A device transmits a movement and a force between a first zone and a second zone which are insulated from one another in a sealed manner. The device includes a planar support, a transmission element that is rotatably movable with respect to the support by a pivot joint having an axis of rotation that is parallel to a plane of the support, an opening in the support through which the transmission element passes and level with which the pivot joint is positioned. The transmission element includes at least one first transmission arm on one side of the plane of the support and one second transmission arm on the other side of the plane of the support, and sealed insulation positioned in the opening, such that it insulates the first zone from the second zone in a sealed manner and allows the rotational movement of the transmission element.

An inertial sensor includes a movable element having a mass that is asymmetric relative to a rotational axis and anchors attached to the substrate. First and second spring systems are spaced apart from the surface of the substrate. Each of the first and second spring systems includes a pair of beams, a center flexure interposed between the beams, and a pair of end flexures. One of the end flexures is interconnected between one of the beams and one of the anchors and the other end flexure is interconnected between one of the beams and the movable element. The beams are resistant to deformation relative to the center flexure and the end flexures. The first and second spring systems facilitate rotational motion of the movable element about the rotational axis and the spring systems facilitate translational motion of the movable element substantially parallel to the surface of the substrate.

A capacitive microelectromechanical device is provided. The capacitive microelectromechanical device includes a semiconductor substrate, a support structure, an electrode element, a spring element, and a seismic mass. The support structure, for example, a pole, suspension or a post, is fixedly connected to the semiconductor substrate, which may comprise silicon. The electrode element is fixedly connected to the support structure. Moreover, the seismic mass is connected over the spring element to the support structure so that the seismic mass is displaceable, deflectable or movable with respect to the electrode element. Moreover, the seismic mass and the electrode element form a capacitor having a capacitance which depends on a displacement between the seismic mass and the electrode element.

According to an embodiment, a semiconductor device includes a first actuator, a second actuator, a first frame provided between the first actuator and the second actuator, a first connection member connecting the first actuator and the first frame to each other, a second connection member connecting the first actuator and the first frame to each other at a position different from a position at which the first connection member connects the first actuator and the first frame to each other, a third connection member connecting the second actuator and the first frame to each other, a fourth connection member connecting the second actuator and the first frame to each other at a position different from a position at which the third connection member connects the second actuator and the first frame to each other.

An actuator device includes a support portion, a movable portion, a connection portion which connects the movable portion to the support portion on a second axis so that the movable portion is swingable about the second axis, a first wiring which is provided on the connection portion, and a second wiring which is provided on the support portion. The rigidity of a first metal material forming the first wiring is higher than that of a second metal material forming the second wiring. The second wiring is connected to a surface opposite to the support portion in a first connection part located on the support portion in the first connection part.

A micromechanical device includes an actuator moveable along at least one rotational axis, and an electromagnetic type actuating device. The rotor is composed of a wire coil mounted on a moveable frame, which is rotationally integral with the actuator. The coil conducts the electric current. Protruding strands form a loop proximate the torsional beam. In another embodiment, the coil terminates through its two ends located on the moveable frame. The ends of the coil are each welded to one of the metal plates terminating on the moveable frame. Starting from the power supply pads on the fixed frame, the conductive lines transit through the torsional beam to join the ends of coil on the moveable frame. To make several plates going through one of the torsional beams, the beams are isolated electrically by a groove.

A micromechanical device and a corresponding manufacturing method. The micromechanical device includes: a spring element which is moveably coupleable or is moveably coupled to a frame unit at at least one connecting point of the spring element, the spring element including at least one web, which extends outward from the at least one connecting point; and the at least one web being structured in such a way that it includes at least one first section as well as at least one widening section for reducing a non-linearity of the spring element, which is widened compared to the first section.

A MEMS device with teeter-totter structure includes a mobile mass having an area in a plane and a thickness in a direction perpendicular to the plane. The mobile mass is tiltable about a rotation axis extending parallel to the plane and formed by a first and by a second half-masses arranged on opposite sides of the rotation axis. The first and the second masses have a first and a second centroid, respectively, arranged at a first and a second distance b1, b2, respectively, from the rotation axis. First through openings are formed in the first half-mass and, together with the first half-mass, have a first total perimeter p1 in the plane. Second through openings are formed in the second half-mass and, together with the second half-mass, have a second total perimeter p2 in the plane, where the first and the second perimeters p1, p2 satisfy the equation: p1b1=p2b2.

A platform includes first and second actuation layers. The first actuation layer includes first and second frames and a plurality of actuators connected between the first frame and the second frame, wherein the plurality of actuators are adapted to move the first and second frames with respect to each other in a first direction. The second actuation layer includes third and fourth frames and a plurality of actuators connected between the third frame and the fourth frame, wherein the plurality of actuators are adapted to move the third frame and the fourth frame with respect to each other in a second direction, different from the first direction. Thereby, the fourth frame of the second actuation layer and the second frame of the first actuation layer are mechanically connected to each other, such that the second actuation layer experiences the movement in the first direction induced by the first actuation layer.

A microelectromechanical device includes a fixed structure defining a cavity with a tiltable structure that is elastically suspended in the cavity. A piezoelectrically driven actuation structure, interposed between the tiltable structure and the fixed structure, is biased for causing rotation of the tiltable structure about a first rotation axis belonging to a horizontal plane in which the tiltable structure rests. The actuation structure includes a pair of driving arms carry respective regions of piezoelectric material and are elastically coupled to the tiltable structure on opposite sides of the first rotation axis through respective elastic decoupling elements. The elastic decoupling elements exhibit stiffness in regard to movements out of the horizontal plane and compliance to torsion about the first rotation axis.