A MEMS device includes a first MEMS sensor associated with a first spatial plane and a second MEMS sensor is associated with a spatial second plane not co-planar with the first spatial plane, wherein the first MEMS sensor is configured to provide a first interrupt and a first data in response to a physical perturbation, wherein the second MEMS sensor is configured to provide a second interrupt and second data in response to the physical perturbation, and a controller configured to receive the first interrupt at a first time and the second interrupt at a second time different from the first time, wherein the controller is configured to determine a latency between the first time and the second time, and wherein the controller is configured to determine motion data in response to the first data, to the second data, and to the latency.

A method for producing a micro-pattern on surface of a wire is disclosed. The method includes a step of applying a nanoparticle solution to the wire to form a nanoparticle solution layer on the surface of the wire; and a step of irradiating the nanoparticle solution layer with a Bessel beam laser to induce sintering of nanoparticles, thereby forming a micro-pattern on the surface of the wire. It is possible to form a microelectrode pattern on a level of several to tens of micrometers on the surface of a micro-wire having a diameter on a scale of several tens to several hundreds of micrometers. Since a laser optical system with a long depth of focus is used, a micro-pattern with a uniform thickness can be formed on surface of a wire having a curvature in a simple.

According to one embodiment, a sensor includes a base body, a first structure body, and a second structure body. The first structure body includes a first fixed portion, a first conductive portion, and first electrodes. The first fixed portion is fixed to the base body. The first conductive portion is held by the first fixed portion. The first conductive portion is separated from the base body in a first direction. The first electrodes are held by the first conductive portion. A distance between the base body and the first electrodes is changeable. The second structure body includes a second conductive portion and second electrodes. The second conductive portion is fixed to the base body. The second electrodes are held by the second conductive portion. One of the second electrodes is between the one of the first electrodes and the other one of the first electrodes.

A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.

A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.

Nano-electromechanical systems (NEMS) sensor devices that utilize thin electrically conductive membranes, which can be, for example, graphene membranes. The NEMS devices can have a trough shape (such as a serpentine shape arrangement) of the electrically conductive membrane. The thin, electrically conductive membrane has membrane-structures disposed upon it in an array of cavities. These membrane structures are between the thin, electrically conductive membrane and the main membrane trace. Such an arrangement increases the sensitivity of the NEMS sensor device. The electrically conductive membrane can be controllably wicked down on the edge of the oxide cavity to increase the sensitivity of the NEMS sensor device. Such NEMS sensor devices include NEMS sensor devices that are well suited to applications that measure magnetic fields that, operate below 10 kHz, such as brain-computer interfaces.

A micromechanical device for transducing acoustic waves in a propagation medium, comprising: a body; a first electrode structure superimposed to the body and electrically insulated from the body, the first electrode structure and the body defining between them a first buried cavity; and a first piezoelectric element superimposed to the first electrode structure, wherein the body, the first electrode structure, and the buried cavity form a first capacitive ultrasonic transducer, and the first electrode structure and the first piezoelectric element form a first piezoelectric ultrasonic transducer.

A semiconductor sensor, comprising a gas-sensing device and an integrated circuit is provided. The gas-sensing device includes a substrate having a sensing area and an interconnection area in the vicinity of the sensing area, an inter-metal dielectric (IMD) layer formed above the substrate in the sensing area and in the interconnection area, and an interconnect structure formed in the interconnection area; further includes a sensing electrode, a second TiO.sub.2-patterned portion, and a second Pt-patterned portion on the second TiO.sub.2-patterned portion in the sensing area. The interconnect structure includes a tungsten layer buried in the IMD layer, wherein part of a top surface of the tungsten layer is exposed by at least a via. The interconnect structure further includes a platinum layer formed in said at least the via, a TiO.sub.2 layer formed on the IMD layer, a first TiO.sub.2-patterned portion and a first Pt-patterned portion.

A capacitive sensor includes a first conductive structure; a second conductive structure movable relative to the first conductive structure in response to an external force acting thereon, wherein the first and the second conductive structures form a first capacitor having a first capacitance that changes with a change in a distance between the first conductive structure and second conductive structure, wherein the first capacitance is representative of the external force; and a diagnostic circuit configured to detect a first leakage current in the capacitive sensor by measuring an first electrical parameter that is affected by the first leakage current and comparing the measured first electrical parameter to a first predetermined error threshold, wherein the diagnostic circuit is further configured to generate a first error signal in response to the measured first electrical parameter being greater than the first predetermined error threshold.

A MEMS chip package is provided with a removable cover to allow non-destructive testing. The MEMS package has a container (with walls and a bottom) and a cover. The cover has a glass pane, and is secured to the MEMS package with an elastomeric gasket mounted between the walls of the MEMS package and the cover. A number of attachment mechanisms secure the cover to the MEMS package.