Patent classifications
H01L27/28
Organic lighting device and lighting equipment
A glazing comprising a luminous means with a substrate having a first main surface, to which a first electrode is applied, a second electrode, and an organic layer stack within an active region of the substrate between the first and the second electrode, wherein the organic layer stack comprises at least one organic layer which is suitable for generating light, wherein the luminous means is arranged between two glass plates of the glazing of a window. Also, storage furniture is disclosed comprising a storage element shaped in planar fashion and having at least one storage surface and at least one radiation-emitting component, and at least one holding apparatus for holding the storage element.
METHOD OF MANUFACTURING A FIELD EFFECT TRANSISTOR USING CARBON NANOTUBES AND A FIELD EFFECT TRANSISTOR
In a method of forming a gate-all-around field effect transistor (GAA FET), a bottom support layer is formed over a substrate and a first group of carbon nanotubes (CNTs) are disposed over the bottom support layer. A first support layer is formed over the first group of CNTs and the bottom support layer such that the first group of CNTs are embedded in the first support layer. A second group of carbon nanotubes (CNTs) are disposed over the first support layer. A second support layer is formed over the second group of CNTs and the first support layer such that the second group of CNTs are embedded in the second support layer. A fin structure is formed by patterning at least the first support layer and the second support layer.
Imaging element, stacked-type imaging element, imaging apparatus, and manufacturing method of imaging element
An imaging element which is formed by sequentially stacking at least an anode, an anode-side buffer layer, a photoelectric conversion layer, and a cathode, in which the anode-side buffer layer includes a material having structural formula ##STR00001##
in which thiophene and carbazole are combined.
Sensor
According to one embodiment, a sensor includes a light emitter and a light sensor. The light emitter includes a first electrode, a second electrode, and a first light emitting layer. The second electrode is light-transmissive. The first light emitting layer is provided between the first electrode and the second electrode. The light sensor includes a third electrode, a fourth electrode, a fifth electrode, a first photoelectric conversion layer, and a second photoelectric conversion layer. the fourth electrode is light-transmissive. The fifth electrode is provided between the third electrode and the fourth electrode. The fifth electrode is light-transmissive. The first photoelectric conversion layer is provided between the third electrode and the fifth electrode. The second photoelectric conversion layer is provided between the fourth electrode and the fifth electrode.
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
The present disclosure relates to a solid-state imaging device that can achieve a high S/N ratio at a high sensitivity level without any decrease in resolution, and to an electronic apparatus. In the upper layer, the respective pixels of a photoelectric conversion unit that absorbs light of a first wavelength are tilted at approximately 45 degrees with respect to a square pixel array, and are two-dimensionally arranged in horizontal directions and vertical directions in an oblique array.
The respective pixels of a photoelectric conversion unit that is sensitive to light of a second or third wavelength are arranged under the first photoelectric conversion unit. That is, pixels that are √{square root over (2)} times as large in size (twice as large in area) and are rotated 45 degrees are arranged in an oblique array. The present disclosure can be applied to solid-state imaging devices that are used in imaging apparatuses, for example.
FIELD EFFECT TRANSISTOR STRUCTURE
A field effect transistor (FET) structure includes a substrate, an internal gate, an insulation layer, a semiconductor strip, a gate dielectric insulator, and a gate conductor. The internal gate includes a floor portion located on the substrate and a wall portion extending from the floor portion. The insulation layer is located on the floor portion of the internal gate. The semiconductor strip is located on the wall portion and a portion of the insulation layer, and the semiconductor strip includes source/drain regions and a channel region adjacent to the source/drain regions. The gate dielectric insulator is located on the channel region. The gate conductor is located on the gate dielectric insulator.
IMAGE SENSOR AND METHOD OF FABRICATING THEREOF
A color filter is disposed on a substrate. An organic photodiode is disposed on the color filter. The organic photodiode includes an electrode insulating layer having a recess region on the substrate, a first electrode on the color filter, the first electrode filling the recess region of the electrode insulating layer, a second electrode on the first electrode, and an organic photoelectric conversion layer interposed between the first electrode and the second electrode. The first electrode includes a seam extending at a first angle from a side surface of the recess region of the electrode insulating layer.
Drive sensing structure and bidirectional organic light-emitting display device using the same
The invention relates to a drive sensing structure, applicable to an environment of an organic light-emitting display device. The driving sensing structure includes: an organic diode, a driving circuit, a sensing circuit, and a voltage maintaining circuit; wherein, the driving circuit is used to receive a control signal and generate a corresponding voltage signal to drive the organic diode to emit light stably. The sensing circuit is used to convert a sensing voltage generated by the organic diode after receiving the light source into an image electrical signal. The voltage maintaining circuit is used to adjust the voltage signal of the driving circuit to prevent the voltage signal of the driving circuit from drifting. Thereby, the bidirectional organic light-emitting display device can be used not only as a light-emitting element, but also as a sensor for fingerprint image recognition, palmprint recognition, and touch function, thereby achieving the purposes of cost reduction and wide applicability.
Display Device and System
A display device having a photosensing function is provided. A display device having a biometric authentication function typified by fingerprint authentication is provided. A display device having a touch panel function and a biometric authentication function is provided. The display device includes a first substrate, a light guide plate, a first light-emitting element, a second light-emitting element, and a light-receiving element. The first substrate and the light guide plate are provided to face each other. The first light-emitting element and the light-receiving element are provided between the first substrate and the light guide plate. The first light-emitting element has a function of emitting first light through the light guide plate. The second light-emitting element has a function of emitting second light to a side surface of the light guide plate. The light-receiving element has functions of receiving the first light and converting the first light into an electric signal and functions of receiving the second light and converting the second light into an electric signal. The first light includes visible light, and the second light includes infrared light.
PHOTOVOLTAIC STRUCTURE AND METHOD OF FABRICATION
A photovoltaic device includes one or more features that taken alone or in combination enhance its efficiency. Some embodiments may comprise a tandem solar device in which a top PV cell is fabricated upon a front transparent substrate, that also serves as the top encapsulating substance. The top PV cell including the front encapsulating substance is then bonded (e.g., using adhesive) to a bottom PV cell in order to complete the tandem device. Using the same transparent, insulating element as both front encapsulating substance and a substrate for fabricating the top PV cell, obviates to the need to provide a separate structure (with resulting interfaces) to perform the latter role. For tandem and non-tandem PV devices, a Through-Substrate-Via (TSV) structure may extend through an insulating substrate in order to provide contact with an opposite side (e.g., back electrode). Embodiments may find particular use in fabricating shingled perovskite photovoltaic solar cells.