H01L39/22

Vertical AL/EPI SI/AL, and also AL/AL oxide/AL, josephson junction devices for qubits

A vertical Josephson junction device includes a substrate, and an epitaxial stack formed on the substrate. The vertical Josephson junction device includes a first superconducting electrode embedded in the epitaxial stack, and a second superconducting electrode embedded in the epitaxial stack, the second superconducting electrode being separated from the first superconducting electrode by a dielectric layer. In operation, the first superconducting electrode, the dielectric layer, and the second superconducting electrode form a vertical Josephson junction.

INTEGRATION SCHEME FOR SHUNTED JOSEPHSON JUNCTIONS

Materials with etch selectivity with respect to one another and one or more additional etch-stop layers are used in a Josephson junction structure to allow for integration with a Josephson junction with supporting structures such as resistors. Selective etch processes compatible with high volume manufacturing are used to pattern various layers of the Josephson junction structure to provide a Josephson junction, which is electrically coupled to a support structure.

HIGH TEMPERATURE SUPERCONDUCTOR-BASED INTERCONNECT SYSTEMS WITH A LOWERED THERMAL LOAD FOR INTERCONNECTING CRYOGENIC ELECTRONICS WITH NON-CRYOGENIC ELECTRONICS

High temperature superconductor (HTS)-based interconnect systems comprising a cable including HTS-based interconnects are described. Each of the HTS-based interconnects includes a first portion extending from a first end towards an intermediate portion and a second portion extending from the intermediate portion to a second end. Each of the HTS-based interconnects includes a substrate layer formed in the first portion, in the intermediate portion, and in the second portion, a high temperature superconductor layer formed in at least a sub-portion of the first portion, in the intermediate portion, and in the second portion, and a metallic layer formed in the first portion and in at least a sub-portion of the intermediate portion. The HTS-based interconnect system includes a thermal load management system configured to maintain the intermediate portion of each of the HTS-based interconnects at a predetermined temperature in a range between a temperature of 60 kelvin and 92 kelvin.

ELECTRONIC CIRCUIT, CALCULATION DEVICE, AND METHOD FOR MANUFACTURING THE ELECTRONIC CIRCUIT
20220376161 · 2022-11-24 · ·

According to one embodiment, an electronic circuit includes a first nonlinear element, a second nonlinear element, and a third nonlinear element. The first nonlinear element includes a first element Josephson junction provided in a first region of a first surface including the first region and a second region. The second nonlinear element includes a second element Josephson junction provided in the second region. The third nonlinear element includes a Josephson junction circuit. At least a part of the Josephson junction circuit is provided on a second surface. The second surface is separated from the first surface in a first direction crossing the first surface. The second surface is along the first surface. The third nonlinear element is configured to be coupled with the first nonlinear element. The third nonlinear element is configured to be coupled with the second nonlinear element.

Materials and methods for fabricating superconducting quantum integrated circuits

Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 μA/μm.sup.2; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.

DEVICE INCLUDING ELEMENTS FOR COMPENSATING FOR LOCAL VARIABILITY OF ELECTROSTATIC POTENTIAL

A device including: a semiconductor layer comprising first regions delimited by second regions and third regions; first electrostatic control gates including first conductive portions extending parallel to each other, in vertical alignment with the second regions; second electrostatic control gates including second conductive portions extending parallel to each other, in vertical alignment with the third regions;
wherein each first gate includes an electrostatic control voltage adjustment element forming two impedances connected in series, one end of one of the impedances being coupled to the first conductive portion of the first gate and one end of the other of the impedances being coupled to a third conductive portion applying an adjustment electric potential to the second impedance, and wherein the value of at least one of the impedances is adjustable.

Systems and methods for coupling qubits in a quantum processor

Josephson junctions (JJ) may replace primary inductance of transformers to realize galvanic coupling between qubits, advantageously reducing size. A long-range symmetric coupler may include a compound JJ (CJJ) positioned at least approximately at a half-way point along the coupler to advantageously provide a higher energy of a first excited state than that of an asymmetric long-range coupler. Quantum processors may include qubits and couplers with a non-stoquastic Hamiltonian to enhance multi-qubit tunneling during annealing. Qubits may include additional shunt capacitances, e.g., to increase overall quality of a total capacitance and improve quantum coherence. A sign and/or magnitude of an effective tunneling amplitude Δ.sub.eff of a qubit characterized by a double-well potential energy may advantageously be tuned. Sign-tunable electrostatic coupling of qubits may be implemented, e.g., via resonators, and LC-circuits. YY couplings may be incorporated into a quantum anneaier (e.g., quantum processor).

READOUT OF A QUANTUM STATE IN AN ARRAY OF QUANTUM DOTS

Methods and systems are described for readout of one or more spin states associated with one or more quantum dots in an array of quantum dots, wherein the method comprises: configuring or providing one or more read-out paths of connected quantum dots in the array of quantum dots, the quantum dots of at least one of the one or more read-out paths being configured close to a charge transition point such that a charge transition in one or more first quantum dots at a first end of the tuned read-out path induces a charge transition in one or more second quantum dots at a second end of the tuned read-out path, the second end being connected to a charge detector; configuring one or more quantum dots of the quantum dot array into a spin-to-charge conversion system connected to the first end of the tuned read-out path, the charge convention system including at least two connected quantum dots hosting a spin state or a quantum dot hosting a spin state connected to a reservoir; and, obtaining information about the spin state in the spin-to-charge system, the obtaining information including the charge detector measuring a charge transition in the one or more second quantum dots at a second end of the tuned read-out path.

Fabricating transmon qubit flip-chip structures for quantum computing devices

A quantum computing device is formed using a first chip and a second chip, the first chip having a first substrate, a first set of pads, and a set of Josephson junctions disposed on the first substrate. The second chip has a second substrate, a second set of pads disposed on the second substrate opposite the first set of pads, and a second layer formed on a subset of the second set of pads. The second layer is configured to bond the first chip and the second chip. The subset of the second set of pads corresponds to a subset of the set of Josephson junctions selected to avoid frequency collision between qubits in a set of qubits. A qubit is formed using a Josephson junction from the subset of Josephson junctions and another Josephson junction not in the subset being rendered unusable for forming qubits.

Superconducting circuit including superconducting qubits
11489101 · 2022-11-01 · ·

The present disclosure discloses a device and a method for fabricating a superconducting circuit including a superconducting qubit. The superconducting circuit comprises a bottom electrode interconnecting a superconducting qubit and a first part of the superconducting circuit. The bottom electrode comprises a bottom electrode of the superconducting qubit and a bottom electrode of the first part of the superconducting circuit. The bottom electrode of the superconducting qubit and the bottom electrode of the first part of the superconducting circuit are formed in a first superconducting layer.