In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).

A substantially tubular iron tip (5) that can be heated and that is extended vertically and a solder piece supply portion that supplies a first solder piece (Wh1) and a second solder piece (Wh2) in which a layer of a flux (72) is provided within a tubular solder layer in this order from above into the iron tip are provided, within the iron tip, the solder pieces are erected such that on the first solder piece, the second solder piece rides and the heat of the iron tip is used to melt the first solder piece and the second solder piece such that the molten solder is supplied downward. In this way, it is possible to more reliably heat and melt the solder pieces in a posture in which they are erected within the iron tip.

The invention described herein generally pertains to a system and method related to an automatic, semi-automatic or a manual welding operation and utilizing a quick release mechanism to removeably secure a torch to a wire feeder or a torch cable to a wire feeder. The quick release mechanism can be configured to attach through a sidewall of a female member coupled to a wire feeder, wherein the quick release mechanism engages a male member inside the female member to couple or decouple the torch from the wire feeder.

The invention is a hand-held portable device for soldering electrical wires to an LED lighting strip. The device comprises mechanisms for positioning and securing LED strip contact pads, wires, and solder in position in proximity to a heating element. When the heating element is engaged, solder is melted and forms a bead which connects the wires to the LED strip contact pads. Various configurations of the device are described, as are methods of using such devices to connect LED strips to power sources.

A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.

A method of forming a rod feedstock for titanium stir friction welding additive manufacturing may comprise: mixing a plurality of powdered metals comprising titanium, iron, vanadium, and aluminum to produce a powder blend; at least one of die pressing the powder blend to form a die pressed powder or continuously powder rolling the powder blend to form a die pressed powder; and sintering the powder blend to form a rod feedstock having a cross-sectional profile.

A metal joined body in which a joint is formed from a first metal member and a second metal member. Brazed joint portions provided intermittently with a brazing material and solder joints filling the spaces between the brazed joint portions with a solder having a fusion point lower than the brazing material, are formed at a seam of the joint. The resulting metal joint has excellent sealing properties and little thermal strain.

A soldering wire dispensing apparatus is provided and comprises a support frame with a motor is mounted therein. A motor axle extends from the motor and rotates upon activation of the motor. A dispenser spool is mounted within the support frame with a predetermined amount of solder wire. A dispensing axle extends from the dispenser spool. A connecting belt links the motor axle to the dispensing axle to rotate the dispensing axle with rotation of the motor axle. A flexible wire nozzle is positioned in and extends from the support frame. An adjustment housing is mounted to the support frame. An upright bar is slidably mounted within the adjustment housing. A lever is connected to the upright bar and extends through the adjustment housing. A connecting wire extends between the second end of the wire nozzle and the upright bar. Upon moving the lever downward, the connecting wire nozzle bends nozzle to a predetermined angle relative to the adjustment housing.

A gripper sensor device for aligning fine wires. The robotic gripper sensor device including a housing having a probe receiving cavity. A sensor probe is positioned in the probe receiving cavity. An arm of a positioning member includes a wire engagement section for engaging respective fine wires and a probe engagement section for engaging a portion of the sensor probe. As the wire engagement section is moved into cooperation with the wire, force is applied to the arm of the positioning member causing the probe engagement section to move relative to the portion of the probe, causing the probe to convert a stress change of the portion of the probe into a force reading.

A storage and feeding assembly for a wire to be fed to an apparatus having a drum suitable for storing the wire and extending about a drum axis between a resting base and an open upper end is provided. A wire handling device positioned between the drum and the apparatus is suitable for extracting the wire from the drum to feed the wire to the apparatus. A lid, placed above the drum and having an upper lid wall in which an outlet passage for the wire is provided, and a lid side wall define a lid volume. The wire handling device extends into the lid volume substantially coaxially to the drum axis.