The imaging device of the present invention includes: an image sensor 14 that is configured such that a plurality of pixels having an organic layer (14-4) for photoelectric conversion is two-dimensionally arranged, and each pixel of the image sensor (14) is divided into a plurality of regions, and has an on-chip microlens (15), which forms a pupil image of a optical imaging system on the plurality of regions, and reading sections (16) which respectively read photoelectrically converted signals of the plurality of divided regions; an optical diaphragm that mechanically stops down rays which are incident into the image sensor 14; and an electronic diaphragm section that electronically controls an aperture value, and that selects signals of the divided regions corresponding to the aperture value from the signals of the plurality of divided regions, on the basis of the aperture value which is controlled by the optical diaphragm.

An imaging device comprises at least one unit pixel cell. Each of them comprises: a photoelectric conversion layer having a first and second surfaces; a pixel electrode and a shield electrode located on the first surface and separated from each other, a shield voltage being applied to the shield electrode; an upper electrode located on the second surface and opposing to the pixel electrode and the shield electrode, a counter voltage being applied to the upper electrode; a charge accumulation node electrically connected to the pixel electrode; and a charge detection circuit electrically connected to the charge accumulation node. An absolute value of a difference between the shield voltage and the counter voltage is larger than an absolute value of a difference between the counter voltage and a voltage of the pixel electrode.

A solid-state image sensor includes a semiconductor substrate having a photoelectric conversion element converting incident light into a charge and a charge retaining section temporarily retaining the charge photoelectrically converted by the photoelectric conversion element and a light shielding section having an embedded section extending in at least a region between the photoelectric conversion element and the charge retaining section of the semiconductor substrate.

An imaging device includes a plurality of pixels arranged in a pixel region, each of the plurality of pixels including a photoelectric conversion element including a first electrode provided above a substrate, a second electrode provided above the first electrode and a photoelectric conversion layer provided between the first electrode and the second electrode, an interconnection layer provided between the substrate and the first electrode, the interconnection layer including a first conductive member extending in a first direction, and a second conductive member arranged at a level lower than the first conductive member and extending in a second direction intersecting the first direction, a first contact portion provided in the pixel region, the first contact portion electrically connecting the second electrode and the first conductive member, and a second contact portion electrically connecting the first conductive member and the second conductive member.

A solid-state image sensor includes a pixel formed, upon forming a structure where a photoelectric conversion layer is laminated on a wiring layer constituting a pixel circuit, by forming at least the photoelectric conversion layer and a wiring layer bonding layer on a different substrate from a semiconductor substrate in which the wiring layer is formed, and by bonding the wiring layer bonding film of the different substrate and the wiring layer of the semiconductor substrate together.

An imaging device with excellent imaging performance is provided. The imaging device has a first circuit including a first photoelectric conversion element and a second circuit including a second photoelectric conversion element. The second circuit is shielded from light. In the imaging device, a current mirror circuit in which a transistor connected to the second photoelectric conversion element serves as an input transistor and a transistor connected to the first photoelectric conversion element serves as an output transistor is formed. With such a configuration, the amount of photocurrent in the first circuit from which the contribution of the dark current of the first photoelectric conversion element has been excluded can be detected.

An imaging device comprises at least one unit pixel cell. Each of them comprises: a photoelectric conversion layer having a first and second surfaces; a pixel electrode and a shield electrode located on the first surface and separated from each other, a shield voltage being applied to the shield electrode; an upper electrode located on the second surface and opposing to the pixel electrode and the shield electrode, a counter voltage being applied to the upper electrode; a charge accumulation node electrically connected to the pixel electrode; and a charge detection circuit electrically connected to the charge accumulation node. The charge detection circuit includes a reset transistor that sets the pixel electrode at an initialization voltage at predetermined timing. An absolute value of a difference between the shield voltage and the counter voltage is larger than an absolute value of a difference between the initialization voltage and the counter voltage.

A highly functional photoelectric conversion element is provided. The photoelectric conversion element includes: a first photoelectric converter that detects light in a first wavelength range and photoelectrically converts the light; a second photoelectric converter that detects light in a second wavelength range and photoelectrically converts the light to obtain distance information of a subject; and an optical filter that is disposed between the first photoelectric converter and the second photoelectric converter, and allows the light in the second wavelength range to pass therethrough more easily than the light in the first wavelength range. The first photoelectric converter includes a stacked structure and an electric charge accumulation electrode. The stacked structure includes a first electrode, a first photoelectric conversion layer, and a second electrode that are stacked in order, and the electric charge accumulation electrode is disposed to be separated from the first electrode and be opposed to the first photoelectric conversion layer with an insulating layer interposed therebetween.

An image sensor includes a color filter array, a first photoelectric conversion device configured to absorb first light passing through the color filter array and convert the absorbed first light into electrical signals, and a second photoelectric conversion device configured to absorb second light passing through both the color filter array and the first photoelectric conversion device and convert the absorbed second light into electrical signals. The first photoelectric conversion device includes a first photoelectric conversion layer configured to selectively absorb a mixed light of the first and second colors. The second photoelectric conversion device comprises a second photoelectric conversion layer configured to absorb light including a third color. Each of the first to third colors is one of three primary colors. The image sensor combines the electrical signals converted from the first and second photoelectric conversion devices to obtain electrical signals of the first to third colors.

An image sensor is provided. The image sensor includes a substrate and isolation structures disposed on the substrate. The isolation structures are electrically non-conductive and define pixel regions. The image sensor also includes electrodes disposed on the substrate and in direct contact with the isolation structures. The image sensor further includes an active layer disposed between the isolation structures. Moreover, the image sensor includes an encapsulation layer disposed over the active layer. The image sensor also includes a color filter layer disposed over the encapsulation layer.