A MEMS microphone includes a substrate defining a cavity, a diaphragm being spaced apart from the substrate, covering the cavity, and being configured to generate a displacement thereof in response to an applied acoustic pressure, an anchor extending from an end portion of the diaphragm, the anchor including a lower surface in contact with an upper surface of the substrate to support the diaphragm, a back plate disposed over the diaphragm, the back plate being spaced apart from the diaphragm such that an air gap is maintained between the back plate and the diaphragm, and defining a plurality of acoustic holes and an upper insulation layer provided on the substrate, covering the back plate, and holding the back plate to space the back plate from the diaphragm, the upper insulation layer having a flat plate shape to prevent sagging of the back plate.

In some examples, a transducer apparatus includes a spring structure that enables a large, reliable amount of displacement of a transducer plate. For instance, an individual cell of the transducer apparatus may include a substrate having a first electrode portion, with at least one spring anchor extending from a first side of the substrate. At least one spring member may be supported by the at least one anchor, and may be connected to a plate that includes a second electrode portion. Accordingly, the spring member may support the plate, at least in part, for enabling the plate to move in a resilient manner toward and away from the substrate. In some cases, the spring member may be a bar-shaped spring that is cantilevered to an anchor or supported by two or more anchors. Additionally, a cavity between the plate and the substrate may be sealed by a sealing material.

Embodiments of the invention include a switching device that includes an electrode, a piezoelectric material coupled to the electrode, and a movable structure (e.g., cantilever, beam) coupled to the piezoelectric material. The movable structure includes a first end coupled to an anchor of a package substrate having organic layers and a second released end positioned within a cavity of the package substrate.

A diaphragm structure of a micromechanical component includes: a diaphragm integrated via at least one spring element into a layered structure, the diaphragm spanning a cavern, so that at least one section of the diaphragm edge extends up to and beyond the edge area of the cavern; and an anchoring structure formed in the overlap area between the diaphragm and the cavern edge area. The anchoring structure includes at least one anchor element structured out of the layered structure above the cavern edge area, and one through opening for the anchor element formed in the edge area of the diaphragm, so that there is a clearance between the anchor element and the through opening which allows for a mechanical stress relaxation of the diaphragm.

The present invention relates to microelectromechanical systems (MEMS), and more specifically to an anchor structure for anchoring MEMS components within a MEMS device. The anchor points for rotor and stator components of the device are arranged such that the anchor points are arranged along and overlap a common axis.

According to one embodiment, an electronic device includes a base region, an element portion located on the base region, the element portion including a movable portion, and a protective film overlying the element portion and forming a cavity on an inner side of the protective film. The protective film includes a first protective layer and a second protective layer located on the first protective layer. A hole extends in a direction parallel to a main surface of the base region, and the second protective layer covers the hole.

This disclosure provides systems, methods and apparatus for an electromechanical systems (EMS) assembly. The EMS assembly includes a substrate, an anchor disposed on the substrate, and a suspended planar body supported over the substrate by the anchor. The suspended planar body includes at least one depression extending out of a plane of the suspended planar body and protruding towards the substrate. The suspended planar body also includes a substantially horizontal portion corresponding to a gap in the at least one depression. An extent of the gap is up to 20% of a length of the suspended planar body.

A sensor device is described. The sensor device includes at least one substrate; an edge region that is disposed on the substrate and laterally delimits an inner region above the substrate; a diaphragm that is anchored on the edge structure and at least partly spans the inner region, the diaphragm encompassing in the inner region at least one region which is movable by way of a pressure and which encloses a cavity between the diaphragm and the substrate; and a first intermediate carrier that extends in the movable region below the diaphragm and is connected to the diaphragm, and in particular has at least one trench.

Methods, apparatuses and methods of manufacture are described for a MEMS mirror array with reduced crosstalk. The MEMS mirror array has a plurality of reflective surfaces wherein each reflective surface has a resonant frequency, and further wherein adjacent reflective surfaces do not have the same resonant frequency.

A micromechanical component, whose diaphragm is supported and has support structures on its inner diaphragm side. Each of the support structures includes a first and second edge element structure, and at least one intermediate element structure positioned between the first and second edge element structures. For each of the support structures, a plane of symmetry is definable, with respect to which at least the first edge element structure of the respective support structure and the second edge element structure of the respective support structure are specularly symmetric. In each of support structures, a first maximum dimension of its first edge element structure perpendicular to its plane of symmetry and a second maximum dimension of its second edge element structure perpendicular to its plane of symmetry are greater than the maximum dimension of its intermediate element structure perpendicular to its plane of symmetry.