An imaging element includes a photoelectric conversion unit formed by laminating a first electrode 21, a photoelectric conversion layer 23A, and a second electrode 22. Between the first electrode 21 and the photoelectric conversion layer 23A, a first semiconductor material layer 23B.sub.1 and a second semiconductor material layer 23B.sub.2 are formed from the first electrode side, and the second semiconductor material layer 23B.sub.2 is in contact with the photoelectric conversion layer 23A. The photoelectric conversion unit further includes an insulating layer 82 and a charge accumulation electrode 24 disposed apart from the first electrode 21 so as to face the first semiconductor material layer 23B.sub.1 via the insulating layer 82. When the carrier mobility of the first semiconductor material layer 23B.sub.1 is represented by μ.sub.1, and the carrier mobility of the second semiconductor material layer 23B.sub.2 is represented by μ.sub.2, μ.sub.2<μ.sub.1 is satisfied.

A method for fabricating at least a portion of a complementary circuit, such as a complementary inverter circuit, includes fabricating a first sheet and a second sheet. Each of the sheets includes metal layers, a dielectric layer, and a semiconductor channel layer, configured so as to form a plurality of transistors of a respective polarity (i.e., P-type for one sheet, N-type for the other). The method also includes placing a layer of conductive material, such as anisotropic conducting glue (ACG) or anisotropic conducting foil (ACF), on the first sheet, and bonding at least a portion of the second sheet to the first sheet such that the conductive material is disposed between and in contact with the top-most metal layers of the first and second sheets. Separately fabricating the two sheets of different polarity may improve yields and/or decrease costs as compared to fabricating both polarities on a single substrate.

The present disclosure provides a display substrate and a manufacturing method thereof, and a display apparatus. The display substrate has a fingerprint identification region. The display substrate includes a base substrate; a display unit on the base substrate and including a display thin film transistor and a light-emitting device, a second electrode of the display thin film transistor being coupled to a first electrode of the light-emitting device; and a fingerprint identification unit at a gap between adjacent display units in the fingerprint identification region and including a fingerprint identification transistor and a photosensitive device, a first electrode of the fingerprint identification transistor being coupled to a second electrode of the photosensitive device. The display substrate further includes a gate insulating layer on a side of an active layer of the display thin film transistor and an active layer of the fingerprint identification transistor distal to the base substrate.

A display device having a biometric authentication function is provided. A highly convenient display device is provided. The display device includes a first substrate, a light guide plate, a plurality of first light-emitting elements, a second light-emitting element, and a plurality of light-receiving elements. The light guide plate includes a first portion having a first surface and a second portion having a second surface that connects with the first surface and has a different normal direction from the first surface. The first light-emitting elements and the light-receiving elements are provided between the first substrate and the light guide plate. The first light-emitting elements have a function of emitting first light through the light guide plate, and the second light-emitting element has a function of emitting second light to a side surface of the light guide plate. The light-receiving elements have a function of receiving the second light and converting the second light to an electric signal. The first light includes visible light, and the second light includes infrared light.

To provide an inspection device and an inspection method which are capable of detecting a disconnection defect in an organic TFT array and/or evaluating a variation in the output properties and response speed of each organic TFT element. There are provided a device and a method of optically measuring the presence or absence of the accumulation of carriers in an organic semiconductor thin film which provides a channel layer of an organic TFT element. A source and a drain in each organic TFT are short-circuited to each other, a voltage is turned on and turned off in a predetermined period between this and a gate, and images before and after application of the voltage are captured in synchronization with the predetermined period while radiating monochromatic light, to obtain a differential image.

The present invention proposes an array substrate and a method for fabricating the same. According to the array substrate and the method of fabricating the array substrate in the present invention, the IGZO pattern and the first electrode strip, the first channel, and the second metallic layer in the corresponding section form the first transistor of the CMOS inverter, and the OSC pattern and the second electrode strip, the second channel, and the second metallic layer in the corresponding section form the second transistor of the CMOS inverter. In this way, the CMOS inverter or the CMOS ring oscillator is fabricated based on IGZO and OSC.

A display device includes a first bank and a second bank spaced apart from each other on a substrate, at least one semiconductor layer disposed between the first bank and the second bank, a first electrode disposed on the first bank and electrically connected to a part of the at least one semiconductor layer, an organic functional layer disposed on another part of the semiconductor layer and comprising at least an organic light emitting layer, and a second electrode disposed on the organic functional layer.

A light emitting element includes a first electrode, a second electrode overlapping the first electrode, and an emission layer between the first electrode and the second electrode. The emission layer includes a quantum well that includes a first layer and a second layer, each having a different band gap. The first layer includes magnesium, and the second layer includes zinc. The first layer and the second layer are amorphous.

A photoelectric conversion element according to an embodiment of the present disclosure includes: a first electrode; a second electrode opposed to the first electrode; and an organic photoelectric conversion layer provided between the first electrode and the second electrode and formed using a plurality of materials having average particle diameters different from each other, the plurality of materials including at least fullerene or a derivative thereof, and a particle diameter ratio, of a first material having a smallest average particle diameter among the plurality of materials with respect to a second material having a largest average particle diameter among the plurality of materials, is 0.6 or less.

An imaging device includes at least one unit pixel cell including a photoelectric converter and a voltage application circuit. The photoelectric converter includes a first electrode, a light-transmitting second electrode, a first photoelectric conversion layer containing a first material and a second photoelectric conversion layer containing a second material. The impedance of the first photoelectric conversion layer is larger than the impedance of the second photoelectric conversion layer. The voltage application circuit applies a first voltage or a second voltage having a larger absolute value than the first voltage selectively between the first electrode and the second electrode.