In an embodiment a sensor device includes a substrate with a first membrane and a first cover layer, the first membrane and the first cover layer being monolithically integrated into the substrate and a first pellistor element including a heater element and a temperature sensor element, the heater element and/or the temperature sensor element being arranged in or on the first membrane, wherein the first cover layer is arranged over or under the first membrane, and wherein the first membrane, the first cover layer and a part of the substrate surround a first cavity.

In an embodiment A package includes a casing having an opening and enclosing a cavity, a die accommodated in the cavity and a membrane attached to the casing, the membrane being air-permeable, covering and sealing the opening, wherein the membrane is configured to allow only a lateral gas flow, and wherein a blocking member is configured to block a vertical gas flow through the membrane into the cavity, the blocking member tightly covering a surface of the membrane at least in an area comprising the opening.

The present disclosure is drawn to microfluidic devices. The microfluidic device includes a microfluidic well, a layered composite stack, and an optical sensor. The layered composite stack includes an optical filter composited with an etch-stopping layer. The optical filter defines the microfluidic well. The optical sensor is associated with the microfluidic well and has the optical filter positioned therebetween.

The invention relates to a microelectromechanical system (MEMS) component or microfluidic component comprising a free-hanging or free-standing microchannel (1), as well as methods for manufacturing such a microchannel, as well as a flow sensor, e.g. a thermal flow sensor or a Coriolis flow sensor, pressure sensor or multi-parameter sensor, valve, pump or microheater, comprising such a microelectromechanical system component or microfluidic component. The MEMS component allows to increase the flow range and/or decrease the pressure drop of for instance a micro Coriolis mass flow meter by increasing the channel diameter, while maintaining its advantages.

The invention relates to a method of fabricating a micro machined channel, comprising the steps of providing a substrate of a first material and having a buried layer of a different material therein, and forming at least two trenches in said substrate by removing at least part of said substrate. Said trenches are provided at a distance from each other and at least partly extend substantially parallel to each other, as well as towards said buried layer. The method comprises the step of forming at least two filled trenches by providing a second material different from said first material and filling said at least two trenches with at least said second material; forming an elongated cavity in between said filled trenches by removing at least part of said substrate extending between said filled trenches; and forming an enclosed channel by providing a layer of material in said cavity and enclosing said cavity.

Aspects of the subject technology relate to an apparatus including a housing and a substrate. The apparatus further includes a sensor, an integrated circuit mounted on the substrate, and one or more heating elements configured to adjust a temperature of the sensor to facilitate measurement of temperature sensitivity and calibration of the sensor.

A sensor unit includes a transducer element monitoring a measurand and generating an electrical output signal correlated with the measurand, a sensor substrate having a first surface and an opposite second surface, a recess extending from the first surface of the substrate through to the second surface of the substrate, and a circuit carrier. The transducer element and a first electrically conductive contact pad are arranged on the first surface and electrically connected. The circuit carrier has a second electrically conductive contact pad. The sensor substrate is mounted on the circuit carrier with the first surface facing the circuit carrier. The first electrically conductive contact pad and the second electrically conductive contact pad are interconnected by an electrically conductive material filled in from the second surface towards the first surface of the sensor substrate.

A MEMS gas sensor (A), array thereof, and preparation method therefor. The MEMS gas sensor comprises a first substrate (A2) provided with a first cavity (A1), and N gas detection assemblies (A3) provided at an opening of A1, each A3 comprises: a supporting arm (A31) and a gas detection part (A32) provided on the A31; the A32 comprises a strip-shaped heating electrode part (A321), an insulating layer (A322), a strip-shaped detection electrode part (A323), and a gas-sensitive material part (A324) that are stacked sequentially; the A323 comprises a first detection electrode part (A323-1) and a second detection electrode part (A323-2) with a first opening (A325) therebetween; the A324 is provided at the A325; a first end of the A324 is connected to the A323-1, a second end of the A324 is connected to the A323-2; strip-shaped heating electrode parts in each A3 are connected sequentially to form a heater (A8).

A microelectromechanical system (MEMS) sensor device includes a package housing having a top member, bottom member, and a spacer coupled the top member to the bottom member, defining a cavity. At least one sensor circuit and a MEMS sensor disposed within the cavity of the package housing. A first opening formed on the package housing a control device embedded within the package housing is electrically coupled to the sensor circuit and is controlled to tune the MEMS sensor from a directional mode to an omni-directional mode.

The present disclosure is directed to a monolithic MEMS (micro-electromechanical system) platform having a temperature sensor, a pressure sensor and a gas sensor, and an associated method of formation. In some embodiments, the MEMS platform includes a semiconductor substrate having one or more transistor devices and a temperature sensor. A dielectric layer is disposed over the semiconductor substrate. A cavity is disposed within an upper surface of the dielectric layer. A MEMS substrate is arranged onto the upper surface of the dielectric layer and has a first section and a second section. A pressure sensor has a first pressure sensor electrode that is vertically separated by the cavity from a second pressure sensor electrode within the first section of a MEMS substrate. A gas sensor has a polymer disposed between a first gas sensor electrode within the second section of a MEMS substrate and a second gas sensor electrode.