An optical electronics device includes first, second and third wafers. The first wafer has a semiconductor substrate with a dielectric layer on a side of the semiconductor substrate. The second wafer has a transparent substrate with an anti-reflective coating on a side of the transparent substrate. The first wafer is bonded to the second wafer at a silicon dioxide layer between the semiconductor substrate and the anti-reflective coating. The first and second wafers include a cavity extending from the dielectric layer through the semiconductor substrate and through the silicon dioxide layer to the anti-reflective coating. The third wafer includes micromechanical elements. The third wafer is bonded to the dielectric layer, and the micromechanical elements are contained within the cavity.

The present disclosure is directed to compact packaging for optical MEMS devices, such as one- and two-dimensional beam scanners. An embodiment in accordance with the present disclosure includes a light source and a MEMS-based scanning element for steering at least a portion of the light provided by the light source in at least one dimension as an output light signal, as well as one or more optical elements for collimating and/or redirecting light within a sealed chamber defined by the elements of a housing. In some embodiments, the one or more optical elements include a reflective lens that collimates the light provided by the light source while simultaneously correcting phase-front error imparted by the scanning element while steering the output beam.

An optical device formed of a mirror wafer, a cap wafer, and a glass wafer. The mirror wafer includes a first layer of electrically conductive material, a second layer of electrically conductive material, and a third layer of electrically insulating material between the first layer and the second layer. A mirror element is formed of the second layer of the mirror wafer, and has a reflective surface in the bottom of a cavity opened into at least the first layer. A good optical quality planar glass wafer can be used to enclose the mirror element when the mirror wafer, cap wafer, and glass wafer are bonded to each other.

An electro-optic device includes a chip provided with a mirror and a drive element adapted to drive the mirror, a light-transmitting cover adapted to cover the mirror in a planar view, and a spacer having contact with one surface of the chip between the cover and the chip. The entire part of one surface of the chip having contact with the spacer is made of a first material such as silicon oxide film having first thermal conductivity, and the spacer is made of a second material such as a quartz crystal having second thermal conductivity higher than the first thermal conductivity. The cover is made of a third material such as sapphire having third thermal conductivity higher than the second thermal conductivity.

An electro-optic device includes an interconnection board provided with an internal terminal, and a chip mounted on the interconnection board, and the chip is provided with a mirror, a drive element, and a chip-side terminal electrically connected to the drive element. The interconnection board includes a first surface on which an internal terminal is disposed, a second surface located on an opposite side to the first surface, a third surface connecting the first surface and the second surface to each other, and a fourth surface located on an opposite side to the third surface. The interconnection board is provided with a metal member exposed on the first surface and the second surface, and through holes (a first through hole and a second through hole) extending from the third surface to the fourth surface and having contact with the metal member.

An optical reflecting device includes a mirror part, a pair of joints, a pair of vibration parts, a plurality of driving parts, and a fixed part. Each of the joints has a first end connected to respective one the facing positions to each other on the mirror part and a second end opposite to the first end, and extends along a first axis. Each of the vibration parts has a central portion connected to the second end of respective one of the joints. A plurality of driving parts is disposed in each of the pair of vibration parts, and rotates the mirror part. Both ends of each of the pair of vibration parts are connected to the fixed part. The beam width defined as the length of each of the joints in a direction orthogonal to the first axis is greater than the beam width of each of the pair of vibration parts.

A hermetic housing is disclosed (10a) for an optoelectronic component (11) or a MEMS device configured to form an enclosure (12) within which a low pressure or vacuum prevails. The hermetic housing includes: an optical window (14) transparent for at least one wavelength of interest (λ); and a layer of a getter material (15a) configured to capture gases present in said enclosure and deposited on the optical window opposite the enclosure. This layer of getter material has a thickness (e_t), greater than 60 nanometers, and a porosity (P) in the range from 10 to 70% to satisfy the following relation: (1−P)*e_t<λ/2πk with λ corresponding to the at least one wavelength of interest, and k corresponding to the extinction coefficient of the material of the layer of getter material for the at least one wavelength of interest of the optical window.

An optical micro-electromechanical system (MEMS) system is disclosed. The optical MEMS system includes a printed circuit board (PCB), and a MEMS optical integrated circuit (IC) package mounted to the PCB. The IC package includes a MEMS optical die, and a plurality of leads electrically and mechanically connected to the MEMS optical die and to the PCB. The optical MEMS system also includes one or more elastomeric grommets contacting one or more of the leads, where the grommets are configured to absorb mechanical vibration energy from the contacted leads.

A multi-purpose Micro-Electro-Mechanical Systems (MEMS) thermopile sensor able to use as a thermal conductivity sensor, a Pirani vacuum sensor, a thermal flow sensor and a non-contact infrared temperature sensor, respectively. The sensor comprises a rectangular membrane created in a silicon substrate which has a thin polysilicon layer and a thin residual thermal reorganized porous silicon layer both attached on its back side, and configured to have its three sides clamped to the frame formed in the silicon substrate which surrounds and supports the membrane and the other side free to the frame, a cavity created in the silicon substrate, positioned under the membrane and having its flat bottom opposite to the membrane, its three side walls shaped as curved planes and the other side wall shaped as a vertical plane, a heater or an infrared absorber positioned on the membrane, close to and parallel with the free side of the membrane and a thermopile positioned on the membrane and consists of several thermocouples connected in series and having its hot junctions close to the heater and its cold junctions extended to the frame.

Methods, apparatuses and methods of manufacture are described for a MEMS mirror array with reduced crosstalk. The MEMS mirror array has a plurality of reflective surfaces wherein each reflective surface has a resonant frequency, and further wherein adjacent reflective surfaces do not have the same resonant frequency.