A method for cleaning the mop of a cleaning robot includes: obtaining mop usage information after the cleaning robot carries the mop to clean the floor, and selecting a target mop cleaning mode to clean the mop according to the mop usage information.

A grinding wheel includes an annular base and a plurality of abrasive members fixed to the lower surface of the base and arranged annularly. The base has a plurality of through holes for discharging a grinding water. The plural through holes radially extend from the inner side surface to the outer side surface of the base. The plural through holes are arranged at given intervals in the circumferential direction of the base so that the grinding water is scattered in different directions from the through holes.

A method for cleaning a brush includes inducing a static charge on a surface of a first plate, wherein the first plate comprises at least one of silicon nitride (Si.sub.xN.sub.y) or silicon oxide (Si.sub.aO.sub.b), wherein a, b, x and y are integers. The method further includes rotating the brush in contact with the surface of the first plate.

A cleaning apparatus includes an end cap assembly for use with an agitator. The end cap assembly includes a stationary end cap, a rotating end cap, and a fragmentor. The stationary end cap is secured to and stationary with respect to a housing of the cleaning apparatus. The rotating end cap is coupled to the agitator and rotates with the agitator relative to the housing. The stationary and rotating end caps define a gap extending radially inward therebetween. The fragmentor is disposed within the gap and is configured to break debris which enters the gap into smaller pieces. The fragmentor may be disposed on a surface of the stationary end cap facing towards the rotating end cap and/or on a surface of the rotating end cap facing towards the stationary end cap. The fragmentor may include a cutting blade and/or an abrasive surface.

A substrate cleaning apparatus includes a substrate holding unit, a brush, an arm, a discharge portion and a guide member. The substrate holding unit is configured to hold a substrate rotatably. The brush has a main body, a cleaning body provided at a lower portion of the main body and configured to be pressed onto the substrate, and a hollow portion formed in the main body and provided with an open top and an open bottom. The arm is configured to rotatably support the main body with a spindle therebetween. The discharge portion is provided at the arm, and plural kinds of processing liquids are discharged from the discharge portion while being switched. The guide member is provided between the discharge portion and the brush, and is configured to receive the processing liquid discharged from the discharge portion and guide the received processing liquid into the hollow portion.

A cleaning apparatus includes an end cap assembly for use with an agitator. The end cap assembly includes a stationary end cap, a rotating end cap, and a fragmentor. The stationary end cap is secured to and stationary with respect to a housing of the cleaning apparatus. The rotating end cap is coupled to the agitator and rotates with the agitator relative to the housing. The stationary and rotating end caps define a gap extending radially inward therebetween. The fragmentor is disposed within the gap and is configured to break debris which enters the gap into smaller pieces. The fragmentor may be disposed on a surface of the stationary end cap facing towards the rotating end cap and/or on a surface of the rotating end cap facing towards the stationary end cap. The fragmentor may include a cutting blade and/or an abrasive surface.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

In a cleaner apparatus for steel plate provided with a brush roll 1 driven to rotate to remove foreign matter D from a surface Wa of a steel plate W to be conveyed, a magnet bar 3 to attract iron powder d among the foreign matter D stuck to the brush roll 1 by magnetic force, a wiping cloth 5 disposed between the brush roll 1 and the magnet bar 3 to remove the foreign matter D attracted by the magnet bar 3; the wiping cloth 5 of belt shape is disposed parallel to an axis L.sub.1 of the brush roll 1.

In a method for determining cleanliness of a cleaning member that contacts a substrate and with which scrub cleaning is performed, the method includes a first step of self-cleaning a cleaning member by releasing contaminants from the cleaning member into a cleaning liquid, and a second step of bringing a self-cleaning discharged liquid into contact with an electrode of a crystal oscillator, attaching the contaminants contained in the discharged liquid onto the electrode of the crystal oscillator, then measuring a frequency response of the crystal oscillator in which the contaminants are attached onto the electrode, and determining cleanliness of the cleaning member based on the measured frequency response.

A system for cleaning a surface of a substrate includes a cleaning element including a resilient compressible material. A liquid source provides liquid directly to the cleaning element, and a squeezing roller engages the cleaning element and applies pressure thereto, to squeeze out excess liquid from said resilient compressible material. A counter element opposes said cleaning element such that the substrate is disposed between the counter element and the cleaning element. The substrate moves between the counter element and the cleaning element such that a surface of the cleaning element, having a suitable amount of liquid absorbed therein, engages and cleans the surface of the substrate without damaging the substrate.