Systems and methods for aligning a transfer head assembly with a substrate are disclosed. In an embodiment a pivot mount is used for generating a feedback signal in a closed-loop motion control system. In an embodiment, the pivot mount includes a plurality of spring arms, with each spring arm including a switch-back along an axial length of the spring arm such that a pair of first and second lengths of the spring arm are immediately adjacent the switch-back and are parallel to each other. A first strain sensing element is located at the first length, and a second strain sensing element is located at the second length.

A micro assembly having a substrate and an operating plane coupled to the substrate. The operating plane is movable from an in-plane position to an out-of-plane position. One or more electric connections provide electric power from the substrate to the operating plane in the out-of-plane position. A tool is coupled to the operating plane. The tool is operable to receive electric power from the operating plane to perform work.

Systems and methods for aligning a transfer head assembly with a substrate are disclosed. In an embodiment a pivot mount is used for generating a feedback signal in a closed-loop motion control system. In an embodiment, the pivot mount includes a plurality of spring arms, with each spring arm including a switch-back along an axial length of the spring arm such that a pair of first and second lengths of the spring arm are immediately adjacent the switch-back and are parallel to each other. A first strain sensing element is located at the first length, and a second strain sensing element is located at the second length.

Diaphragm 33 is provided on a top surface of silicon substrate 32, and plate unit 39 is fixed to the top surface of silicon substrate 32 so as to cover the movable electrode film with a gap. Plate unit 39 is made of an insulating material. Fixed electrode film 40 is formed on a bottom surface of plate unit 39, and diaphragm 33 and fixed electrode film 40 constitute a capacitor. In an area around plate unit 39, a whole outer peripheral edge of the top surface of silicon substrate 32 is exposed from plate unit 39. On the top surface of the substrate 32, insulating sheet 47 made of the insulating material is formed in a part of an area exposed from plate unit 39, and electrode pad 48 electrically connected to diaphragm 33 and electrode pad 49 electrically connected to fixed electrode film 40 are provided on a top surface of insulating sheet 47.

A transfer head array includes a base substrate, an interlayer isolation layer, plural transfer heads, and at least one shielding layer. The interlayer isolation layer is disposed on the base substrate, and the interlayer isolation layer has a flat top surface facing away from the base substrate. The transfer heads are arranged on the interlayer isolation layer. The shielding layer is disposed in the interlayer isolation layer.

A mounting device for a micromechanical structural element, such as a sensor element. The mounting device includes at least one flexible carrier element, the structural element, and a stiffening element. The structural element is applied to a first side of the flexible carrier element in a first region, the stiffening element is provided on the opposite second side of the carrier element in a second region, and the flexible carrier element can be electrically connected, as a result of which compact and flexible installation of the sensor structure is made possible.

A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

System and method that allow to jointly cause movement of multiple micro-and-nano-objects to desired positions are described. A high speed camera tracks the locations of the objects. An array of electrodes is used to generate a dynamic potential energy landscape for manipulating objects with both DEP and EP forces. One or more computing devices are used to: process images captured by the camera to estimate positions of the objects; use model predictive control optimization to obtain trajectories and electrode potentials for moving at least some of the objects from estimated positions to further positions; and control the electrodes based on electrode potentials.

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moir alignment techniques resulting in highly accurate, parallel assembly of feedstocks.