The invention provides a micro-electro-mechanical system device including: a substrate; a proof mass, including an outer frame which inwardly defines an internal space, and at least one inner extension portion which is directly connected to the outer frame and inwardly extends from the outer frame; at least one compliant structure, located in the internal space, and directly connected to the corresponding inner extension portion; an anchor, located in the internal space and directly connected to the at least one compliant structure, the anchor being connected to the substrate; movable electrodes, located in the internal space and connected to the proof mass; and fixed electrodes, respectively located in correspondence to the movable electrodes, and being connected to the substrate through fixing portions.

A nano-electromechanical switch and a method for designing a nano-electromechanical switch. The nano-electromechanical switch includes at least one actuator electrode and a curved cantilever beam. The curved cantilever beam is adapted to flex in response to an activation voltage applied between the actuator electrode and the curved cantilever beam to provide an electrical contact between the curved cantilever beam and an output electrode of the nano-electromechanical switch. Before, during and after the curved cantilever beam flex in response to the activation voltage, a remaining gap between the curved cantilever beam and the actuator electrode is uniform.

A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.

A system and method for forming a sensor device includes defining an in-plane electrode in a device layer of a silicon on insulator (SOI) wafer, forming an out-of-plane electrode in a silicon cap layer located above an upper surface of the device layer, depositing a silicide-forming metal on a top surface of the silicon cap layer, and annealing the deposited silicide-forming metal to form a silicide portion in the silicon cap layer.

A micromechanical structure, comprising a substrate having a through hole; a residual portion of a sacrificial oxide layer peripheral to the hole; and a polysilicon layer overlying the hole, patterned to have a planar portion; a supporting portion connecting the planar portion to polysilicon on the residual portion; polysilicon stiffeners formed extending beneath the planar portion overlying the hole; and polysilicon ribs surrounding the supporting portion, attached near a periphery of the planar portion. The polysilicon ribs extend to a depth beyond the stiffeners, and extend laterally beyond an edge of the planar portion. The polysilicon ribs are released from the substrate during manufacturing after the planar region, and reduce stress on the supporting portion.

According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter of the second electrode, and a mechanical support separate from the anchor at the perimeter of the second electrode and mechanically connected to the first electrode and the second electrode. The mechanical support is fixed to a portion of the second electrode such that, during operation, a maximum deflection of the second electrode occurs between the mechanical structure and the perimeter of the second electrode.

A component for a micromechanical system has an upper side and a lower side disposed opposite the upper side and includes at least one first structural element that is arranged in a first region of the component and bounded by at least one first gap and at least one second structural element that is arranged in a second region of the component different from the first region and bounded by at least one second gap. The first region includes a first cutout in the lower side of the component, wherein a first thickness of the component in the first region is reduced in the second region with respect to a second thickness of the component. A minimal second gap width of the at least one second gap is larger than a minimal first gap width of the at least one first gap.

An electromechanical system includes a frame; an element movable relative to the frame, the movable element comprising a membrane and a rigidifying structure for the membrane; a capacitive measurement or actuation device; a first transmission device for a movement between the movable element and the capacitive measurement or actuation device, the first transmission device being rotatably movable relative to the frame by a plurality of first pivot hinges; in which system: a first opening is arranged in the movable element; the frame includes a first island extending into the first opening; and the first transmission device is connected to the first island via one of the first pivot hinges.

An electromechanical system includes a frame; a movable element; a capacitive measurement or actuation system including a first movable electrode and at least one electrode separated from the first movable electrode by a first dielectric medium; a first transmission device for transmitting movement between the movable element and the first movable electrode, the first transmission device being rotatably movable relative to the frame by a plurality of first pivot hinges; the first transmission device including a first transmission shaft having a first longitudinal axis of rotation; and a plurality of first transmission arms, each of the first transmission arms including a first end coupled to the movable element and a second end secured to the first transmission shaft; the first movable electrode being connected to the first transmission shaft.

A piezoelectric microelectromechanical systems microphone is provided comprising a sensor, an anchor region at which the sensor is supported by a substrate, a first region of the sensor adjacent to the anchor region having a first compliance, the first region having at least one piezoelectric layer and at least one electrode, and a second region of the sensor, the second region being adjacent to the first region, having at least one piezoelectric layer and at least one electrode, and having a second compliance, the first and second compliances being different. A method for manufacturing a piezoelectric microelectromechanical systems microphone is also provided.