Micro-electro-mechanical systems and a preparation method thereof are provided. The micro-electro-mechanical systems include first fixed comb fingers, second fixed comb fingers, a support beam, a movable platform, and movable comb fingers. The first fixed comb fingers and the second fixed comb fingers are fastened to a substrate, and the first fixed comb fingers are electrically isolated from the second fixed comb fingers. Two ends of the support beam are fastened to the substrate, and the movable platform is coupled to the support beam. The movable comb fingers are coupled to the movable platform, and form a three-layer comb finger structure with the first fixed comb fingers and the second fixed comb fingers. This structure improves drive efficiency of the micro-electro-mechanical systems.

The micromirror device includes: a movable portion having a mirror portion on which a reflecting surface for reflecting incident light is formed; a first support portion that is connected to the movable portion on a first axis located in a plane including the reflecting surface of the mirror portion in a stationary state, and that swingably supports the movable portion around the first axis; and a pair of first actuators that are connected to the first support portion and face each other across the first axis, each of which being a piezoelectric drive type first actuator that allows the movable portion to swing around the first axis, in which in a case where the movable portion swings around the first axis, at least a part of the first actuator swings around the first axis in a phase opposite to a phase of the movable portion, and assuming that a ratio of a rotation angle of the first actuator to a rotation angle of the movable portion is R, 0<R<1.00 is satisfied.

Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.

A movable device includes a light deflector including a movable part rotatable about a predetermined axis; a mount including a pair of stationary parts to which the light deflector is secured; and a substrate attached to an opposite side of a light-deflector side of the mount. The substrate has a through hole between the pair of the stationary parts.

A microelectromechanical system (MEMS) device including an oscillator structure configured to oscillate about a rotation axis; a frame that is rotationally fixed, the frame including a frame recess within which the oscillator structure is suspended; and a suspension assembly mechanically coupled to and between the oscillator structure and the frame, the suspension assembly configured to suspend the oscillator structure within the frame recess. The suspension assembly includes a central support beam that extends lengthwise along the rotation axis, the central support beam being mechanically coupled to and between the oscillator structure and the frame; a first outer support beam mechanically coupled to the oscillator structure and laterally displaced from the central support beam in a first direction orthogonal to the rotation axis; and at least one first interior support beam directly coupled to and between the central support beam and the first outer support beam.

Disclosed is a MEMS mirror including a flat plate that is displaceable in a film thickness direction, a frame part that is separated from the flat plate and surrounds the flat plate, a support part that connects the flat plate and the frame part and is smaller in film thickness than the frame part, and a piezoelectric body for control that is arranged on the support part. A control voltage is applied to the piezoelectric body for control to deform the piezoelectric body for control and deform the support part together with the deformation of the piezoelectric body for control, to thereby adjust a spring constant of the support part.

In one example, an apparatus comprises a semiconductor integrated circuit, the semiconductor integrated circuit including a microelectromechanical system (MEMS) device layer and a silicon substrate, the MEMS layer including at least one micro-mirror assembly, the at least one micro-mirror assembly including a micro-mirror and electrodes. The at least one micro-mirror assembly further includes a light reduction layer formed below a surface of the silicon substrate. A method of fabricating the semiconductor integrated circuit is also provided.

In one example, an apparatus comprises a semiconductor integrated circuit, the semiconductor integrated circuit including a microelectromechanical system (MEMS) device layer and a silicon substrate, the MEMS device layer including at least one micro-mirror assembly, the at least one micro-mirror assembly including a micro-mirror and electrodes. The at least one micro-mirror assembly further includes a light reduction layer on the silicon substrate. A method of fabricating the semiconductor integrated circuit is also provided.

In one example, an apparatus comprises a semiconductor integrated circuit, the semiconductor integrated circuit including a microelectromechanical system (MEMS) device layer, an oxide layer, and a silicon substrate, the oxide layer being sandwiched between the MEMS device layer and the silicon substrate, the MEMS device layer including at least one micro-mirror assembly, the at least one micro-mirror assembly including a micro-mirror and electrodes. The at least one micro-mirror assembly further includes a light reduction layer between at least a part of the MEMS device layer and the oxide layer. A method of fabricating the semiconductor integrated circuit is also provided.

An interposer substrate, a MEMS device and a corresponding manufacturing method. The interposer substrate is equipped with a front side and a rear side, a cavity starting from the rear side, which extends up to a first depth, a through-opening and a sunken area situated between the cavity and the through-opening, which is sunken from the rear side up to a second depth in relation to the rear side, the first depth being greater than the second depth.