An LED device, particularly an LED lamp, includes pump LEDs and one or more phosphors allowing the lamp to emit both visible light and SWIR (short-wave infrared) useful in, for example, aviation safety. The emission spectrum of the phosphors provides SWIR light that has high transmission in air with a high water vapor concentration, making it suitable for use with SWIR cameras employed in aircraft. The layout of the LED device also delivers the sufficient visible flux required in aviation safety.

A system in a package (SIP) (195) includes carrier layer regions (107) that have a dielectric material with a metal post (109) therethrough, where adjacent carrier layer regions define a gap. A driver IC die (110) is positioned in the gap having nodes connected to bond pads (111) exposed by openings in a top side of a first passivation layer (113), with the bond pads facing up. A dielectric layer (116) is on the first passivation layer and carrier layer region (107) that includes filled through vias (116a) coupled to the bond pads and to the metal post (109). A light blocking layer (118) is on sidewalls and a bottom of the substrate. A first device (140) includes a light emitter that has first bondable features (151a). The light blocking layer blocks at least 90% of incident light. The first bondable features are flipchip mounted to a first portion of the bond pads.

A substrate, which has edges, a device region, and at least one bonding region, includes a base, device groups, signal line groups, and bridging parts. The device groups are located in the device region, and arranged along first and second directions. The signal line groups are located on the same side of the base as the device groups. A signal line group includes signal lines extending along the second direction, and arranged at intervals along the first direction. Any signal line extends from a bonding region on the device region, and is electrically connected to a column of device groups along the second direction. The bridging parts are located on the same side as the device groups. At least one bridging part is located in the device region. At least two signal lines in at least one signal line group are electrically connected together through a bridging part.

A display device includes: a substrate; a pixel circuit layer on the substrate; a first connection electrode and a second connection electrode on the pixel circuit layer; a first bump on the first connection electrode, and a second bump on the second connection electrode, the first bump and the second bump including materials having different elastic moduli; and a light-emitting element including a first electrode electrically connected to the first connection electrode and a second electrode electrically connected to the second connection electrode.

In accordance with one aspect of the present disclosure, there may be provided a light emitting device, including: a substrate; a plurality of light emitters disposed on an upper surface of the substrate to emit light; a first electrode disposed between the substrate and the plurality of light emitters and electrically connected to the plurality of light emitters; and a second electrode spaced apart from the substrate and electrically connected to the plurality of light emitters, wherein the first electrode and the second electrode are spaced apart from each other in an up and down direction by at least one of the plurality of light emitters, and extend while intersecting in the at least one light emitter when viewed from above.

An electronic device, including a circuit substrate, a light-absorbing layer, and an electronic component, is provided. The light-absorbing layer is disposed on the circuit substrate, and the light-absorbing layer includes an opening. The electronic component is disposed in the opening and is electrically connected to the circuit substrate. In a cross-sectional view of the electronic device, a profile of a sidewall of the opening has at least one arc-shaped edge, and an inclination angle between an extension line of the sidewall of the opening and a horizontal line is between 75 degrees and 105 degrees.

A micro LED array includes a plurality of micro LED structures, wherein each of the micro LED structure includes: a mesa structure; a first thermal conductive layer formed surrounding a sidewall of the mesa structure, wherein a material of the first thermal conductive layer is an electrically insulative material with high thermal conductivity; and a bottom connect structure provided at a bottom of the mesa structure to electrically connect the mesa structure to a bottom pad of an integrated circuit (IC) backplane.

A micro LED display panel includes an integrated circuit (IC) backplane including a bottom pad array and a micro LED array comprising a plurality of micro LED structures provided on the IC backplane, one micro LED structure of the plurality of micro LED structures being electrically connected with one bottom pad of the plurality of bottom pads. The micro LED structure includes a mesa structure; a first thermal conductive layer formed surrounding a sidewall of the mesa structure, a material of the first thermal conductive layer being an electrically insulative material with high thermal conductivity; and a second thermal conductive layer filled between adjacent ones of micro LED structures. The IC backplane further includes: one or more heat dissipation structures provided corresponding to an area outside the micro LED structure and passing thought the IC backplane to radiate heat to outside, wherein the heat dissipation structure and the bottom pad are separated.

A ceramic substrate including a ceramic plate, a seed layer arranged on an upper surface of the ceramic plate, a Cu layer arranged on an upper surface of the seed layer, an intermediate layer of one or more layers arranged on an upper surface of the Cu layer and a lateral surface of the Cu layer, and an Au layer arranged on an upper surface of the intermediate layer and a lateral surface of the intermediate layer. The upper surface of the seed layer and the intermediate layer contact each other. The upper surface of the ceramic plate and the Au layer do not contact each other. An edge portion of the upper surface of the seed layer is located outside an edge portion of a lower surface of the Cu layer in a horizontal direction.

Provided is a ultra-small light-emitting diode (LED) electrode assembly including a base substrate; an electrode line formed on the base substrate, and including a first electrode and a second electrode formed in a line shape to be interdigitated with each other while being spaced apart from each other; and at least one ultra-small LED device connected to the electrode line. A cross section of at least one of the first and second electrodes in a vertical direction has a height variation such that the first and second electrodes easily come in contact with the at least one ultra-small LED device.