Provided is a micro light emitting chip, which includes two sub-chips, an insulating structure, a first electrode, a second electrode, and a conductive element. The insulating structure is disposed between the two sub-chips to allow the two sub-chips to be electrically insulated from each other at the insulating structure. The first electrode and the second electrode are respectively connected to the two sub-chips and respectively have a first notch and a second notch. The conductive element is disposed between the first notch of the first electrode and the second notch of the second electrode, and electrically connected to the two sub-chips. A sum of orthogonal projection areas of the first electrode, the second electrode and the conductive element on a reference plane parallel to the two sub-chips is greater than or equal to 0.6 times an orthogonal projection area of the micro light emitting chip on the reference plane. Also provided are a micro light emitting chip structure and a display panel.

A display device includes a display panel in which a plurality of first pixel areas and a plurality of second pixel areas each including a plurality of sub pixels are defined; a pixel circuit which is disposed in each of the plurality of sub pixels and includes a driving transistor; and a welding transistor which selectively connects the pixel circuits of the first pixel area and a second pixel area which are adjacent to each other, among the plurality of first pixel areas and the plurality of second pixel areas. Accordingly, the welding transistor is used to further supply a driving current of the pixel circuit to the light emitting diode of an adjacent sub pixel to improve the luminance.

A method for transferring one or more clusters of micro-LEDs to a display panel includes fabricating or loading a plurality of micro-LED clusters comprising two or more micro-LEDs onto a substrate, and positioning the substrate in a first position. At least a first micro-LED cluster is aligned with at least a first electrical connector on a display panel. The method also includes lowering the substrate toward the display panel such that the first micro-LED cluster contacts the first electrical connector, and releasing the first micro-LED cluster from the substrate.

A display device is discussed. The Display device includes a plurality of semiconductor light-emitting elements on a substrate, wherein the substrate includes: a base substrate; an insulating layer on the base substrate; and pads protruding farther than the insulating layer and enabling the semiconductor light-emitting elements to in contact, wherein the insulating layer includes inorganic particles, and at least a portion of some of the inorganic particles is formed so as to protrude from a surface of the insulating layer.

The disclosure provides a semiconductor chip including a first semiconductor element, a second semiconductor element, a filling layer, a transparent conductive layer and a first metal layer. The second semiconductor element is adjacent to the first semiconductor element. The filling layer wraps the first semiconductor element and the second semiconductor element. The transparent conductive layer is disposed on the filling layer. The transparent conductive layer electrically connects the first semiconductor element and the second semiconductor element. The first metal layer is disposed under the filling layer and includes a first portion and a second portion. The first portion is electrically connected to at least one of the first semiconductor element and the second semiconductor element. The second portion is disposed on a side surface of the filling layer. The semiconductor chip of the disclosure is adapted to reduce a defect rate or power consumption.

The present disclosure can be applied to technical fields relating to display devices, and relates to a display device using, for example, a micro light-emitting diode (LED) and a manufacturing method therefor. The present disclosure, which is a display device using a semiconductor light-emitting element, may comprise: a wiring substrate; first electrodes defining unit sub-pixel regions and arranged on the wiring substrate; light-emitting elements having first type electrodes disposed on the first electrodes; a plurality of conductive balls electrically connecting the first type electrodes of the light-emitting elements with the first electrodes; and conductive adhesive parts located on the conductive balls to fix the conductive balls to the first electrodes and/or to the first type electrodes.

A packaging structure and a formation method thereof are provided. The packaging structure includes a base, a semiconductor element, a wrap layer, a cap layer, and an electrical connecting structure. The wrap layer is disposed on the base, covers the semiconductor element, and exposes the top surface of the semiconductor element. The cap layer is disposed on the wrap layer and the semiconductor element and includes a first and a second part. The first part is in contact with the semiconductor element. The second part is in contact with the wrap layer, wherein in measurement results of Fourier transform infrared spectroscopy, the ratio between maximum intensities at wavenumbers of 1060 cm.sup.1 to 1080 cm.sup.1 and 780 cm.sup.1 to 800 cm.sup.1 of the second part is greater than 0.65. The electrical connecting structure passes through the base and the wrap layer to electrically connect to the semiconductor element.

A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a plurality of protruding structures.

A multi-layer display including an upper substrate including light emitting diodes (LEDs) fabricated on a topside of the upper substrate, and LED bonding pads fabricated on a bottomside of the upper substrate. The LED bonding pads being electrically connected to the LEDs through vias extending through the upper substrate. The display also including a lower substrate including LED driver circuits and driver bonding pads fabricated on a topside of the lower substrate. The driver bonding pads being electrically connected to the LED driver circuits, where the LED bonding pads and driver bonding pads are aligned and electrically connected to each other, thereby electrically connecting the LED driver circuits to the LEDs.

A display device includes a base layer including a plurality of pad electrodes exposed through a surface of the base layer, a circuit board including a plurality of bump electrodes disposed on the base layer, and a base film in which a plurality of first grooves that expose the plurality of bump electrodes through the surface of the base layer are defined. The display device further includes a plurality of metal patterns electrically connecting the plurality of pad electrodes and the plurality of bump electrodes. Each of the plurality of metal patterns includes a first part disposed in the plurality of first grooves, and a second part disposed on the plurality of pad electrodes.