A dielectric structure comprising one or more dielectric layers is over the micro-lens. A receptor layer is over the dielectric structure. An optical signal enhancement structure is disposed along the dielectric structure and between the receptor layer and the micro-lens.

A fingerprint sensor has an array of microlenses formed on an upper surface of a transparent substrate; with a lower surface of the transparent substrate bonded to an upper surface of a fingerprint image sensor integrated circuit. In embodiments, it includes one or two filter layers on the lower surface of the transparent substrate, and may also include masked black baffle layers on one or more of the upper and lower surface of the transparent substrate. The sensor is made by forming the microlenses and black baffle layers on the transparent substrate, then aligning the transparent substrate to a wafer of fingerprint sensor integrated circuits and bonding the transparent substrate to the wafer, then dicing the wafer into individual fingerprint sensors.