There is provided an AM apparatus for an AM process. The AM apparatus has an AM assembly with a build chamber to support part(s) built with a powder, in a build operation. Unused powder accumulates in the build chamber during the build operation. The AM apparatus has a vacuum assembly with duct line(s) in flow communication with the build chamber, and a powder receptacle in flow communication with the duct line(s). The powder receptacle has coupling member(s) allowing the powder receptacle to be reversibly attached to the duct line(s). The vacuum assembly includes a vacuum apparatus coupled to, and in flow communication with, the powder receptacle, via vacuum duct line(s). The vacuum assembly pulls the unused powder from the build chamber to the powder receptacle, and provides an automated removal of the unused powder from the build chamber into the powder receptacle, to avoid manual removal of the unused powder.

A laser processing apparatus 1 includes a laser head 31, a flexible cable 6 connecting a laser oscillator and the laser head 31 to each other, a conveyance apparatus 2 that conveys a workpiece W, a head drive mechanism 5 that moves the laser head 31 to a processing position, and a cable support mechanism 7 that moves the cable 6 in association with movement of the laser head 31. The cable support mechanism 7 includes a first holder 61 holding the cable 6, a first spring balancer 711 connected to the first holder 61 through a first wire 712, and a second spring balancer 721 connected to the first holder 61 through a second wire 722. The spring balancers 711, 721 are fixed to a support frame 8, and as viewed in plane, are arranged in a line along a width direction X perpendicular to a conveyance direction Y.

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

A desktop laser cutter configured to cut a cylindrical workpiece includes a laser, a cutting head that receives an electromagnetic beam from the laser and emits a cutting beam, and a gantry that supports the cutting head relative to a base plate of the laser cutter housing. The gantry can be actuated to move the cutting head within a plane that is parallel to the baseplate. The cutting head emits the cutting beam in a direction parallel to the plane. In use, the cutting head is disposed side-by-side with the workpiece and the cutting beam is applied to a side of the workpiece that faces a sidewall of the laser cutter housing. The workpiece is supported by the gantry to rotate an amount that is a function of movement of the cutting head in a direction parallel to the plane.

The device comprises a welding unit with a tube (3), a laser radiation unit (1) radiating in direction of the tube axis (3.0), and a mandrel (4) which is connected to the tube (3) via a holding unit which is formed, e.g., by two spacer elements (5.1) and which is coaxially arranged relative to and in the tube (3). The tube (3) and the circumferential surface of the mandrel (4) are reflective of the laser radiation of the laser radiation unit (1) such that through multiple reflections between the tube (3) and the mandrel (4) the laser radiation is deflected toward the beam output-side tube end (3.2) and is shaped annularly.

A laser annealing apparatus, a fabrication method of a polysilicon thin film, and a fabrication method of a thin film transistor are provided. The laser annealing apparatus includes: a laser generator, an optical system and an annealing chamber. The laser generator is configured to emit a laser beam, and the laser beam is guided to the annealing chamber via the optical system. The optical system includes a beam splitter, the beam splitter decomposes the laser beam into a first beam and a second beam, an energy density of the first beam is greater than an energy density of the second beam, and the first beam and the second beam are guided into the annealing chamber for laser annealing.

A device for processing microstructure arrays of polystyrene-graphene nanocomposites, including a laser generator, a vacuum chamber, an object stage, an ultraviolet filter and a gas flow control unit. The object stage is detachably fixed to a bottom of the vacuum chamber with a passage that can be opened or closed. The ultraviolet filter is provided in the vacuum chamber. A laser light emitted by the laser generator arrives at the object stage through the ultraviolet filter. The object stage is configured to place a sample to be processed. The gas flow control unit is communicated with the vacuum chamber and is configured to control the flow of the gas entering the vacuum chamber. The vacuum chamber is fixed on a three-axis precision positioning platform via a vacuum chamber clamp. The device disclosed herein aims to solve the existing difficulty in processing microstructure arrays of polystyrene-graphene nanocomposites.

An electromagnetic radiation steering mechanism An electromagnetic radiation steering mechanism configured to steer electromagnetic radiation to address a specific location within a two-dimensional field of view comprising a first optical element having an associated first actuator configured to rotate the first optical element about a first rotational axis to change a first coordinate of a first steering axis in the two-dimensional field of view, a second optical element having an associated second actuator configured to rotate the second optical element about a second rotational axis to change a second coordinate of a second steering axis in the two-dimensional field of view, and an electromagnetic radiation manipulator optically disposed between the first and second optical elements. A first angle is defined between the first and second rotational axes and a second angle is defined between the first and second steering axes. The electromagnetic radiation manipulator is configured to introduce a difference between the first angle and the second angle.

A method and apparatus for the generative production of a three-dimensional component in a processing chamber are disclosed. The method performs the steps of providing a metal starting material in the processing chamber and melting the starting material by inputting energy, which are repeated multiple times. A process gas is passed through the processing chamber in a circuit. Hydrogen is added to the circulating gas, then the circulating gas is heated to a temperature above 500 C. and then cooled to a temperature below 60 C.

A flow control device for an additive manufacturing system is provided. The flow control device includes a gas supply configured to discharge a gas, a first flow modifier configured to modify at least one flow characteristic of a first portion of the gas, and a second flow modifier configured to cooperate with the first flow modifier to modify the at least on flow characteristic of the first portion of the gas. The second flow modifier is further configured to modify at least one flow characteristic of a second portion of the gas, and the first flow modifier and the second flow modifier are configured to cooperate to direct at least a portion of the first portion and the second portion of the gas towards a melt pool in a plurality of particles.