Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.

A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.

Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.

A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.

A MEMS device including a fixed member and a movable member supported via a resilient body. The MEMS device includes an impact alleviation mechanism provided at a position where the movable member and the fixed member collide during operation. The impact alleviation mechanism includes a stopper provided to either the fixed member or the movable member and that protrude to be parallel between sides of the two members with at least one side edge fixed to the respective member. Moreover, the impact alleviation mechanism includes an elongate protruding member provided on the other of the fixed member and the movable member. The elongate protruding member and the stopper are configured such that as collision force increases between the movable member and the fixed member during operation, an abutment area of an outer edge position of the elongate protruding member approaches the fixed side edge of the stopper.

Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.

A MEMS microphone includes a substrate having a cavity, a back plate provided over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, and spaced apart from the substrate and the back plate, a strut located at outer side of the diaphragm, having a lower surface in contact with an upper surface of the substrate and being integrally formed with the upper insulation layer to support the upper insulation layer to space the upper insulation layer from the diaphragm, and a bending prevention member provided on an upper surface of the back plate for preventing the back plate from being bent.

A microelectromechanical device includes a semi-flexible proof-mass comprising a primary part, a secondary part and a stiff spring suspending the primary part and the secondary part. The spring causes the parts to move as a single entity when the device is in its normal range. A first stopper structure stops the primary part. The proof-mass is configured to deform through deflection of the spring, when the device is subjected to a shock having a force that is beyond the normal operation range. While the shock causes motion of the proof-mass in one direction along an axis of movement, the spring is configured to cause a restoring force causing the secondary part of the proof-mass to be driven into a restoring motion in a direction opposite to motion along an axis caused by the shock. Momentum of the secondary part causes the primary part to dislodge from the first stopper structure.

A microelectromechanical component including, vertically at a distance from one another, a substrate device, a first, a second, and a third functional layer, a vertical stop being formed between the second and third functional layer, the vertical stop having a stop area on a surface of the second functional layer facing the third functional layer, wherein the second functional layer is connected to the first functional layer in a connecting area allocated to the stop area.

Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.