What is presented and described is a method for avoiding the microbial attack of a cleaning apparatus (X2), in particular a cleaning apparatus (X2) for a metering system, wherein the cleaning apparatus (X2) has at least one mechanical cleaning element (X29) with at least one cleaning surface (X31), wherein the method is characterized in that the at least one cleaning surface (X31) of the at least one mechanical cleaning element (X29) is exposed, at least temporarily, to an oxidizing agent. The present invention further relates to a method for cleaning a metering system, in particular for a dispersion, especially a paint-metering system, to a cleaning apparatus, and to a metering system.

A mobile device comprising: a display; a first sensor to detect a cloth approaching a surface of the display; an ultrasonic emitter to emit ultrasonic waves towards the cloth; a second sensor to track a pressure a user exerts on the surface of the display; and a processing unit to: determine if the material of the cloth is hard or soft; in response to the material being hard, alert the user that the cloth is not appropriate to clean the surface of the display; and alert the user that the entire display was not cleaned with the cloth.

Disclosed are a nozzle unit and a robot cleaner including same. The nozzle unit according to various embodiments of the present invention comprises a main brush for collecting waste such as hair and a sub brush for separating the waste such as hair attached to the main brush. The sub brush is provided with various members according to the embodiment, and separates the waste such as hair attached to the main brush. Thus, the waste such as hair can be easily collected, separated, and captured. Accordingly, user convenience can be enhanced.

A coater machine, a coater system and a cleaning method of the coater machine are provided. The coater machine includes: a coating platform including a working surface; and a first cleaner device configured to move relative to the working surface to remove a foreign matter on the working surface.

A cleaning mechanism is installed on a cleaning device. The cleaning mechanism is used to clean a work area under control of the cleaning device. A cleaning control method for the cleaning mechanism includes: obtaining a cleaning start time of the cleaning device; obtaining a cleaning duration of the cleaning mechanism; determining a cleaning time of the cleaning mechanism based on the cleaning start time and the cleaning duration, the cleaning time being before the cleaning start time; and controlling the cleaning device to clean the cleaning mechanism when the time reaches the cleaning time. A cleaning control apparatus and a computer-readable storage medium are also disclosed.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Devices and processes for axial disentanglement of debris from a rotatable mechanical agitator generally includes a cleaning member including a top stem portion, an intermediate cutting portion, and a bottom base portion; and a cylindrically-shaped mechanical agitator rotatably mounted within a head unit. The mechanical agitator includes one or more channels extending along a longitudinal axis and the head unit includes a slot opening coaxially aligned with a channel when in use. The bottom base portion and the intermediate cutting portion are configured to traverse a length of the one or more channels, wherein the intermediate cutting portion is positioned to cut debris entangled on the mechanical agitator when the top stem portion slidingly engages the slot opening in the head unit.

Embodiments of the present disclosure are directed to additive manufacturing apparatuses, cleaning stations incorporated therein, and methods of cleaning using the cleaning stations.

In a cleaner apparatus for steel plate provided with a brush roll 1 driven to rotate to remove foreign matter D from a surface Wa of a steel plate W to be conveyed, a magnet bar 3 to attract iron powder d among the foreign matter D stuck to the brush roll 1 by magnetic force, a wiping cloth 5 disposed between the brush roll 1 and the magnet bar 3 to remove the foreign matter D attracted by the magnet bar 3; the wiping cloth 5 of belt shape is disposed parallel to an axis L.sub.1 of the brush roll 1.

Apparatus (10) for automatically removing an exhausted layer of adhesive material from an adhesive roll (12), said apparatus comprising an adhesive roll (12) comprising at least one layer of adhesive material (22), said at least one adhesive layer having first and second mutually opposing faces, said second face releasably attached to said adhesive roll and having a first adhesion force between said second face and an said adhesive roll; and an adhesive layer removal mechanism (14) comprising an outer surface arranged to operably engage said at least one layer of adhesive material of said adhesive roll and remove the same from said adhesive roll, said outer surface having a second adhesion force between said outer surface and said at least one layer of adhesive material, wherein said second adhesion force is greater than the first adhesion force.