Three-dimensional micro devices usable as electromagnetic and magnetomechanical energy converters, as micromagnetic motors or generators, and methods for their production. The three-dimensional micro devices exhibit high efficiency even at dimensions on the microscale and below, and the method for production, as well as mass production, is simple and economical. Moreover, the three-dimensional micro devices at least include one three-dimensional device produced using roll-up technology. This three-dimensional device includes all functional and structural components for full functionality. At least one functional or structural component is an element that is at least partially freely movable at least partially within a surrounding element and is arranged such that it can be rotated at least around one of its axes.

Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

A process for manufacturing an interaction system of a microelectromechanical type for a storage medium, the interaction system provided with a supporting element and an interaction element carried by the supporting element, envisages the steps of: providing a wafer of semiconductor material having a substrate with a first type of conductivity (P) and a top surface; forming a first interaction region having a second type of conductivity (N), opposite to the first type of conductivity (P), in a surface portion of the substrate in the proximity of the top surface; and carrying out an electrochemical etch of the substrate starting from the top surface, the etching being selective with respect to the second type of conductivity (N), so as to remove the surface portion of the substrate and separate the first interaction region from the substrate, thus forming the supporting element.

Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

A new tri-electrode topology reduces the control voltage requirement for electrostatic actuators. Conventional parallel plate actuators are dual-electrode systems, formed by the MEMS structure and the drive electrode. By placing a perforated intermediate electrode between these elements, a tri-electrode configuration is formed. This topology enables a low voltage on the intermediate electrode to modulate the electrostatic force of the higher voltage drive electrode, whose voltage remains fixed. Results presented show that in comparison to conventional parallel plate electrostatic actuators, the intermediate electrode's modulating voltage can be as low as 20% of normal, while still providing the full actuation stroke.

A micromechanical device capable of providing out-of-plane motion and force generation in response to an in-plane strain applied to the device is provided. Embodiments of the present invention comprise one or more islands that are operatively coupled with one or more hinges. The hinges are operative for inducing rotation of the islands when a lateral strain is applied to the structure. In some embodiments, the hinges are also electrically conductive such that they enable electrical communication between the one or more islands and devices external to the structure. Some embodiments of the present invention are particularly well suited for use in biological applications. Some devices in accordance with the present invention are fabricated using conventional planar processes, such as flex-circuit fabrication techniques.

Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.

Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

Introduced here is an electromechanical actuator that includes a stator assembly with a chamber partially defined therethrough along a central longitudinal axis and a plunger assembly that is situated in the chamber and, in operation, moves along the central longitudinal axis between different positions. The stator assembly can include a pair of contacts that have an opening therebetween and a trinity of ferromagnetic layers with coils situated therebetween. The plunger assembly can include a magnet. When current is applied to the coils, the trinity of ferromagnetic layers become magnetically polarized, thereby dictating the motion of the plunger assembly by magnetically attracting or repelling the magnet included in the plunger assembly. The plunger assembly may be stabilized by a flexure flexibly connecting the stator assembly and plunger assembly.

Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.