The present inventions, in one aspect, are directed to micromachined resonator comprising: a first resonant structure extending along a first axis, wherein the first axis is different from a crystal axis of silicon, a second resonant structure extending along a second axis, wherein the second axis is different from the first axis and the crystal axis of silicon and wherein the first resonant structure is coupled to the second resonant structure, and wherein the first and second resonant structures are comprised of silicon (for example, substantially monocrystalline) and include an impurity dopant (for example, phosphorus) having a concentrations which is greater than 10.sup.19 cm.sup.-3, and preferably between 10.sup.19 cm.sup.-3 and 10.sup.21 cm.sup.-3.

A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.

A method for manufacturing a micromechanical sensor. The method includes: applying a first oxide sacrificial layer onto a substrate; removing material of the substrate through openings in the first oxide sacrificial layer; closing the openings in the first oxide sacrificial layer by applying a second oxide sacrificial layer; forming a sensing area on a carrier structure, the sensing area and the carrier structure being formed on the oxide sacrificial layers and the sensing area and/or the carrier structure being connected to the substrate via at least one attachment area, which forms a flexible structure; and at least partially removing the oxide sacrificial layers between the carrier structure and the substrate with the aid of an etching process.

A microrobot is disclosed. The microrobot includes a magnet configured to provide a motive force when magnetic force of one or more electrical coils act upon the magnet, a support member coupled to the magnet, a thermo-responsive polymer member coupled to each end of the support member at a proximal end, the thermo-responsive polymer member configured to articulate when heated, wherein the thermo-responsive polymer members configured to receive light from a microrobot structured light system and convert the received light into heat.

Microelectronic structure comprising at least one movable mass that is mechanically connected to a first mechanical element by a first mechanically linking connector and to a second mechanical element (24) by electrically conductive second mechanically linking connector, and a device for electrically biasing the second mechanically linking connector, the second mechanically linking connector being such that they are the seat of a thermo-piezoresistive effect, the second linking connector and the movable mass being placed with respect to each other so that a movement of the movable mass applies a mechanical stress to the second linking connector, wherein the electrically biasing device are DC voltage biasing device and form, with at least the second mechanically linking connector, a thermo-piezoresistive feedback electric circuit.

The present invention discloses an optical MEMS based intracranial pressure (ICP) and intracranial temperature (ICT) monitor, comprising: a broadband light source, a tunable optical filter (TOF), an optical etalon, a plurality of optical receivers, a plurality of optical couplers, and a probe; wherein the probe comprises an ICP sensor and an ICT sensor; ICP is obtained by a depression wavelength of a reflection spectrum of the ICP sensor, the depression wavelength is obtained by comparing with a periodic spectrum with an absolute wavelength mark of an optical etalon; and ICT is obtained by a peak wavelength of a reflection spectrum of the ICT sensor, the peak wavelength is obtained by comparing with a periodic spectrum with an absolute wavelength mark of an optical etalon. The present application can precisely monitor ICP and ICT.

A microrobot is disclosed. The microrobot includes a magnet configured to provide a motive force when magnetic force of one or more electrical coils act upon the magnet, a support member coupled to the magnet, a thermo-responsive polymer member coupled to each end of the support member at a proximal end, the thermo-responsive polymer member configured to articulate when heated, wherein the thermo-responsive polymer members configured to receive light from a microrobot structured light system and convert the received light into heat.

The invention relates to an amplifier unit for a MEMS sound transducer, which is operable as a microphone and as a loudspeaker, comprising at least one audio amplifier for sound reproduction and/or sound recording. According to the invention, the amplifier unit is designed in such a way that the MEMS sound transducer provided therefor is simultaneously operable as a loudspeaker and as a microphone. Moreover, the invention relates to sound-generating unit comprising a MEMS sound transducer, which is operable as a microphone and as a loudspeaker, and an amplifier unit coupled to the sound transducer for sound reproduction and/or sound recording.

The switch contacts of a MEMS relay for a circuit interrupter are coated with a thin layer of liquid metal, and the MEMS relay is disposed in a sealed enclosure containing a gas medium. The gas medium provides an environmentally desirable alternative to sulfur hexafluoride (SF.sub.6), prevents oxidation of the liquid metal coating the relay switch contacts, and has sufficient dielectric strength in order to prevent current flow after separation of the switch contacts.

A sensor unit includes: a substrate; a first sensor module that is disposed at the substrate and that includes a first acceleration sensor; and a second sensor module that is disposed at the substrate and includes a second acceleration sensor, in which the first sensor module and the second sensor module are arranged to be adjacent to each other at one surface side of the substrate, the first acceleration sensor is eccentrically disposed at the second sensor module side in the first sensor module, and the second acceleration sensor is eccentrically disposed at the first sensor module side in the second sensor module.