The invention is directed to methods of generating carbonate in situ in a use solution under an enriched CO.sub.2 atmosphere. In another aspect, the invention is directed to methods of cleaning food processing surfaces under an enriched CO.sub.2 atmosphere comprising contacting a food processing surface with a cleaning composition comprised of an alkalinity source, a surfactant, and water, monitoring the pH during the wash cycle and adjusting the pH by recirculating a use solution, adding a secondary alkalinity source, or both recirculating a use solution and adding a secondary alkalinity source, to generate carbonate in situ in the use solution. In a particular embodiment of the invention the alkalinity source is an alkali metal carbonate and the secondary alkalinity source is an alkali metal hydroxide.

The invention relates to a composition comprising a fatty acid-methyl ester component and an alcohol component, the composition being liquid at normal pressure at 20° C. and being immiscible with water. The invention further relates to a mixture containing crude oil, oil sludge and/or oil residues and the aforementioned composition. The invention also relates to a method for reducing the viscosity of crude oil, oil sludge and/or oil residues. The invention finally relates to a method for cleaning a surface from crude oil, oil sludge and/or oil residues.

There is provided a cleaning fluid that effectively removes metal impurities and the like existing on a portion through which a chemical solution for lithography passes, before causing the chemical solution to pass through a semiconductor manufacturing equipment in a lithography process, in order to prevent defects caused by the metal impurities and the like found on a semiconductor substrate after forming a resist pattern or after processing a semiconductor substrate in a process for manufacturing semiconductor device. A cleaning fluid to clean a portion through which a chemical solution for lithography passes in a semiconductor manufacturing equipment used in a lithography process for manufacturing semiconductors, including: an inorganic acid; water; and a hydrophilic organic solvent. In the cleaning fluid, the concentration of the inorganic acid is preferably 0.0001% by mass to 60% by mass based on a total mass of the cleaning fluid.

The use of a gel consisting of a colloidal solution comprising, preferably consisting of: 5% to 30% by weight, preferably 5% to 25% by weight, more preferably 8% to 20% by weight relative to the weight of the gel, of at least one inorganic viscosifying agent; a mineral base selected from among hydroxides of alkaline metals, hydroxides of alkaline-earth metals and the mixtures thereof, said mineral base being present in a proportion of 0.05 to 10 mol/L of gel, preferably in a proportion of 0.1 to 5 mol/L of gel; an oxidizing agent stable in a basic medium selected from among permanganates, persulfates, ozone, hypochlorites and the mixtures thereof, said oxidizing agent stable in a basic medium being present in a proportion of 0.05 to 5 mol/L of gel, preferably 0.1 to 2 mol/L of gel; 0.1% to 2% by weight relative to the weight of the gel, of at least one surfactant; and a solvent; the gel not containing any super-absorbent polymer, to remove a biofilm present on a surface of a solid substrate.

Provided is a method for removing a scale in a steam generation facility, whereby it becomes possible to remove a scale deposited on the inside of a boiler vessel during the operation of a boiler without causing corrosion of the boiler. A method for removing a scale in a steam generation facility is disclosed, wherein in the steam generation facility, a pH of boiler water is adjusted to 11.3 or more, and a polyacrylic acid having a weight average molecular weight that is 0.50 to 2.00 times a reference weight average molecular weight as calculated from the following calculation formula (1), or a salt thereof, is added in accordance with the pH value of the boiler water during the operation of a boiler, thereby removing a scale deposited on the inside of a boiler vessel:
Reference weight average molecular weight=−8462×{(pH value)−11.3}+61538  (1).

The invention relates to a non-corrosive degreasing concentrate and ready to use formulation. In particular, non-corrosive compositions capable of removing polymerized grease as effectively as some alkali metal hydroxide (i.e. caustic) based degreasers without requiring the use of personal protective equipment are disclosed.

A cleaner and method for maintaining bearings, bushings, linkage pins and chains used in various types of machinery, including industrial machinery is disclosed. The cleaner is effective to rejuvenate spent grease and includes a polar fraction, a miscible non-polar fraction, and a non-ionic surface activating agent.

Disclosed are inhibitor/cleaner compositions comprising alkyldiphenyloxide disulfonates, and methods of inhibiting corrosion of and removing schmoo from metal containments in contact with corrosive water sources. Also disclosed are metal containment assemblages comprising inhibitor/cleaner compositions and metal containment therefore. The alkyldiphenyloxide disulfonates are soluble or substantially soluble in the water sources and inhibit corrosion of the metal containments by the water sources containing corrodents. The alkyldiphenyloxide disulfonates also remove schmoo from the metal containments. The inhibitor/cleaners of the invention are useful for addition to produced waters and other corrosive water sources resulting from enhanced oil recovery operations. The inhibitor/cleaners inhibit corrosion of tanks, devices, and other metal containments such as carbon steel pipes which come into contact with produced waters from the oil recovery operations, while also providing schmoo reduction and removal from the metal containments. The inhibitor cleaners are also useful for addition to other corrosive aqueous fluids to inhibit corrosion of metal containments with which the aqueous fluids come into contact, such as corrosive aqueous discharge from mines and other industrial operations such as paper-making.

Provided is a cleaning solution including: water; a compound represented by general formula (1) below; a glycol ether solves in an amount of greater than 5 g in 100 g of water having a temperature of 25 degrees C., and a proportion of the glycol ether compound is 1 percent by mass or greater but 30 percent by mass or less, and wherein in general formula (1) below, R.sup.1 represents an alkyl group containing 1 or more but 4 or less carbon atoms. ##STR00001##

A composition is provided for the treatment of scaling and deposits due to naturally occurring radioactive material, said composition comprising one or more extractants that preferentially attract radioactive isotopes over other forms of alkaline earth cations A composition is further provided wherein said composition forms a polydentate ligand with one or more metals to act as carriers for radioactive elements. The composition comprises components that enhance stabilization of coordination complexation of the radioactive isotopes in the formation of polydentate ligands.