Stencil frames for tensioning stencils of an angular shape are provided. The stencil frame comprises corner elements (2), edge elements (1), fastening elements (13) and tensioning devices with a tensioning device being associated with each edge element (1). The corner elements (2) each have two, mutually perpendicular, guiding profiles (12) which joined at an intersection of their axes and the edge elements (1) each have a uniaxial reception profile (11). Each reception profile (11) is connectable to two guiding profiles (12) by loose fit. Each tensioning device has at least one elastic element (5) and connects between two neighbouring corner elements (2). A line of force exerted by each tensioning device is parallel to the axis of its corresponding reception profile (11).

A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.

A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.

A laser assembly is disclosed. The laser assembly includes a carrier for mounting a semiconductor laser diode (LD) and a capacitor thereon. The carrier provides, in a top surface thereof, a metal pattern having a die area for mounting the LD through a brazing material, a mounting area, and an auxiliary area for absorbing a surplus brazing material. The capacitor is mounted on the mounting area closer to the LD through another brazing material.

An apparatus includes a hopper configured to receive a plurality of solder microspheres, and a moveable singulation device positioned proximate to and below the hopper. The moveable singulation device is configured to receive the plurality of solder microspheres from the hopper as the plurality of microspheres exit the hopper. The movable singulation device includes a plurality of holes, with each of the plurality of holes configured to receive a single solder microsphere of the plurality of solder micro spheres. The apparatus further includes a piezoelectric vibration device configured to provide ultrasonic vibrations to the singulation device, thereby preventing agglomeration of the plurality of solder microspheres in the hopper.

A working machine for a board including a working device that selectively performs work for mounting conductive balls on a circuit board by a ball holder and work for transferring viscous fluid onto the circuit board by transfer pins, and a tray in which the viscous fluid is stored, when the conductive balls are to be mounted on the circuit board, the viscous fluid being transferred onto the circuit board by the transfer pins and the conductive balls having been immersed in the viscous fluid are mounted on the transferred viscous fluid. Accordingly, the conductive balls can be fixed onto the circuit board by the viscous fluid, which is transferred onto the circuit board by the transfer pins, and the viscous fluid that adheres to the conductive balls due to the immersion of the conductive balls in the viscous fluid.

Assembly for placing solder from solder balls on a substrate, comprising a reservoir with a plurality of solder balls, an exit opening for releasing one single solder ball, a feeding channel between the reservoir and the exit opening with a feeding channel width larger than the diameter of one solder ball and smaller than the diameter of two solder balls, and a suction channel with end opening into the feeding channel which end is smaller than the diameter of one solder ball. A pressure difference is generated between the feeding channel and the suction channel and is controlled whereby pressure in the suction channel is smaller than in the feeding channel. A solder ball present in the feeding channel can be sucked to and held to the end of the suction channel at a first pressure difference to block feeding of solder balls and is released at a second pressure difference.

A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wettable surface of a planar substrate; aligning the pin with the solder disposed on the non-wettable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

Provided is a tape-shaped contact member including a tape-shaped contact material. At least one wire-shaped brazing material is bonded to the tape-shaped contact material, at least one projection including the brazing material and protruding from a surface of the contact material is formed in a cross-sectional shape, a diffusion region containing a metal component forming the brazing material is formed along an interface with the brazing material inside the contact material, and the diffusion region has a thickness of 2 μm or more and 10 μm or less. A chip-shaped contact component can be obtained by cutting the tape-shaped contact member to an arbitrary length. The present contact component is useful as a constituent member for a switching electrical contact, and capable of adapting to height reduction of the electrical contact. The present invention can also contribute to reduction of occurrence of poor bonding.