A micro-electrical-mechanical system (MEMS) device includes one or more slidable connection assemblies for releasably coupling the micro-electrical-mechanical system (MEMS) device to a wafer from which the micro-electrical-mechanical system (MEMS) device was made. The MEMS device may include a MEMS actuation core, and a MEMS electrical connector assembly electrically coupled to the MEMS actuation core configured to be electrically coupled to a printed circuit board.

A micromachined tunable capacitor. A pair of first and second MEMS fabricated flexures are flexibly coupled to a piezo actuator drive element configured wherein a stress or strain induced by the piezo actuator drive element urges a first movable capacitor plate element a predetermined distance toward or away from a second capacitor plate element proportional to a predetermined voltage signal.

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

A device transmits a movement and a force between a first zone and a second zone which are insulated from one another in a sealed manner. The device includes a planar support, a transmission element that is rotatably movable with respect to the support by a pivot joint having an axis of rotation that is parallel to a plane of the support, an opening in the support through which the transmission element passes and level with which the pivot joint is positioned. The transmission element includes at least one first transmission arm on one side of the plane of the support and one second transmission arm on the other side of the plane of the support, and sealed insulation positioned in the opening, such that it insulates the first zone from the second zone in a sealed manner and allows the rotational movement of the transmission element.

A micro-electrical-mechanical system (MEMS) cantilever assembly includes an intermediary cantilever portion, a main cantilever arm configured to couple a moveable portion of a micro-electrical-mechanical system (MEMS) and the intermediary cantilever portion, and a plurality of intermediary links configured to couple the intermediary cantilever portion to a portion of the micro-electrical-mechanical system (MEMS).

An inertial sensor includes a movable element having a mass that is asymmetric relative to a rotational axis and anchors attached to the substrate. First and second spring systems are spaced apart from the surface of the substrate. Each of the first and second spring systems includes a pair of beams, a center flexure interposed between the beams, and a pair of end flexures. One of the end flexures is interconnected between one of the beams and one of the anchors and the other end flexure is interconnected between one of the beams and the movable element. The beams are resistant to deformation relative to the center flexure and the end flexures. The first and second spring systems facilitate rotational motion of the movable element about the rotational axis and the spring systems facilitate translational motion of the movable element substantially parallel to the surface of the substrate.

A method for manufacturing a microelectromechanical systems (MEMS) device, includes forming a cavity in a bulk semiconductor substrate; defining a movably suspended mass in the bulk semiconductor substrate by one or more trenches extending from a main surface area of the bulk semiconductor substrate to the cavity; arranging a cap structure on the main surface area of the bulk semiconductor substrate; and forming a capacitive structure. Forming the capacitive structure includes arranging a first electrode structure on the movably suspended mass; and providing a second electrode structure at the cap structure such that the first electrode structure and the second electrode structure are spaced apart in a direction perpendicular to the main surface area of the bulk semiconductor substrate.

The present disclosure provides a displacement amplification structure and a method for controlling displacement. In one aspect, the displacement amplification structure of the present disclosure includes a first beam and a second beam substantially parallel to the first beam, an end of the first beam coupled to a fixture site, and an end of the second beam coupled to a motion actuator; and a motion shutter coupled to an opposing end of the first and second beams. In response to a displacement of the motion actuator along an axis direction of the second beam, the motion shutter displaces a distance along a transversal direction substantially perpendicular to the axis direction.

The present disclosure provides a displacement amplification structure and a method for controlling displacement. In one aspect, the displacement amplification structure of the present disclosure includes a first beam and a second beam substantially parallel to the first beam, an end of the first beam coupled to a fixture site, an end of the second beam coupled to a motion actuator, and a motion shutter coupled to an opposing end of the first and second beams. In response to a displacement of the motion actuator along an axis direction of the second beam, the motion shutter displaces a distance along a transversal direction substantially perpendicular to the axis direction.

A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.