A system is provided for wire processing. The wire processing system may include a wire transport, a processing station that may provide wire to the wire transport, a processing station that may move an electrical component threaded onto the wire, and a processing station that may move the electrical component to a position on the wire for further processing.

A semiconductor wafer has an edge support ring around a perimeter of the semiconductor wafer and conductive layer formed over a surface of the semiconductor wafer within the edge support ring. A first stencil is disposed over the edge support ring with first openings aligned with the conductive layer. The first stencil includes a horizontal portion over the edge support ring, and a step-down portion extending the first openings to the conductive layer formed over the surface of the semiconductor wafer. The horizontal portion may have a notch with the edge support ring disposed within the notch. A plurality of bumps is dispersed over the first stencil to occupy the first openings over the conductive layer. A second stencil is disposed over the edge support ring with second openings aligned with the conductive layer to deposit a flux material in the second openings over the conductive layer.

Disclosed are ball jumping apparatuses and ball absorption methods using the same. The ball jumping apparatus comprises a fixing part, a moving part spaced apart from the fixing part, and a resilient member that connects the fixing part and the moving part to each other. The resilient member extends upwardly from the fixing part and has a connection with the moving part. The fixing part includes a fixing plate that spreads in a horizontal direction. The moving part includes an oscillating vessel that has a ball receiving space in which a ball is received, and an oscillator coupled to the oscillating vessel. A bottom surface of the oscillating vessel is upwardly spaced apart from a top surface of the fixing plate.

The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle (36) of the application device into an application position P3, wherein a detector device (69) is provided that serves to trigger a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device, wherein the detector device has a reflection sensor (70) that detects reflection radiation (72) that is reflected by the solder material deposit arranged in the application position P3.

The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the solder paste tub through an opening of the solder paste tub, wherein solder paste is accommodated in the housing of the solder paste tub; bearing the solder paste tub, with the opening facing downward, on a working platform by means of the solder paste nozzle; holding the solder paste tub by mating a holder with an engagement means on an outer wall of the housing of the solder paste tub, the holder being capable of moving up and down with the housing of the solder paste tub; and pressing the housing of the solder paste tub, such that the housing of the solder paste tub moves relative to the solder paste nozzle, at the same time causing the holder to move as the housing of the solder paste tub moves, so as to extrude solder paste accommodated in the housing of the solder paste tub from the solder paste nozzle.

The connection method between at least two elements (E1, E2) corresponding to a printed circuit (4) and to an electronic component (5), comprises a step of forming a plurality of pad-type stacks (2) of bosses (3), the stacks (2) of bosses (3) being formed on a face (10) of a first (E1) of the elements (E1, E2), the stacks (2) of bosses (3) each comprising the same given number of bosses (3), said method also comprising a step of depositing a brazing product (7) on this first element (E1) provided with stacks (2) of bosses (3), a step of arranging the second (E2) of the elements (E1, E2) on the first element (E1), and a step of remelting the assembly thus formed, in order to obtain an electronic device (1). This method makes it possible to produce a precise and flexible raising of surface mounted electronic components.

In an application method of a solid brazing material, while being rotated, the solid brazing material is brought into contact with an aluminum plate material, thereby applying the solid brazing material to the aluminum plate material.

A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.

A method and a device for establishing a wire connection between a first contact surface and at least one further contact surface. A contact end of a wire is positioned in a contact position relative to the first contact surface with a wire guiding tool. Subsequently, a mechanical, electrically conductive connection is established between the first contact surface and the contact end with a first solder material connection, and subsequently the wire guiding tool is moved to the further contact surface thus forming a wire section and establishing a further mechanical, electrically conductive connection between the wire section end and the further contact surface with a further solder material connection.

A solder ball bonding (SBB) tool includes a rotatable feed plate for transporting solder balls from a translatable solder ball reservoir to a nozzle unit, which is a position at which a laser light source can irradiate and thus melt the solder balls. The SBB tool includes a gap between the reservoir and the feed plate positioned over the reservoir, and a feed mechanism coupled with the reservoir, where the feed mechanism is driven by a pressurized gas to translate the reservoir upward across at least a portion of the gap in preparation for movement of a solder ball to the feed plate and downward in preparation for rotation of the feed plate after a solder ball is moved to the feed plate. The gap may have a maximum size that exceeds a nominal size of the solder balls contained in the reservoir.