Disclosed is a method of fabricating a contact in a semiconductor device. The method includes: receiving a semiconductor structure having an opening into which the contact is to be formed; forming a metal layer in the opening; forming a bottom anti-reflective coating (BARC) layer in the opening; performing implanting operations with a dopant on the BARC layer and the metal layer, the performing implanting operations including controlling an implant energy level and controlling an implant dosage level to form a crust layer with a desired minimum depth on top of the BARC layer; removing unwanted metal layer sections using wet etching operations, wherein the crust layer and BARC layer protect remaining metal layer sections under the BARC layer from metal loss during the wet etching operations; removing the crust layer and the BARC layer; and forming the contact in the opening over the remaining metal layer sections.

A semiconductor device including a gate electrode layer embedded in a gate trench, a contact trench including a first intersection region intersecting the gate trench, and an emitter contact electrode layer embedded in the contact trench, in which gate electrode recess portions are formed in the first intersection region in the gate trench and a peripheral portion of the first intersection region, a gate covering insulating layer is embedded in the gate electrode recess portion, and the emitter region is formed deeper than an upper surface of the gate electrode layer in the periphery of the first intersection region.

A device includes a substrate, a drift region in the substrate, a base region above the drift region; a first high concentration region selectively formed in a part on a surface side of the base region and having a concentration higher than the drift region; a trench portion formed in a front surface of the substrate and including extending portions; and mesa portions between the extending portions. The mesa portions includes first mesa portions having the first high concentration region and second mesa portions not having the first high concentration region, the trench portion includes a first trench portion having an first conductive portion (a gate conductive portion) and adjacent to the first mesa portion, a second trench portion having the first conductive portion and adjacent to the second mesa portion, and a third trench portion having an second conductive portion and adjacent to the first or second mesa portion.

Disclosed is a method of fabricating a contact in a semiconductor device. The method includes: receiving a semiconductor structure having an opening into which the contact is to be formed; forming a metal layer in the opening; forming a bottom anti-reflective coating (BARC) layer in the opening; performing implanting operations with a dopant on the BARC layer and the metal layer, the performing implanting operations including controlling an implant energy level and controlling an implant dosage level to form a crust layer with a desired minimum depth on top of the BARC layer; removing unwanted metal layer sections using wet etching operations, wherein the crust layer and BARC layer protect remaining metal layer sections under the BARC layer from metal loss during the wet etching operations; removing the crust layer and the BARC layer; and forming the contact in the opening over the remaining metal layer sections.

A device includes a thinned semiconductor substrate having a first side and a second side opposite to the first side; and at least one radio frequency device at the first side, wherein the second side of the thinned semiconductor substrate is processed to reduce leakage currents or to improve a radio frequency linearity of the at least one radio frequency device through Bosch etching.

A semiconductor device includes a trench emitter electrode located at a boundary between one end of an active cell region and an inactive cell region, a trench gate electrode located at a boundary between the other end of the active cell region and the inactive cell region, an end trench gate electrode connected to one end of the trench gate electrode, and an end trench emitter electrode connected to one end of the trench emitter electrode. A hole barrier region of a first conductivity type is provided under a body region of a second conductivity type between the end trench gate electrode and the end trench emitter electrode in a plan view. A body region in the active cell region and a body region in the inactive cell region are connected to each other by a body region between the end trench gate electrode and the end trench emitter electrode.

Provided is a semiconductor device including a semiconductor substrate; a transistor portion provided in the semiconductor substrate; a current sensing portion for detecting current flowing through the transistor portion; an emitter electrode set to an emitter potential of the transistor portion; a sense electrode electrically connected to the current sensing portion; and a Zener diode electrically connected between the emitter electrode and the sense electrode. Provided is a semiconductor device fabricating method including providing a transistor portion in a semiconductor substrate; providing a current sensing portion for detecting current flowing through the transistor portion; providing an emitter electrode set to an emitter potential of the transistor portion; providing a sense electrode electrically connected to the current sensing portion; and providing a Zener diode electrically connected between the emitter electrode and the sense electrode.

A semiconductor component includes: a SiC semiconductor body; a trench extending from a first surface of the SiC semiconductor body into the SiC semiconductor body, the trench having a conductive connection structure, a structure width at a bottom of the trench, and a dielectric layer covering sidewalls of the trench; a shielding region along the bottom and having a central section which has a lateral first width; and a contact formed between the conductive connection structure and the shielding region. The conductive connection structure is electrically connected to a source electrode. In at least one doping plane extending approximately parallel to the bottom, a dopant concentration in the central section deviates by not more than 10% from a maximum value of the dopant concentration in the shielding region in the doping plane. The first width is less than the structure width and is at least 30% of the structure width.

A semiconductor device and method of making is described. A substrate (1) topped by a buffer layer (2) of a first conductivity type and one or more epitaxial layers (3) of the same type. In the topmost epitaxial layer, a body region (4) of a second conductivity type is formed, along with a source region (5) of the first conductivity type. Beneath the source region lies a buried body contact region (6) of the second conductivity type. A trench (16) in the source region provides access to the body contact region and is narrower than it. Ohmic contacts include a source contact (9) overlapping the source region on trench sidewalls and a body contact (10) overlapping the body contact region at the trench bottom. Between body regions of neighboring cells, a JFET region (13) is formed.

A semiconductor die includes: a semiconductor substrate; transistor cells formed in a first region of the semiconductor substrate and electrically coupled in parallel to form a power transistor, the transistor cells including first trenches that extend from a first surface of the semiconductor substrate into the first region; a gate pad formed above the first surface and electrically connected to gate electrodes in the first trenches, the gate pad being formed over a second region of the semiconductor substrate that is devoid of functional transistor cells; second trenches extending from the first surface into the second region and including gate electrodes that are electrically connected to the gate pad and form a first conductor of an additional input capacitance of the power transistor; and a second conductor of the additional input capacitance formed in the second region adjacent the second trenches. Methods of producing the semiconductor die are also described.