B81B3/0083

System and method for an optical MEMS transducer
10715930 · 2020-07-14 · ·

According to an embodiment, an optical MEMS transducer includes a diffraction structure including alternating first reflective elements and openings arranged in a first plane, a reflection structure including second reflective elements and configured to deflect with respect to the diffraction structure, and an optical element configured to direct a first optical signal at the diffraction structure and the reflection structure and to receive a second optical signal from the diffraction structure and the reflection structure. The second reflective elements are arranged in the first plane when the reflection structure is at rest. Other embodiments include corresponding systems and apparatus, each configured to perform various embodiment methods.

Integrated MEMS switches for selectively coupling light in and out of a waveguide

A steerable optical transmit and receive terminal includes a MEMS-based N1 optical switch network. Each optical switch in the optical switch network uses an electrostatic MEMS structure to selectively position a translatable optical grating close to or far from an optical waveguide. In the close (ON) position, light couples between the translatable optical grating and the optical waveguide, whereas in the far (OFF) position, no appreciable light couples between the translatable optical grating and the optical waveguide. The translatable optical grating is disposed at or near a surface of the optical switch network. Thus, the translatable optical grating emits light into, or receives light from, free space. The steerable optical transmit and receive terminal also includes a lens and can steer a free space optical beam in a direction determined by which port of the N1 optical switch network is ON.

Micro-electro-mechanical device with a movable structure, in particular micromirror, and manufacturing process thereof

A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

MICROELECTROMECHANICAL (MEMS) FABRY-PEROT INTERFEROMETER, APPARATUS AND METHOD FOR MANUFACTURING FABRY-PEROT INTERFEROMETER
20200124475 · 2020-04-23 ·

A microelectromechanical (MEMS) Fabry-Perot interferometer includes a transparent substrate; a first metallic mirror structure on the transparent substrate, including a first metal layer and a first support layer; a second metallic mirror structure above the first metallic mirror structure on an opposite side of the first metallic mirror structure in view of the transparent substrate, the second metallic mirror structure including a second metal layer and a second support layer, wherein the first and the second support layer are parallel and including at least one of aluminum oxide or titanium dioxide; a Fabry-Perot cavity between the first and the second support layer, whereby the Fabry-Perot cavity is formed by providing an insulation layer on the first mirror structure, and at least partially removing the insulation layer after providing the second mirror structure; and electrodes for providing electrical contacts to the first and the second metal layer.

OLED device, brightness adjustment method thereof and display device
10629657 · 2020-04-21 · ·

An organic light-emitting diode (OLED) device, a brightness adjustment method thereof and a display device are provided. The OLED device includes: an OLED substrate provided with at least one OLED element; a package structure configured to form a closed space with the OLED substrate; and an external compensation component including at least one photosensitive sensor and at least one compensation adjustment unit. The at least one photosensitive sensor is configured to detect the light intensity emitted by the at least one OLED element; and the at least one compensation adjustment unit is provided on a side wall on a light-emitting side of the package structure facing the closed space and configured to adjust light intensity emitted by the at least one OLED element according to a detected signal by the at least one photosensitive sensor.

MEMS ELEMENT AND OPTICAL APPARATUS USING THE SAME
20200116942 · 2020-04-16 ·

A MEMS element includes a substrate 200, a fixing portion 2 provided at the substrate 200, first and second actuators 3, 4 provided at the fixing portion, a drive target member 7 coupled to the first and second actuators 3, 4, a third actuator 9 provided at the fixing portion 2, and a restriction member 10 coupled to the third actuator. The first and second actuators 3, 4 drive the drive target member 7 in a direction parallel to or crossing an upper surface of the substrate 200. The third actuator 9 drives the restriction member 10 in a direction crossing a movement direction of the drive target member 7 to position the restriction member 10 within a movement plane of the drive target member 7 such that the restriction member 10 restricts displacement of the drive target member 7.

Piezoelectric mirror system

A piezo MEMS mirror system that includes a drive system that drives a piezo MEMS mirror that generates an image on a portable device display. The drive system includes a DC-AC converter that operates to convert the DC power provided by the battery to AC power. The DC-AC converter may generate the AC power having a peak voltage that is at an intermediate levelbeing between the DC voltage of the battery, and the peak AC voltage generated by the drive system. The drive system also includes an output filter that uses a series-coupled inductance system (perhaps inductively coupled inductors in a differential mode circuit) in conjunction with a capacitance of the piezo MEMS mirror (and perhaps tuning capacitors to account for mirror fabrication deviations) to amplify the AC voltage of the AC power at a mechanical resonant frequency of the piezo MEMS mirror.

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING A SEMICONDUCTOR DEVICE
20200062586 · 2020-02-27 ·

A method of producing a semiconductor device includes providing a carrier structure having a semiconductor substrate; applying or introducing a precursor substance onto or into the carrier structure, treating the precursor substance for producing a porous matrix structure; introducing a functionalization substance into the porous matrix structure.

Integrated MEMS Switches for Selectively Coupling Light In and Out of a Waveguide

A steerable optical transmit and receive terminal includes a MEMS-based N1 optical switch network. Each optical switch in the optical switch network uses an electrostatic MEMS structure to selectively position a translatable optical grating close to or far from an optical waveguide. In the close (ON) position, light couples between the translatable optical grating and the optical waveguide, whereas in the far (OFF) position, no appreciable light couples between the translatable optical grating and the optical waveguide. The translatable optical grating is disposed at or near a surface of the optical switch network. Thus, the translatable optical grating emits light into, or receives light from, free space. The steerable optical transmit and receive terminal also includes a lens and can steer a free space optical beam in a direction determined by which port of the N1 optical switch network is ON.

Techniques for removing particulate from an optical surface

The present disclosure generally relates to a method, and apparatus implementing the method for removing particulate accumulation from an optical element of a micro electromechanical systems (MEMS) package. The method may select a cleaning mode based, at least in part on, one or more of output of a sensor or a maintenance routine. Cleaning modes may include actuating, using an actuator of the MEMS package, one of a plurality of motion modes across the optical element. Optionally, the cleaning mode may include applying, using a power source of the MEMS package, a charge to the optical element. The disclosed techniques may enable the MEMS package to automatically and dynamically remove particulate matter without introducing additional mechanical elements.