In one or more embodiments, an apparatus generally comprises a microelectromechanical system (MEMS) module comprising a plurality of air movement cells and a power unit operable to control the plurality of air movement cells, and a housing configured for slidably receiving the MEMS module and positioning the MEMS module adjacent to a heat generating component of a network device. The MEMS module is operable to dissipate heat from the heat generating component and is configured for online installation and removal during operation of the heat generating component.

An accelerometer includes an enclosure coupled to one or more mechanical interposers. The interposers are configured to couple the enclosure to a magnetic assembly and the magnetic assembly is configured to couple to a proof mass. The accelerometer may include electrical circuitry having a torquer coil coupled to the proof mass, where the electrical circuitry may be configured to generate an electrical signal based on an acceleration of the accelerometer. Orienting the coupling of the of the enclosure to the magnetic assembly, temperature strain on the accelerometer may be relieved.

A MEMS micromirror device comprising, a reflective movable mirror and an underlying substrate. A viscous liquid or gel is located between the movable mirror and substrate.

A method for fabricating a micro-electronics H-frame device is provided by micro-machining a top cover usable in the device, and micro-machining a bottom cover usable in the device. The method includes fabricating together on a front of a wafer a top surface of a top substrate, the top substrate usable in the device, and a bottom surface of a bottom substrate, the bottom substrate usable in the device, wherein the top surface of the top substrate comprises top substrate top metallization, and wherein the bottom surface of the bottom substrate comprises bottom surface bottom metallization. In addition, fabricating mid-substrate metallization, bonding the top substrate to the top cover, and bonding the bottom substrate to the bottom cover are performed. The top substrate is bonded to a top surface of the mid-substrate metallization and bonding the bottom substrate to a bottom surface of the mid-substrate metallization, thereby creating a vertical electrical connection between the top substrate and the bottom substrate.

A drying implement may include a first portion having a diatomaceous earth slab and a resilient slab covering, and a second portion that is coupled to the first panel. The resilient slab covering may include a mesh of openings that allow water from an article placed on the resilient slab covering to drip through the mesh of openings, onto the diatomaceous earth slab. The second panel may include a plurality of cross pieces that are overmolded with a resilient second covering.

A sensor device is constructed to maintain a high glass strength to avoid the glass failure at low burst pressure, resulting from the sawing defects located in the critical high stress area of the glass pedestal as one of the materials used for construction of the sensor. This is achieved by forming polished recess structures in the critical high stress areas of the sawing street area. The sensor device is also constructed to have a robust bonding with the die attach material by creating a plurality of micro-posts on the mounting surface of the glass pedestal.

A MEMS IR sensor, with a cavity in a substrate underlapping an overlying layer and a temperature sensing component disposed in the overlying layer over the cavity, may be formed by forming an IR-absorbing sealing layer on the overlying layer so as to cover access holes to the cavity. The sealing layer is may include a photosensitive material, and the sealing layer may be patterned using a photolithographic process to form an IR-absorbing seal. Alternately, the sealing layer may be patterned using a mask and etch process to form the IR-absorbing seal.

A sensor device is constructed to maintain a high glass strength to avoid the glass failure at low burst pressure, resulting from the sawing defects located in the critical high stress area of the glass pedestal as one of the materials used for construction of the sensor. This is achieved by forming polished recess structures in the critical high stress areas of the sawing street area. The sensor device is also constructed to have a robust bonding with the die attach material by creating a plurality of micro-posts on the mounting surface of the glass pedestal.

An apparatus includes a first acoustic sensing resonator formed from a silicon substrate and has a first microelectromechanical system. The apparatus also includes a second acoustic sensing resonator formed from the silicon substrate and has a second microelectromechanical system. The second acoustic sensing resonator is arranged on the silicon substrate at a ninety degree (90) angle with respect to the first acoustic sensing resonator and together the first acoustic sensing resonator and second acoustic sensing resonator form a torque sensor. A high temperature bonding surface is connected to the torque sensor for directly connecting the torque sensor to a metal object.

Systems and methods with the ability to raise the set point temperature immediately after a temperature increase due to radiation exposure, thereby reducing T-dot (rate of change in temperature) errors when trying to cool the inertial system back to its original set point temperature. An example system includes an inertial instrument, a sensor that senses if an increased temperature event has been experienced by the inertial instrument, and a controller device that will increase the set point temperature of the inertial instrument based on the determined increase in temperature. The controller device will also maintain the inertial instrument at a temperature associated with at least one of the sensed increased temperature event or the increased set point temperature.