A working machine including front and rear wheels or a pair of endless tracks supporting a body. A first working arm with a first implement mount is connected to the body. An apparatus with a collector having a first opening and a sweeper trailing the collector is mounted to the first implement mount. A second implement mount connected to the body, and a milling device is mounted to the second implement mount. The sweeper is configured and arranged to move surface material broken up by the milling device into the collector via the first opening.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

A cleaning apparatus includes an end cap assembly for use with an agitator. The end cap assembly includes a stationary end cap, a rotating end cap, and a fragmentor. The stationary end cap is secured to and stationary with respect to a housing of the cleaning apparatus. The rotating end cap is coupled to the agitator and rotates with the agitator relative to the housing. The stationary and rotating end caps define a gap extending radially inward therebetween. The fragmentor is disposed within the gap and is configured to break debris which enters the gap into smaller pieces. The fragmentor may be disposed on a surface of the stationary end cap facing towards the rotating end cap and/or on a surface of the rotating end cap facing towards the stationary end cap. The fragmentor may include a cutting blade and/or an abrasive surface.

There is provided a contact cleaning surface (10), for a contact cleaning roller, configured to collect and/or remove contaminating particles from a contaminated substrate, including a frame defining a plurality of recessed cells (14), the frame having at least one wall defining the perimeter of each cell, the at least one wall having a pair of parallel opposing surfaces upstanding substantially perpendicularly from a base and terminating in a contact surface configured to contact the contaminated substrate, the at least one wall having a cross-sectional area that is substantially the same between said base and said contact surface. There is also provided a contact cleaning and an apparatus, each configured to collect and/or remove contaminating particles from a contaminated substrate, and method of collecting and/or removing contaminating particles from a contaminated substrate.

A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.

A cleaning device for a hemming roller cleans the hemming roller of a hemming roller unit mounted on an arm tip of a hemming robot. The cleaning device includes: a support frame installed on a floor of a workshop; a roller rotation unit that is installed on an upper surface of the support frame and rotates the hemming roller that has entered the upper surface of the support frame through the hemming robot; and a scraper that is installed to be movable back and forth on the support frame while facing the roller rotation unit and removing foreign substances on the surface of the hemming roller.

The Pro Sponge Rejuvenator is sponge cleaner for cleaning a plurality of used sponges, comprising: a liquid-tight container in which stems which extend from a platform toward a bottom of the container are oscillate-able to rub the sponges against the bottom by an oscillation means connected to the platform and supported by the bottom. The Pro Sponge Rejuvenator cleans sponges using a cleaning solution that is filtered with every sponge cleaning oscillation up/down stroke of the apparatus through the use of one-way flow valves under the sponges and a central tube with filter media. The Pro Sponge Rejuvenator is ideal for cleaning sponges and especially cosmetics makeup sponges.

A substrate cleaning apparatus includes a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces, a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces, and a rotation driving part to rotate the porous suction part.

The present disclosure provides a nozzle cleaning device, a doctor blade replacing apparatus and a doctor blade replacing method. The doctor blade replacing apparatus includes a first doctor blade box, a second doctor blade box, a transferring assembly and a clamping and conveying mechanism. The transferring assembly includes a first tray which is disposed between the first doctor blade box and the second doctor blade box and a pushing assembly which is configured to push the first doctor blade in the first doctor blade box to the first tray and push the second doctor blade on the first tray into the second doctor blade box. The clamping and conveying mechanism is disposed between the first tray and the nozzle cleaning device for clamping and conveying the first doctor blade and the second doctor blade between the first tray and the nozzle cleaning device.

The present application provides a cleaning base station, including a base, a cleaning tank for cleaning wipers, and a first sewage tank for storing sewage. The cleaning tank is arranged in the base, an entrance is arranged on the base for a cleaning robot to enter the cleaning tank, a side of the base is defined with an opening configured for allowing the cleaning tank to be taken out, and the first sewage tank is connected to the cleaning tank. In the cleaning base station, by connecting the first sewage tank to the cleaning tank, and defining an opening on the side of the base, when cleaning the first sewage tank and the cleaning tank and taking out the cleaning tank from the base, the first sewage tank is disassembled to take out the cleaning tank and the first sewage tank at one time.