A semiconductor diode includes a wide bandgap semiconductor body having opposing first and second surfaces. The wide band gap semiconductor body includes a first pn junction diode having a first p-doped region adjoining the first surface and a first n-doped region adjoining both surfaces. The semiconductor diode further includes a semiconductor element including a second pn junction diode having a second p-doped region and second n-doped region, and a dielectric structure between the wide bandgap semiconductor body and semiconductor element. The dielectric structure electrically insulates the wide bandgap semiconductor body from the semiconductor element. The bandgap energy of the semiconductor element is smaller than that of the wide bandgap semiconductor body. A cathode contact is electrically connected to the first n-doped region at the second surface. The second n-doped region of the second pn junction diode is electrically coupled to the first n-doped region of the first pn junction diode.

A semiconductor component includes: a SiC semiconductor body; a trench extending from a first surface of the SiC semiconductor body into the SiC semiconductor body, the trench having a conductive connection structure, a structure width at a bottom of the trench, and a dielectric layer covering sidewalls of the trench; a shielding region along the bottom and having a central section which has a lateral first width; and a contact formed between the conductive connection structure and the shielding region. The conductive connection structure is electrically connected to a source electrode. In at least one doping plane extending approximately parallel to the bottom, a dopant concentration in the central section deviates by not more than 10% from a maximum value of the dopant concentration in the shielding region in the doping plane. The first width is less than the structure width and is at least 30% of the structure width.

Semiconductor devices and associated fabrication methods are disclosed. In one disclosed approach a process for forming a semiconductor device is provided. The process includes: implanting a first region of semiconductor material using a first channeled implant with a first conductivity type; and implanting, after the first channeled implant, a second region of semiconductor material using a second channeled implant with a second conductivity type. The first channeled implant disrupts a crystal structure of the first region of semiconductor material and does not disrupt a crystal structure of the second region of semiconductor material.

A semiconductor device includes a semiconductor layer having an active region and a gate contact region adjacent the active region, a plurality of alternating mesa stripes and trenches in the active region, a gate contact pad on the semiconductor layer, and an under-gate mesa in the gate contact region beneath the gate contact pad. The semiconductor device may have a saw street at an outer periphery of the semiconductor layer, wherein a top surface of the saw street is at a same height above the substrate as top surfaces of the plurality of mesa stripes.

A vertical junction field effect transistor includes a trench structure laterally arranged between mesa regions along a first lateral direction. The trench structure extends into a semiconductor body from a first surface of the semiconductor body. Each of the mesa regions includes a mesa channel region of a first conductivity type. The vertical junction field effect transistor further includes a gate region of a second conductivity type. The gate region adjoins at least part of opposite sidewalls of the trench structure and to a bottom side of the trench structure. The trench structure includes a silicon layer adjoining the gate region at the bottom side of the trench structure. A first thickness of the gate region at the bottom side of the trench structure is larger than a second thickness of the gate region at each of the opposite sidewalls of the trench structure.

A transistor that may include a drift layer formed on a substrate. A well implant layer formed within the drift layer wherein the well implant layer has a first gap. A gate implant layer formed within the drift layer and partially over the well implant layer wherein the gate implant layer has a second gap. A source implant layer formed within the drift layer and within the second gap of the gate implant layer. A plurality of gate contacts operatively connected to the gate implant layer. A source contact operatively connected to the source implant layer.

A method of fabricating a semiconductor device includes providing a substrate structure comprising a semiconductor substrate of a first conductivity type, a drift layer on the semiconductor substrate, and a fin array on the drift layer and surrounded by a recess region. The fin array comprises a first row of fins and a second row of fins parallel to each other and separated from each other by a space. The first row of fins comprises a plurality of first elongated fins extending parallel to each other in a first direction. The second row of fins comprises a plurality of second elongated fins extending parallel to each other in a second direction parallel to the first direction. The method also includes epitaxially regrowing a gate layer surrounding the first and second row of fins on the drift layer and filling the recess region.

A semiconductor device includes a semiconductor layer having an active region. The semiconductor layer has a first conductivity type. The semiconductor device further includes a plurality of alternating mesa stripes and trenches in the active region, a source metal layer electrically connected with the plurality of mesa stripes, an isolation ring adjacent the active region, the isolation ring having a second conductivity type opposite the first conductivity type, and a doped region in the semiconductor layer, wherein the isolation ring is between the active region and the doped region, the doped region having the second conductivity type and forming a P-N junction with the semiconductor layer. The source metal layer is electrically connected with the doped region.

A semiconductor device includes a semiconductor layer including a trench, wherein the trench is adjacent a mesa, a first metal silicide layer on a top portion of the mesa, and a second metal silicide layer on a bottom portion of the trench. The first metal silicide layer has a thickness that is no more than about 1 to 1.5 times greater than a thickness of the second metal silicide layer. Related methods of forming a semiconductor device are disclosed.

A vertical fin-based field effect transistor (FinFET) device includes an array of FinFETs comprising a plurality of rows and columns of separated fins. Each of the separated fins has a length and a width measured laterally with respect to the length and includes a first fin tip disposed at a first end of the separated fin, a second fin tip disposed at a second end of the separated fin opposing the first end, a central region disposed between the first fin tip and the second fin tip and characterized by a first electrical conductivity, and a source contact electrically coupled to the central region. The first fin tip and the second fin tip are characterized by a second electrical conductivity less than the first electrical conductivity. The FinFET further includes a first gate region surrounding the first fin tip and a second gate region surrounding the second fin tip.