A MEMS device includes a plurality of ribbon elements, a securing portion, and a plurality of connecting portions. The securing portion supports the plurality of ribbon elements. The plurality of connecting portions are disposed on ends of each of the plurality of ribbon elements and connect each of the plurality of ribbon elements to the securing portion. An angle formed by a longitudinal extending line of each of the plurality of ribbon elements and each of the plurality of connecting portions is greater than 0 in a planar direction of each of the plurality of ribbon elements.

A method of producing a semiconductor device includes providing a carrier structure having a semiconductor substrate; applying or introducing a precursor substance onto or into the carrier structure, treating the precursor substance for producing a porous matrix structure; introducing a functionalization substance into the porous matrix structure.

A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.

An MEMS optical microphone, including: a case, a membrane, a waveguide plate, a variable optical waveplate, an optoelectronic module, and an IC module. The case includes a cavity and a sound inlet. The membrane is suspended in the cavity and closes the sound inlet. The waveguide plate is suspended in the cavity and located at a side of the membrane away from the sound inlet. The optoelectronic module includes an electromagnetic radiation source and a sensing part provided at two opposite sides of the waveguide plate, respectively. The variable optical waveplate is configured to convert an input polarization state of the first light path into an output polarization state, which varies as a moving distance of the variable optical waveplate. The IC module is electrically connected to the membrane and the optoelectronic module. It has advantages such as high sensitivity, flat frequency response, thereby further improving the device performance.

A MEMS optical device including: a semiconductor body; a main cavity, which extends within the semiconductor body; a membrane suspended over the main cavity; a piezoelectric actuator, which is mechanically coupled to the membrane and can be electronically controlled so as to deform the membrane; a micro-lens, mechanically coupled to the membrane so as to undergo deformation following the deformation of the membrane; and a rigid optical element, which contacts the micro-lens and is arranged so that the micro-lens is interposed between the rigid optical element and the membrane. The micro-lens and the main cavity are arranged on opposite sides of the membrane.

An optical light package includes an optical output lens, an optical filter located thereunder and between the output lens and LEDS, a tray of LEDs arrayed on a stage mounted on a linear comb based MEMS device that is distributed in such a way that the stage is movable, and a driver that controls movement of the stage.

A gas sensor, a method of manufacturing a gas sensor, a method for fabricating a micro electro-mechanical system (MEMS) die for a heater or thermopile, and a micro electro-mechanical system (MEMS) die for a heater or thermopile. The gas sensor comprises a first micro electro-mechanical system (MEMS) die comprising a light source; a second MEMS die comprising a light detector; a sample chamber disposes in an optical path between the light source and the light detector; and a holder substrate; wherein the first and second MEMS dies are disposed on the holder substrate in a vertical orientation relative to the holder.

A steerable optical transmit and receive terminal includes a MEMS-based N1 optical switch network. Each optical switch in the optical switch network uses an electrostatic MEMS structure to selectively position a translatable optical grating close to or far from an optical waveguide. In the close (ON) position, light couples between the translatable optical grating and the optical waveguide, whereas in the far (OFF) position, no appreciable light couples between the translatable optical grating and the optical waveguide. The translatable optical grating is disposed at or near a surface of the optical switch network. Thus, the translatable optical grating emits light into, or receives light from, free space. The steerable optical transmit and receive terminal also includes a lens and can steer a free space optical beam in a direction determined by which port of the N1 optical switch network is ON.

The present disclosure generally relates to a method, and apparatus implementing the method for removing particulate accumulation from an optical element of a micro electromechanical systems (MEMS) package. The method may select a cleaning mode based, at least in part on, one or more of output of a sensor or a maintenance routine. Cleaning modes may include actuating, using an actuator of the MEMS package, one of a plurality of motion modes across the optical element. Optionally, the cleaning mode may include applying, using a power source of the MEMS package, a charge to the optical element. The disclosed techniques may enable the MEMS package to automatically and dynamically remove particulate matter without introducing additional mechanical elements.

This invention describes the structure and function of an integrated multi-sensing system. Integrated systems described herein may be configured to form a microphone, pressure sensor, gas sensor or accelerometer. The system uses Fabry-Perot Interferometer in conjunction with beam collimator, beam splitter, optical waveguide and a photodetector integrated. It also describes a configurable method for tuning the integrated system to specific resonance frequency using electrostatic actuators.