A rotary mechanism and a handheld tool, which relates to mechanical regulation. The rotary mechanism including a first part, a second part, and a rotary locking assembly, a mounting portion being provided on the first part, the second part having a rotary portion adapted to the mounting portion; the rotary portion and the mounting portion are rotatably sleeving-fitted, the rotary locking assembly includes a sliding block and a rotary drive element, the sliding block is mounted on the rotary portion, and the rotary drive element rotates to bring the sliding block to move radially along the rotary portion so that the sliding block is locked on the mounting portion or is unlocked from the mounting portion.

A rotary mechanism and a handheld tool, which relates to mechanical regulation. The rotary mechanism including a first part, a second part, and a rotary locking assembly, a mounting portion being provided on the first part, the second part having a rotary portion adapted to the mounting portion; the rotary portion and the mounting portion are rotatably sleeving-fitted, the rotary locking assembly includes a sliding block and a rotary drive element, the sliding block is mounted on the rotary portion, and the rotary drive element rotates to bring the sliding block to move radially along the rotary portion so that the sliding block is locked on the mounting portion or is unlocked from the mounting portion.

The present invention provides methods and systems for a self-cleaning ion generator that includes a self-cleaning ion generator device that includes a bottom portion, a top portion, at least one electrode extending from the top portion, and a cleaning apparatus for cleaning the at least one electrode.

A substrate treatment device includes: a substrate holding unit including a plate-shaped holding table that rotatably holds a substrate so that a surface of the substrate on which the fine patterns are formed faces downward, and a plurality of holding pins provided on the holding table to hold an outer periphery of the substrate at a plurality of points; a heater that heats the substrate; a cover that internally houses the substrate holding unit and the heater, and forms a treatment chamber; a pump that exhausts the treatment chamber to make a negative-pressure atmosphere; an inert gas supply port that faces an opposite side surface opposite to the surface with the fine patterns formed thereon, and supplies inert gas into the treatment chamber; and a nozzle to jet a cleaning solution toward the surface with the fine patterns formed thereon and a gas exhaust port to communicate with the pump.

A cleaning apparatus and a method of using the cleaning apparatus are provided. The method includes first moving a pencil pad into contact with a top surface of a wafer, wherein the pencil pad is connected to a pivot arm and second moving the pivot arm in a sweeping motion from a first zone to a second zone, the first zone being closer to a center of the top surface of the wafer than the second zone, wherein the sweeping motion is controlled by a controller, the pivot arm moves at a first speed in the first zone and the pivot arm moves at a second speed in the second zone, wherein the first speed is different from the second speed.

A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.

A high pressure surface cleaner includes a housing having an open end, a high pressure coupling in fluid communication with the housing and having a first end and a second end, the first end configured to receive a high pressure water source, and a supply conduit rotatably secured to the second end of the high pressure coupling and configured to rotate about the high pressure coupling defining a horizontal plane within the housing. The cleaner also includes first and second nozzles having a vertical axis therethrough and secured proximate to the first and opposing second ends of the supply conduit, respectively, the vertical axis of the first and second nozzles approximately normal to the first horizontal plane, and a directional nozzle coupled to the supply conduit and having a directional outlet orientated to cause the supply conduit with the first and second nozzles to rotate when discharging water.

A data acquisition system for determining the state of a tubular while the tubular rotates about its cylindrical axis. The tubular remains otherwise substantially stationary. Sensors travel up and down the length of the rotating tubular, interrogating the inside and outside of the tubular for data regarding the tubular's state. Sensors may take samples which may be associated with rotational reference information tying the sample to its absolute position on the internal or external surface of the tubular. A data processor processes the samples and other sensor data to produce a wide array of output, including data signatures of the tubular, maps of contour data regarding the internal or external surface of the tubular, and dimensional data regarding the tubular. Data acquisition is advantageously done in real time, and may further be done concurrently with internal or external cleaning operations.

A substrate cleaning device includes a pair of upper holding devices that hold an outer peripheral end of a substrate, a lower-surface brush that comes into contact with a lower surface of the substrate to clean the lower surface of the substrate and a control device that changes an uplift force for uplifting the lower-surface brush in a period during which the lower-surface brush cleans a lower-surface center region of the substrate.

A substrate cleaning device includes a pair of upper holding devices that hold an outer peripheral end of a substrate, a lower-surface brush that comes into contact with a lower surface of the substrate to clean the lower surface of the substrate and a control device that changes an uplift force for uplifting the lower-surface brush in a period during which the lower-surface brush cleans a lower-surface center region of the substrate.