A semiconductor device for electrostatic discharge (ESD) protection including a source, a gate, a drain having a drain diffusion, and a diffusion region extending from, or located under, the drain diffusion. The source, the gate, the drain and the diffusion region are located in or on a substrate. The diffusion region is laterally spaced from at least one of the gate or the outer edge of the drain diffusion.

Devices and methods are disclosed for facilitating faster switching of silicon-based and silicon carbide-based power transistors suitable for use in electric vehicles. The disclosed techniques can minimize the impact on turn-on and turn-off losses, while reducing gate voltage and drain voltage spikes during device switching. A fast/slow cell design incorporating shielded gate MOSFETs controls gate-to-drain capacitance and gate resistances to optimize suppression of voltage overshoot.

The present application relates to a semiconductor circuit, including a semiconductor device and a delay element. The semiconductor device includes a gate electrode and a field electrode in a field electrode trench. The delay element is electrically connected between the gate electrode and the field electrode. The delay element is configured to delay a charging of the field electrode compared to a charging of the gate electrode. A semiconductor die that includes the semiconductor circuit and a method of manufacturing the semiconductor die are also described.

Provided is a radiation-tolerant 3D unit MOSFET having at least one selected from a dummy drain (DD), an N-well layer (NW), a deep N-well layer (DNW), and a P+ layer to minimize an influence by a total ionization dose effect and an influence by a single event effect.

A semiconductor device includes a gate electrode disposed on a substrate. A source region and a drain region are disposed in the substrate and located on two sides of the gate electrode respectively. The drain region includes a plurality of drain segments that are laterally separated from each other. These drain segments have a first conductive type and the substrate has a second conductive type. A plurality of drain contacts is electrically connected to the drain segments. Each drain segment corresponds to at least one of these drain contacts. A drain electrode is electrically connected to these drain contacts. A source electrode is electrically connected to the source region.

A display device includes a substrate including a display area and a non-display area adjacent to the display area, a plurality of pixels being located in the display area, a driver located in the non-display area, a data line electrically connected to the driver to transmit a data signal to each of the plurality of pixels, a first driving voltage line and a second driving voltage line in the non-display area, and an antistatic portion in the non-display area and connected between the data line and the first driving voltage line. The display area further includes at least one first area electrically connected to one side of the driver and at least one second area electrically connected to another side of the driver. In addition, the non-display area includes a first non-display area corresponding to the first area and a second non-display area corresponding to the second area.

A semiconductor device includes a P-type body region and an N-type drift region disposed in a substrate; a gate electrode, disposed on the P-type body region and the N-type drift region, including a high concentration doping region and a high resistance region, wherein a dopant concentration of the high concentration doping region is higher than a dopant concentration of the high resistance region; a spacer disposed on a side of the gate electrode; a highly doped source region disposed in the P-type body region; and a highly doped drain region disposed in the N-type body region. The high concentration doping region overlaps the P-type body region, and the high resistance region overlaps the N-type drift region.

An IC device includes a first power terminal, an IO pad, a first ESD protection device coupled between the first power terminal and IO pad, a first trigger current source device coupled between the first power terminal and IO pad, and a semiconductor substrate over which the first ESD protection device and first trigger current source device are formed. The first ESD protection device includes a parasitic BJT having a collector and an emitter coupled between the IO pad and first power terminal, and a base coupled via a substrate resistance to a well tap coupled to the first power terminal. The first trigger current source device, in response to an ESD voltage on the IO pad, becomes conductive and causes discharge of the ESD voltage through the first ESD protection device to the first power terminal.

Devices and methods are disclosed for facilitating faster switching of silicon-based and silicon carbide-based power transistors suitable for use in electric vehicles. The disclosed techniques can minimize the impact on turn-on and turn-off losses, while reducing gate voltage and drain voltage spikes during device switching. A fast/slow cell design incorporating shielded gate MOSFETs controls gate-to-drain capacitance and gate resistances to optimize suppression of voltage overshoot.

A semiconductor ESD protection device includes a pair of source regions, a pair of gate structures, a drain region, a plurality of first conductive contacts, a plurality of second conductive contacts, a plurality of third conductive contacts, and a dummy structure. The pair of gate structures are disposed between the pair of source regions and extend along a direction. The drain region is disposed between the pair of gate structures. Each of the first conductive contacts is disposed on one of the pair of source regions and is arranged along the direction. Each of the plurality of second conductive contacts is disposed on one of the pair of gate structures. The plurality of third conductive contacts are disposed on the drain region and arranged along the direction. The dummy structure is disposed over the drain region and between the gate structures and between the third conductive contacts.